Datasheet LTC3615, LTC3615-1 (Analog Devices) - 4

ManufacturerAnalog Devices
DescriptionDual 4MHz, 3A Synchronous Step-Down DC/DC Converter
Pages / Page32 / 4 — e lecTrical characTerisTics The. denotes the specifications which apply …
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e lecTrical characTerisTics The. denotes the specifications which apply over the specified operating

e lecTrical characTerisTics The denotes the specifications which apply over the specified operating

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LTC3615/LTC3615-1
e lecTrical characTerisTics The
l
denotes the specifications which apply over the specified operating junction temperature range, otherwise specifications are at TA = 25°C (Note 2), SVIN = PVINx = 3.3V, RT = 178k, RSRLIM = 40.2k, unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
jSW1–SW2 Output Phase Shift Between SW1 VPHASE < 0.15 • SVIN 0 Deg and SW2 (LTC3615) 0.35 • SVIN < VPHASE < 0.65 • SVIN 90 Deg VPHASE > 0.85 • SVIN 180 Deg Output Phase Shift Between SW1 VPHASE < 0.65 • SVIN 140 Deg and SW2 (LTC3615-1) VPHASE > 0.85 • SVIN 180 Deg VSRLIM Voltage at SRLIM to Enable DDR (Note 9) SVIN – 0.3 V Mode VMODE Internal Burst Mode Operation 0.3 V (Note 9) Pulse-Skipping Mode SVIN – 0.3 V Forced Continuous Mode 1.1 SVIN • 0.58 V External Burst Mode Operation 0.5 0.85 V PGOOD Power Good Voltage Windows TRACK/SSx = SVIN, Entering Window VFBx Ramping Up –3.5 –6 % VFBx Ramping Down 3.5 6 % TRACK/SSx = SVIN, Leaving Window VFBx Ramping Up 9 11 % VFBx Ramping Down –9 –11 % tPGOOD Power Good Blanking Time Entering/Leaving Window 70 105 140 µs RPGOOD Power Good Pull-Down On-Resistance I = 10mA 8 12 30 Ω VRUN Enable Pin Input High l 1 V Input Low l 0.4 V Pull-Down Resistance 4 MΩ
Note 1:
Stresses beyond those listed under Absolute Maximum Ratings
Note 3:
This parameter is tested in a feedback loop which servos VFB1,2 to may cause permanent damage to the device. Exposure to any Absolute the midpoint for the error amplifier (VITH1,2 = 0.75V). Maximum Rating condition for extended periods may affect device
Note 4:
External compensation on ITH pin. reliability and lifetime.
Note 5:
Tying the ITH pin to SVIN enables internal compensation and AVP
Note 2:
The LTC3615/LTC3615-1 are tested under pulsed load conditions mode for the selected channel. such that TJ ≈ TA. The LTC3615E/LTC3615E-1 are guaranteed to meet
Note 6:
Dynamic supply current is higher due to the internal gate charge performance specifications over the 0°C to 85°C operating junction being delivered at the switching frequency. temperature range. Specifications over the –40°C to 125°C operating junction temperature range are assured by design, characterization and
Note 7:
See description of the TRACK/SS pin in the Pin Functions section. correlation with statistical process controls. The LTC3615I/LTC3615I-1
Note 8:
When sourcing current, the average output current is defined are guaranteed to meet specifications over the –40°C to 125°C operating as flowing out of the SW pin. When sinking current, the average output junction temperature range. The LTC3615H/LTC3615H-1 are guaranteed current is defined as flowing into the SW pin. Sinking mode requires the to meet specifications over the –40°C to 150°C operating temperature use of forced continuous mode. range. The LTC3615MP/LTC3615MP-1 are tested and guaranteed to meet
Note 9:
See description of the MODE pin in the Pin Functions section. specifications over the full –55°C to 150°C operating junction temperature
Note 10:
Guaranteed by design and correlation to wafer level range. High junction temperatures degrade operating lifetime; operating measurements for QFN packages. lifetime is derated for junction temperatures greater than 125°C. Note that
Note 11:
This IC includes overtemperature protection that is intended the maximum ambient temperature consistent with these specifications to protect the device during momentary overload conditions. Junction is determined by specific operating conditions in conjunction with board temperature will exceed 150°C when overtemperature protection is active. layout, the rated package thermal impedance and other environmental Continuous operation above the specified maximum operating junction factors. The junction temperature (TJ, in °C) is calculated from the ambient temperature may impair device reliability or permanently damage the temperature device. (TA, in °C) and power dissipation (PD, in watts) according to the formula: TJ = TA + (PD • θJA) where θJA (in °C/W) is the package thermal impedance. 3615fb 4 For more information www.linear.com/LTC3615 Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Functional Block Diagram Operation Applications Information Typical Applications Package Description Revision History Typical Application Related Parts
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