Datasheet LTM8065 (Analog Devices) - 2
| Manufacturer | Analog Devices |
| Description | 40VIN, 2.5A Silent Switcher µModule Regulator |
| Pages / Page | 26 / 2 — ABSOLUTE MAXIMUM RATINGS. PIN CONFIGURATION. (Notes 1, 2). ORDER … |
| Revision | B |
| File Format / Size | PDF / 1.8 Mb |
| Document Language | English |
ABSOLUTE MAXIMUM RATINGS. PIN CONFIGURATION. (Notes 1, 2). ORDER INFORMATION. PART MARKING*. PACKAGE. MSL. PART NUMBER. TERMINAL FINISH
Model Line for this Datasheet
Text Version of Document
LTM8065
ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION (Notes 1, 2)
VIN, RUN, PG Voltage .. 42V TOP VIEW AUX, VOUT, BIAS Voltage .. 19V FB, TR/SS Voltage ... 4V GND BIAS PG GND RT GND SYNC Voltage .. 6V A Maximum Internal Temperature .. 125°C FB AUX SYNC TR/SS RUN B Storage Temperature .. –55°C to 125°C BANK 2 Peak Reflow Solder Body Temperature ... 260°C VIN C D BANK 1 GND E F BANK 3 VOUT 1 2 3 4 5 6 BGA PACKAGE 36-LEAD (6.25mm × 6.25mm × 2.32mm) BGA PACKAGE TJMAX = 125°C, θJA = 21°C/W, θJCbottom = 5.9°C/W θJCtop = 36.5°C/W, θJB = 6.3°C/W, WEIGHT = 0.5g θ VALUES DETERMINED PER JEDEC51-9, 51-12
ORDER INFORMATION PART MARKING* PACKAGE MSL PART NUMBER TERMINAL FINISH DEVICE FINISH CODE TYPE RATING TEMPERATURE RANGE
LTM8065EY#PBF SAC305 (RoHS) LTM8065 e1 BGA 3 –40°C to 125°C LTM8065IY#PBF • Contact the factory for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Pad or ball finish code is per IPC/JEDEC J-STD-609. Procedures • LGA and BGA Package and Tray Drawings Rev.B 2 For more information www.analog.com
ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION (Notes 1, 2)
VIN, RUN, PG Voltage .. 42V TOP VIEW AUX, VOUT, BIAS Voltage .. 19V FB, TR/SS Voltage ... 4V GND BIAS PG GND RT GND SYNC Voltage .. 6V A Maximum Internal Temperature .. 125°C FB AUX SYNC TR/SS RUN B Storage Temperature .. –55°C to 125°C BANK 2 Peak Reflow Solder Body Temperature ... 260°C VIN C D BANK 1 GND E F BANK 3 VOUT 1 2 3 4 5 6 BGA PACKAGE 36-LEAD (6.25mm × 6.25mm × 2.32mm) BGA PACKAGE TJMAX = 125°C, θJA = 21°C/W, θJCbottom = 5.9°C/W θJCtop = 36.5°C/W, θJB = 6.3°C/W, WEIGHT = 0.5g θ VALUES DETERMINED PER JEDEC51-9, 51-12
ORDER INFORMATION PART MARKING* PACKAGE MSL PART NUMBER TERMINAL FINISH DEVICE FINISH CODE TYPE RATING TEMPERATURE RANGE
LTM8065EY#PBF SAC305 (RoHS) LTM8065 e1 BGA 3 –40°C to 125°C LTM8065IY#PBF • Contact the factory for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Pad or ball finish code is per IPC/JEDEC J-STD-609. Procedures • LGA and BGA Package and Tray Drawings Rev.B 2 For more information www.analog.com
