Datasheet LTM4601HV (Analog Devices) - 25
| Manufacturer | Analog Devices |
| Description | 12A 28VIN DC/DC µModule Regulator with PLL, Output Tracking and Margining |
| Pages / Page | 30 / 25 — PACKAGE DESCRIPTION. Please refer to … |
| File Format / Size | PDF / 528 Kb |
| Document Language | English |
PACKAGE DESCRIPTION. Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings
Model Line for this Datasheet
Text Version of Document
LTM4601HV
PACKAGE DESCRIPTION Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
PIN 1 12 11 10 9 8 7 6 5 4 3 2 1 A B TED. C ATION BGA 118 0112 REV A D TIONAL, E e F TOM VIEW G Y BE EITHER A MOLD OR G TING PLANE Y LOADING ORIENT H TED WITHIN THE ZONE INDICA PACKAGE BOT J TION PER JESD MS-028 AND JEP95 TURE LTMXXXXXX µModule K TUM -Z- IS SEA PACKAGE IN TRA L b Y DA AILS OF PIN #1 IDENTIFIER ARE OP AIL A M DET BUT MUST BE LOCA THE PIN #1 IDENTIFIER MA MARKED FEA DET NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 2. ALL DIMENSIONS ARE IN MILLIMETERS 3 BALL DESIGNA 4 5. PRIMAR 6. SOLDER BALL COMPOSITION IS 96.5% Sn/3.0% Ag/0.5% Cu Y PIN 1 BEVEL PIN “A1” b e TRA 3 COMPONENT F SEE NOTES Z
NOTES
A A2 AIL B DET PACKAGE SIDE VIEW
MAX
3.62 0.70 2.92 0.90 0.66 0.15 0.10 0.20 0.30 0.15 ×
3.42mm)
b1 TE Y
NOM
3.42 0.60 2.82 0.75 0.63 15.0 15.0 1.27 13.97 13.97 0.27 – 0.37 X ×
15mm
A1 Z Z
DIMENSIONS
SUBSTRA M M
BGA Package
ddd eee
MIN
3.22 0.50 2.72 0.60 0.60 AL NUMBER OF BALLS: 118 AIL B AIL A TOT MOLD CAP DET DET ccc Z // bbb Z A A1 A2 b b1 D E e F G aaa bbb ccc ddd eee
SYMBOL
Øb (118 PLACES)
118-Lead (15mm
(Reference LTC DWG # 05-08-1903 Rev A) 2.45 – 2.55 aaa Z 0.0000 D X 6.9850 5.7150 4.4450 3.1750 1.9050 0.6350 0.6350 1.9050 3.1750 4.4450 5.7150 6.9850 Y 6.9850 5.7150 4.4450 3.1750 1.9050 YOUT 0.6350 0.0000 E 0.6350 TOP VIEW 1.9050 PACKAGE TOP VIEW 3.1750 SUGGESTED PCB LA 4.4450 5.7150 6.9850 aaa Z 4 PIN “A1” CORNER 0.630 ±0.025 Ø 118x 4601hvfb 25 Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Simplified Block Diagram Decoupling Requirements Operation Applications Information Typical Applications Package Description Revision History Package Photos Related Parts
PACKAGE DESCRIPTION Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
PIN 1 12 11 10 9 8 7 6 5 4 3 2 1 A B TED. C ATION BGA 118 0112 REV A D TIONAL, E e F TOM VIEW G Y BE EITHER A MOLD OR G TING PLANE Y LOADING ORIENT H TED WITHIN THE ZONE INDICA PACKAGE BOT J TION PER JESD MS-028 AND JEP95 TURE LTMXXXXXX µModule K TUM -Z- IS SEA PACKAGE IN TRA L b Y DA AILS OF PIN #1 IDENTIFIER ARE OP AIL A M DET BUT MUST BE LOCA THE PIN #1 IDENTIFIER MA MARKED FEA DET NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 2. ALL DIMENSIONS ARE IN MILLIMETERS 3 BALL DESIGNA 4 5. PRIMAR 6. SOLDER BALL COMPOSITION IS 96.5% Sn/3.0% Ag/0.5% Cu Y PIN 1 BEVEL PIN “A1” b e TRA 3 COMPONENT F SEE NOTES Z
NOTES
A A2 AIL B DET PACKAGE SIDE VIEW
MAX
3.62 0.70 2.92 0.90 0.66 0.15 0.10 0.20 0.30 0.15 ×
3.42mm)
b1 TE Y
NOM
3.42 0.60 2.82 0.75 0.63 15.0 15.0 1.27 13.97 13.97 0.27 – 0.37 X ×
15mm
A1 Z Z
DIMENSIONS
SUBSTRA M M
BGA Package
ddd eee
MIN
3.22 0.50 2.72 0.60 0.60 AL NUMBER OF BALLS: 118 AIL B AIL A TOT MOLD CAP DET DET ccc Z // bbb Z A A1 A2 b b1 D E e F G aaa bbb ccc ddd eee
SYMBOL
Øb (118 PLACES)
118-Lead (15mm
(Reference LTC DWG # 05-08-1903 Rev A) 2.45 – 2.55 aaa Z 0.0000 D X 6.9850 5.7150 4.4450 3.1750 1.9050 0.6350 0.6350 1.9050 3.1750 4.4450 5.7150 6.9850 Y 6.9850 5.7150 4.4450 3.1750 1.9050 YOUT 0.6350 0.0000 E 0.6350 TOP VIEW 1.9050 PACKAGE TOP VIEW 3.1750 SUGGESTED PCB LA 4.4450 5.7150 6.9850 aaa Z 4 PIN “A1” CORNER 0.630 ±0.025 Ø 118x 4601hvfb 25 Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Simplified Block Diagram Decoupling Requirements Operation Applications Information Typical Applications Package Description Revision History Package Photos Related Parts
