Datasheet HT16D35A/HT16D35B (Holtek) - 5
| Manufacturer | Holtek |
| Description | RAM Mapping 28×8 Constant Current LED Driver |
| Pages / Page | 71 / 5 — HT16D35A/HT16D35B. A.C. Characteristics. Test Conditions. Symbol. … |
| Revision | 1.00 |
| File Format / Size | PDF / 2.3 Mb |
| Document Language | English |
HT16D35A/HT16D35B. A.C. Characteristics. Test Conditions. Symbol. Parameter. Min. Typ. Max. Unit. VDD. Conditions
Model Line for this Datasheet
Text Version of Document
HT16D35A/HT16D35B
I 4. %/dV ROW_MAX – IROW_MIN DD (%/V) = (5.5V – 4.5V) × IROW_AVG IROW_AVG: the average current for (IROW_MAX + IROW_MIN)/2 of all test ROW pins between VDD = 4.5V and 5.5V IROW_MAX: the max current of all test ROW pins between VDD = 4.5V and 5.5V IROW_MIN: the min current of all test ROW pins between VDD = 4.5V and 5.5V VDS = 1V
A.C. Characteristics
VDD=2.7~5.5V; Ta=25°C
Test Conditions Symbol Parameter Min. Typ. Max. Unit VDD Conditions
fSYS System Clock — On-chip RC oscillator 4.33 4.92 5.51 MHz fLED LED frame rate — COM Duty Select, n=1~8 — fSYS/(4160×n) — Hz V VDD Start voltage to ensure Power on POR reset — — — — 100 mV RRVDD VDD Rise Rate to ensure Power on reset — — 0.05 — — V/ms t Minimum Time for VDD to remain at VPOR POR to ensure Power on reset — — 10 — — ms
SPI 3-wire Serial Bus A.C. Characteristics
VDD=2.7~5.5V; Ta=25°C
Test Condition Symbol Parameter Min. Typ. Max. Unit VDD Condition
tCLK Clock cycle time — — 250 — — ns tCW Clock Pulse Width — — 100 — — ns tDS Data Setup Time — — 50 — — ns tDH Data Hold Time — — 50 — — ns tCSW “H” CSB Pulse Width — — 100 — — ns tCSL CSB Setup Time (CSB↓ – CLK↑) — — 50 — — ns tCSH CSB Hold Time (CLK↑ – CSB↑) — — 2 — — μs t t PD=10 to 90% PD DATA Output Delay Time (CLK – DIO) — CO=15pF — — 350 ns tPD=10 to 10% Rev. 1.00 5 July 12, 2017 Document Outline Features Applications General Description Selection Table Block Diagram Pin Assignment Pin Description Absolute Maximum Ratings D.C. Characteristics A.C. Characteristics A.C. Characteristics – SPI 3-wire Serial Bus A.C. Characteristics – I2C Serial Bus Timing Diagrams SPI 3-Wire Serial Bus Timing I2C Bus Timing Power on Reset Timing Functional Description Power-on Reset LED Driver System Oscillator ROW Driver Outputs Column Driver Outputs Address Pointer Over Temperature Protection Constant Current Output Setting the Output Current Load Supply Voltage – LED_V Display Data RAM – DDRAM LED Driver Output Waveform Output Signal Timing Fade Data RAM Universal COM (UCOM) RAM Data Universal SEG (USEG) RAM Data Matrix Masking RAM Data Command Description – Command Table Software Reset Binary/Gray Select Number of COM Outputs Global Blinking Cascade Mode System Control Constant Current Ratio Global Brightness Mode Control Scrolling Control Scrolling Speed COM Pin Control ROW Pin Control Direct Pin Control Read Flag Read Status Write Display Data Write Fade Data Write UCOM Data Write USEG Data Write Matrix Masking Data SPI 3-wire Serial Interface I2C Serial Interface Power Supply Sequence Operation Flow Chart Application Circuits LED Matrix Circuit Single LED IC Application Cascade Function Cascade Control Flow Package Information 48-pin LQFP (7mm×7mm) Outline Dimensions (Exposed Pad)
I 4. %/dV ROW_MAX – IROW_MIN DD (%/V) = (5.5V – 4.5V) × IROW_AVG IROW_AVG: the average current for (IROW_MAX + IROW_MIN)/2 of all test ROW pins between VDD = 4.5V and 5.5V IROW_MAX: the max current of all test ROW pins between VDD = 4.5V and 5.5V IROW_MIN: the min current of all test ROW pins between VDD = 4.5V and 5.5V VDS = 1V
A.C. Characteristics
VDD=2.7~5.5V; Ta=25°C
Test Conditions Symbol Parameter Min. Typ. Max. Unit VDD Conditions
fSYS System Clock — On-chip RC oscillator 4.33 4.92 5.51 MHz fLED LED frame rate — COM Duty Select, n=1~8 — fSYS/(4160×n) — Hz V VDD Start voltage to ensure Power on POR reset — — — — 100 mV RRVDD VDD Rise Rate to ensure Power on reset — — 0.05 — — V/ms t Minimum Time for VDD to remain at VPOR POR to ensure Power on reset — — 10 — — ms
SPI 3-wire Serial Bus A.C. Characteristics
VDD=2.7~5.5V; Ta=25°C
Test Condition Symbol Parameter Min. Typ. Max. Unit VDD Condition
tCLK Clock cycle time — — 250 — — ns tCW Clock Pulse Width — — 100 — — ns tDS Data Setup Time — — 50 — — ns tDH Data Hold Time — — 50 — — ns tCSW “H” CSB Pulse Width — — 100 — — ns tCSL CSB Setup Time (CSB↓ – CLK↑) — — 50 — — ns tCSH CSB Hold Time (CLK↑ – CSB↑) — — 2 — — μs t t PD=10 to 90% PD DATA Output Delay Time (CLK – DIO) — CO=15pF — — 350 ns tPD=10 to 10% Rev. 1.00 5 July 12, 2017 Document Outline Features Applications General Description Selection Table Block Diagram Pin Assignment Pin Description Absolute Maximum Ratings D.C. Characteristics A.C. Characteristics A.C. Characteristics – SPI 3-wire Serial Bus A.C. Characteristics – I2C Serial Bus Timing Diagrams SPI 3-Wire Serial Bus Timing I2C Bus Timing Power on Reset Timing Functional Description Power-on Reset LED Driver System Oscillator ROW Driver Outputs Column Driver Outputs Address Pointer Over Temperature Protection Constant Current Output Setting the Output Current Load Supply Voltage – LED_V Display Data RAM – DDRAM LED Driver Output Waveform Output Signal Timing Fade Data RAM Universal COM (UCOM) RAM Data Universal SEG (USEG) RAM Data Matrix Masking RAM Data Command Description – Command Table Software Reset Binary/Gray Select Number of COM Outputs Global Blinking Cascade Mode System Control Constant Current Ratio Global Brightness Mode Control Scrolling Control Scrolling Speed COM Pin Control ROW Pin Control Direct Pin Control Read Flag Read Status Write Display Data Write Fade Data Write UCOM Data Write USEG Data Write Matrix Masking Data SPI 3-wire Serial Interface I2C Serial Interface Power Supply Sequence Operation Flow Chart Application Circuits LED Matrix Circuit Single LED IC Application Cascade Function Cascade Control Flow Package Information 48-pin LQFP (7mm×7mm) Outline Dimensions (Exposed Pad)
