Datasheet LTM8033 (Analog Devices) - 2
| Manufacturer | Analog Devices |
| Description | Ultralow Noise EMC 36VIN, 3A DC/DC μModule Regulator |
| Pages / Page | 26 / 2 — ABSOLUTE MAXIMUM RATINGS (Note 1). PIN CONFIGURATION. ORDER INFORMATION. … |
| File Format / Size | PDF / 386 Kb |
| Document Language | English |
ABSOLUTE MAXIMUM RATINGS (Note 1). PIN CONFIGURATION. ORDER INFORMATION. PART MARKING*. PACKAGE. MSL. TEMPERATURE RANGE. PART NUMBER
Model Line for this Datasheet
Text Version of Document
LTM8033
ABSOLUTE MAXIMUM RATINGS (Note 1)
VIN, FIN, RUN/SS Voltage ..36V BIAS ...25V ADJ, RT, SHARE Voltage ..6V Maximum Junction Temperature (Note 2) .. 125°C VOUT, AUX ..25V Solder Temperature ... 245°C PGOOD, SYNC ..30V
PIN CONFIGURATION
TOP VIEW TOP VIEW GND SYNC GND SYNC 8 RUN/SS 8 RUN/SS ADJ PGOOD ADJ PGOOD BANK 3 FIN 7 BANK 3 FIN 7 SHARE RT SHARE RT 6 6 BANK 2 BANK 2 5 5 GND GND 4 BIAS 4 BIAS 3 AUX 3 AUX BANK 1 BANK 4 BANK 1 BANK 4 2 2 V V OUT IN V V OUT IN 1 1 A B C D E F G H J K L A B C D E F G H J K L LGA PACKAGE BGA PACKAGE 76-LEAD (15mm × 11.25mm × 4.32mm) 76-LEAD (15mm × 11.25mm × 4.92mm) TJMAX = 125°C, θJA = 15.4°C/W, θJCbottom = 5.2°C/W, θJB = 9.8°C/W, θJCtop = 16.7°C/W TJMAX = 125°C, θJA = 15.4°C/W, θJCbottom = 5.2°C/W, θJB = 9.8°C/W, θJCtop = 16.7°C/W θ VALUES DERIVED FROM A 4 LAYER 6.35cm × 6.35cm PCB θ VALUES DERIVED FROM A 4 LAYER 6.35cm × 6.35cm PCB WEIGHT = 2.2g WEIGHT = 2.2g
ORDER INFORMATION PART MARKING* PACKAGE MSL TEMPERATURE RANGE PART NUMBER PAD OR BALL FINISH DEVICE FINISH CODE TYPE RATING (Note 2)
LTM8033EV#PBF Au (RoHS) LTM8033V e4 LGA 3 –40°C to 125°C LTM8033IV#PBF Au (RoHS) LTM8033V e4 LGA 3 –40°C to 125°C LTM8033MPV#PBF Au (RoHS) LTM8033V e4 LGA 3 –55°C to 125°C LTM8033EY#PBF SAC305 (RoHS) LTM8033Y e1 BGA 3 –40°C to 125°C LTM8033IY#PBF SAC305 (RoHS) LTM8033Y e1 BGA 3 –40°C to 125°C LTM8033IY SnPb (63/67) LTM8033Y e0 BGA 3 –40°C to 125°C LTM8033MPY#PBF SAC305 (RoHS) LTM8033Y e1 BGA 3 –55°C to 125°C LTM8033MPY SnPb (63/67) LTM8033Y e0 BGA 3 –55°C to 125°C Consult Marketing for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Device temperature grade is indicated by a label on the shipping Procedures: container. Pad or ball finish code is per IPC/JEDEC J-STD-609. www.linear.com/umodule/pcbassembly • Terminal Finish Part Marking: • LGA and BGA Package and Tray Drawings: www.linear.com/leadfree www.linear.com/packaging 8033fb 2 For more information www.linear.com/LTM8033 Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Typical Applications Package Description Package Photographs Revision History Typical Application Related Parts
ABSOLUTE MAXIMUM RATINGS (Note 1)
VIN, FIN, RUN/SS Voltage ..36V BIAS ...25V ADJ, RT, SHARE Voltage ..6V Maximum Junction Temperature (Note 2) .. 125°C VOUT, AUX ..25V Solder Temperature ... 245°C PGOOD, SYNC ..30V
PIN CONFIGURATION
TOP VIEW TOP VIEW GND SYNC GND SYNC 8 RUN/SS 8 RUN/SS ADJ PGOOD ADJ PGOOD BANK 3 FIN 7 BANK 3 FIN 7 SHARE RT SHARE RT 6 6 BANK 2 BANK 2 5 5 GND GND 4 BIAS 4 BIAS 3 AUX 3 AUX BANK 1 BANK 4 BANK 1 BANK 4 2 2 V V OUT IN V V OUT IN 1 1 A B C D E F G H J K L A B C D E F G H J K L LGA PACKAGE BGA PACKAGE 76-LEAD (15mm × 11.25mm × 4.32mm) 76-LEAD (15mm × 11.25mm × 4.92mm) TJMAX = 125°C, θJA = 15.4°C/W, θJCbottom = 5.2°C/W, θJB = 9.8°C/W, θJCtop = 16.7°C/W TJMAX = 125°C, θJA = 15.4°C/W, θJCbottom = 5.2°C/W, θJB = 9.8°C/W, θJCtop = 16.7°C/W θ VALUES DERIVED FROM A 4 LAYER 6.35cm × 6.35cm PCB θ VALUES DERIVED FROM A 4 LAYER 6.35cm × 6.35cm PCB WEIGHT = 2.2g WEIGHT = 2.2g
ORDER INFORMATION PART MARKING* PACKAGE MSL TEMPERATURE RANGE PART NUMBER PAD OR BALL FINISH DEVICE FINISH CODE TYPE RATING (Note 2)
LTM8033EV#PBF Au (RoHS) LTM8033V e4 LGA 3 –40°C to 125°C LTM8033IV#PBF Au (RoHS) LTM8033V e4 LGA 3 –40°C to 125°C LTM8033MPV#PBF Au (RoHS) LTM8033V e4 LGA 3 –55°C to 125°C LTM8033EY#PBF SAC305 (RoHS) LTM8033Y e1 BGA 3 –40°C to 125°C LTM8033IY#PBF SAC305 (RoHS) LTM8033Y e1 BGA 3 –40°C to 125°C LTM8033IY SnPb (63/67) LTM8033Y e0 BGA 3 –40°C to 125°C LTM8033MPY#PBF SAC305 (RoHS) LTM8033Y e1 BGA 3 –55°C to 125°C LTM8033MPY SnPb (63/67) LTM8033Y e0 BGA 3 –55°C to 125°C Consult Marketing for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Device temperature grade is indicated by a label on the shipping Procedures: container. Pad or ball finish code is per IPC/JEDEC J-STD-609. www.linear.com/umodule/pcbassembly • Terminal Finish Part Marking: • LGA and BGA Package and Tray Drawings: www.linear.com/leadfree www.linear.com/packaging 8033fb 2 For more information www.linear.com/LTM8033 Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Typical Applications Package Description Package Photographs Revision History Typical Application Related Parts
