Datasheet ADP2360 (Analog Devices) - 5
| Manufacturer | Analog Devices |
| Description | 50 mA, 60 V, High Efficiency Buck Regulator |
| Pages / Page | 15 / 5 — Data Sheet. ADP2360. ABSOLUTE MAXIMUM RATINGS Table 2. THERMAL … |
| Revision | A |
| File Format / Size | PDF / 674 Kb |
| Document Language | English |
Data Sheet. ADP2360. ABSOLUTE MAXIMUM RATINGS Table 2. THERMAL RESISTANCE. Parameter. Rating. Table 3. Thermal Resistance
Model Line for this Datasheet
Text Version of Document
Data Sheet ADP2360 ABSOLUTE MAXIMUM RATINGS Table 2. THERMAL RESISTANCE Parameter Rating
θJA is specified for the worst case conditions, that is, a device VIN, EN, PG, to AGND, PGND −0.3 V to +61 V soldered in a circuit board for surface-mount packages. FB to AGND, PGND −0.3 V to +5.5 V For additional information on thermal resistance, refer to SW to AGND, PGND −0.3 V to VIN + 0.3 V Application Note AN-000, Thermal Characteristics of IC ITH, SS to AGND, PGND −0.3 V to +4 V Assembly. Operating Junction Temperature Range −40°C to +125°C Storage Temperature Range –65°C to +150°C
Table 3. Thermal Resistance
Soldering Conditions JEDEC J-STD-020
Package Type θJA ΨJB Unit
Stresses at or above those listed under Absolute Maximum 8-Lead LFCSP 62.7 33.60 °C/W Ratings may cause permanent damage to the product. This is a θJA and ΨJB and are modeled using a standard 4-layer JEDEC printed stress rating only; functional operation of the product at these circuit board (PCB) (2S2P) with the exposed pad soldered to or any other conditions above those indicated in the operational the board with a 2 × 2 array of thermal vias and still air. section of this specification is not implied. Operation beyond
ESD CAUTION
the maximum operating conditions for extended periods may affect product reliability. Rev. A | Page 5 of 15 Document Outline FEATURES APPLICATIONS TYPICAL APPLICATION CIRCUIT GENERAL DESCRIPTION REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION OVERVIEW CONTROL SCHEME 100% Duty Cycle Adjustable Peak Current Threshold (ITH) DEVICE FEATURES Fixed and Adjustable Output Models Shutdown/Precision Enable Soft Start Thermal Shutdown (TSD) Undervoltage Lockout (UVLO) Power Good APPLICATIONS INFORMATION SETTING THE OUTPUT VOLTAGE INPUT CAPACITOR SELECTION ESTIMATING THE SWITCHING FREQUENCY SETTING THE PEAK INDUCTOR CURRENT INDUCTOR SELECTION OUTPUT CAPACITOR SELECTION DESIGN OPTIMIZATION RECOMMENDED COMPONENTS PCB LAYOUT CONSIDERATIONS OUTLINE DIMENSIONS ORDERING GUIDE
θJA is specified for the worst case conditions, that is, a device VIN, EN, PG, to AGND, PGND −0.3 V to +61 V soldered in a circuit board for surface-mount packages. FB to AGND, PGND −0.3 V to +5.5 V For additional information on thermal resistance, refer to SW to AGND, PGND −0.3 V to VIN + 0.3 V Application Note AN-000, Thermal Characteristics of IC ITH, SS to AGND, PGND −0.3 V to +4 V Assembly. Operating Junction Temperature Range −40°C to +125°C Storage Temperature Range –65°C to +150°C
Table 3. Thermal Resistance
Soldering Conditions JEDEC J-STD-020
Package Type θJA ΨJB Unit
Stresses at or above those listed under Absolute Maximum 8-Lead LFCSP 62.7 33.60 °C/W Ratings may cause permanent damage to the product. This is a θJA and ΨJB and are modeled using a standard 4-layer JEDEC printed stress rating only; functional operation of the product at these circuit board (PCB) (2S2P) with the exposed pad soldered to or any other conditions above those indicated in the operational the board with a 2 × 2 array of thermal vias and still air. section of this specification is not implied. Operation beyond
ESD CAUTION
the maximum operating conditions for extended periods may affect product reliability. Rev. A | Page 5 of 15 Document Outline FEATURES APPLICATIONS TYPICAL APPLICATION CIRCUIT GENERAL DESCRIPTION REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION OVERVIEW CONTROL SCHEME 100% Duty Cycle Adjustable Peak Current Threshold (ITH) DEVICE FEATURES Fixed and Adjustable Output Models Shutdown/Precision Enable Soft Start Thermal Shutdown (TSD) Undervoltage Lockout (UVLO) Power Good APPLICATIONS INFORMATION SETTING THE OUTPUT VOLTAGE INPUT CAPACITOR SELECTION ESTIMATING THE SWITCHING FREQUENCY SETTING THE PEAK INDUCTOR CURRENT INDUCTOR SELECTION OUTPUT CAPACITOR SELECTION DESIGN OPTIMIZATION RECOMMENDED COMPONENTS PCB LAYOUT CONSIDERATIONS OUTLINE DIMENSIONS ORDERING GUIDE
