Datasheet Si8931/32 (Silicon Labs) - 26
| Manufacturer | Silicon Labs |
| Description | Isolated Amplifier for Voltage Measurement |
| Pages / Page | 31 / 26 — 6.3 Land Pattern: 8-Pin Wide Body Stretched SOIC. Figure 6.3. 8-Pin Wide … |
| Revision | 0.5 |
| File Format / Size | PDF / 579 Kb |
| Document Language | English |
6.3 Land Pattern: 8-Pin Wide Body Stretched SOIC. Figure 6.3. 8-Pin Wide Body Stretched SOIC Land Pattern
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link to page 26 Si8931/32 Data Sheet Packaging
6.3 Land Pattern: 8-Pin Wide Body Stretched SOIC
The figure below illustrates the recommended land pattern details for the Si8931/32 in a 8-Pin Wide Body Stretched SOIC package. The table lists the values for the dimensions shown in the illustration.
Figure 6.3. 8-Pin Wide Body Stretched SOIC Land Pattern Table 6.3. 8-Pin Wide Body Stretched SOIC Land Pattern Dimensions1 Dimension (mm)
C1 10.60 E 1.27 X1 0.60 Y1 1.85
Note: General
1. All dimensions shown are at Maximum Material Condition (MMC). Least Material Condition (LMC) is calculated based on a Fabri- cation Allowance of 0.05mm. 2. This Land Pattern Design is based on the IPC-7351 guidelines.
Solder Mask Design
1. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to be 60mm minimum, all the way around the pad.
Stencil Design
1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release. 2. The stencil thickness should be 0.125mm (5 mils). 3. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pins.
Card Assembly
1. A No-Clean, Type-3 solder paste is recommended. 2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components.
silabs.com
| Building a more connected world. Preliminary Rev. 0.5 | 26 Document Outline 1. Ordering Guide 2. System Overview 3. Voltage Sense Application 4. Electrical Specifications 4.1 Regulatory Information 4.2 Typical Operating Characteristics 5. Pin Descriptions 5.1 Si8931 Pin Descriptions 5.2 Si8932 Pin Descriptions 6. Packaging 6.1 Package Outline: 8-Pin Wide Body Stretched SOIC 6.2 Package Outline: 8-Pin Narrow Body SOIC 6.3 Land Pattern: 8-Pin Wide Body Stretched SOIC 6.4 Land Pattern: 8-Pin Narrow Body SOIC 6.5 Top Marking: 8-Pin Wide Body Stretched SOIC 6.6 Top Marking: 8-Pin Narrow Body SOIC 7. Document Revision History
6.3 Land Pattern: 8-Pin Wide Body Stretched SOIC
The figure below illustrates the recommended land pattern details for the Si8931/32 in a 8-Pin Wide Body Stretched SOIC package. The table lists the values for the dimensions shown in the illustration.
Figure 6.3. 8-Pin Wide Body Stretched SOIC Land Pattern Table 6.3. 8-Pin Wide Body Stretched SOIC Land Pattern Dimensions1 Dimension (mm)
C1 10.60 E 1.27 X1 0.60 Y1 1.85
Note: General
1. All dimensions shown are at Maximum Material Condition (MMC). Least Material Condition (LMC) is calculated based on a Fabri- cation Allowance of 0.05mm. 2. This Land Pattern Design is based on the IPC-7351 guidelines.
Solder Mask Design
1. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to be 60mm minimum, all the way around the pad.
Stencil Design
1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release. 2. The stencil thickness should be 0.125mm (5 mils). 3. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pins.
Card Assembly
1. A No-Clean, Type-3 solder paste is recommended. 2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components.
silabs.com
| Building a more connected world. Preliminary Rev. 0.5 | 26 Document Outline 1. Ordering Guide 2. System Overview 3. Voltage Sense Application 4. Electrical Specifications 4.1 Regulatory Information 4.2 Typical Operating Characteristics 5. Pin Descriptions 5.1 Si8931 Pin Descriptions 5.2 Si8932 Pin Descriptions 6. Packaging 6.1 Package Outline: 8-Pin Wide Body Stretched SOIC 6.2 Package Outline: 8-Pin Narrow Body SOIC 6.3 Land Pattern: 8-Pin Wide Body Stretched SOIC 6.4 Land Pattern: 8-Pin Narrow Body SOIC 6.5 Top Marking: 8-Pin Wide Body Stretched SOIC 6.6 Top Marking: 8-Pin Narrow Body SOIC 7. Document Revision History