Datasheet EFR32BG21 (Silicon Labs) - 69
| Manufacturer | Silicon Labs |
| Description | Blue Gecko Wireless SoCFamily |
| Pages / Page | 72 / 69 — Table 7.2. QFN32 PCB Land Pattern Dimensions. Dimension. Typ. Note: |
| File Format / Size | PDF / 941 Kb |
| Document Language | English |
Table 7.2. QFN32 PCB Land Pattern Dimensions. Dimension. Typ. Note:
Model Line for this Datasheet
Text Version of Document
EFR32BG21 Blue Gecko Wireless SoC Family Data Sheet QFN32 Package Specifications
Table 7.2. QFN32 PCB Land Pattern Dimensions Dimension Typ
L 0.76 W 0.22 e 0.40 S 3.21 S1 3.21 L1 2.80 W1 2.80
Note:
1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. This Land Pattern Design is based on the IPC-7351 guidelines. 3. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to be 60 µm minimum, all the way around the pad. 4. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release. 5. The stencil thickness should be 0.101 mm (4 mils). 6. The ratio of stencil aperture to land pad size can be 1:1 for all perimeter pads. 7. A 2x2 array of 1.10 mm x 1.10 mm openings on a 1.30 mm pitch can be used for the center ground pad. 8. A No-Clean, Type-3 solder paste is recommended. 9. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. 10.
Above notes and stencil design are shared as recommendations only. A customer or user may find it necessary to use different parameters and fine tune their SMT process as required for their application and tooling. silabs.com
| Building a more connected world. Rev. 1.0 | 69 Document Outline 1. Feature List 2. Ordering Information 3. System Overview 3.1 Introduction 3.2 Radio 3.2.1 Antenna Interface 3.2.2 Fractional-N Frequency Synthesizer 3.2.3 Receiver Architecture 3.2.4 Transmitter Architecture 3.2.5 Packet and State Trace 3.2.6 Data Buffering 3.2.7 Radio Controller (RAC) 3.3 General Purpose Input/Output (GPIO) 3.4 Clocking 3.4.1 Clock Management Unit (CMU) 3.4.2 Internal and External Oscillators 3.5 Counters/Timers and PWM 3.5.1 Timer/Counter (TIMER) 3.5.2 Low Energy Timer (LETIMER) 3.5.3 Real Time Clock with Capture (RTCC) 3.5.4 Back-Up Real Time Counter 3.5.5 Watchdog Timer (WDOG) 3.6 Communications and Other Digital Peripherals 3.6.1 Universal Synchronous/Asynchronous Receiver/Transmitter (USART) 3.6.2 Inter-Integrated Circuit Interface (I2C) 3.6.3 Peripheral Reflex System (PRS) 3.7 Security Features 3.7.1 Standard Security 3.7.2 True Random Number Generator 3.8 Analog 3.8.1 Analog Comparator (ACMP) 3.8.2 Analog to Digital Converter (ADC) 3.9 Reset Management Unit (RMU) 3.10 Core and Memory 3.10.1 Processor Core 3.10.2 Memory System Controller (MSC) 3.10.3 Linked Direct Memory Access Controller (LDMA) 3.11 Memory Map 3.12 Configuration Summary 4. Electrical Specifications 4.1 Electrical Characteristics 4.1.1 Absolute Maximum Ratings 4.1.2 General Operating Conditions 4.1.3 Thermal Characteristics 4.1.4 Current Consumption 4.1.4.1 MCU current consumption at 1.8V 4.1.4.2 MCU current consumption at 3.0V 4.1.4.3 Radio current consumption at 1.8V 4.1.4.4 Radio current consumption at 3.0V 4.1.5 2.4 GHz RF Transceiver Characteristics 4.1.5.1 RF Transmitter Characteristics 4.1.5.2 RF Receiver Characteristics 4.1.6 Flash Characteristics 4.1.7 Wake Up, Entry, and Exit times 4.1.8 Oscillators 4.1.8.1 High Frequency Crystal Oscillator 4.1.8.2 Low Frequency Crystal Oscillator 4.1.8.3 High Frequency RC Oscillator (HFRCO) 4.1.8.4 Fast Start_Up RC Oscillator (FSRCO) 4.1.8.5 Low Frequency RC Oscillator 4.1.8.6 Ultra Low Frequency RC Oscillator 4.1.9 GPIO Pins (3V GPIO pins) 4.1.10 Analog to Digital Converter (ADC) 4.1.11 Analog Comparator (ACMP) 4.1.12 Temperature Sense 4.1.13 Brown Out Detectors 4.1.13.1 DVDD BOD 4.1.13.2 LE DVDD BOD 4.1.13.3 AVDD and VIO BODs 4.1.14 SPI Electrical Specifications 4.1.14.1 SPI Master Timing 4.1.14.2 SPI Slave Timing 4.1.15 I2C Electrical Specifications 4.1.15.1 I2C Standard-mode (Sm) 4.1.15.2 I2C Fast-mode (Fm) 4.1.15.3 I2C Fast-mode Plus (Fm+) 4.2 Typical Performance Curves 4.2.1 Supply Current 4.2.2 2.4 GHz Radio 5. Typical Connection Diagrams 5.1 Power 5.2 RF Matching Networks 5.2.1 2.4 GHz 0 dBm Matching Network 5.2.2 2.4 GHz 10 dBm Matching Network 5.2.3 2.4 GHz 20 dBm Matching Network 5.3 Other Connections 6. Pin Definitions 6.1 QFN32 2.4GHz Device Pinout 6.2 Alternate Function Table 6.3 Analog Peripheral Connectivity 6.4 Digital Peripheral Connectivity 7. QFN32 Package Specifications 7.1 QFN32 Package Dimensions 7.2 QFN32 PCB Land Pattern 7.3 QFN32 Package Marking 8. Revision History
Table 7.2. QFN32 PCB Land Pattern Dimensions Dimension Typ
L 0.76 W 0.22 e 0.40 S 3.21 S1 3.21 L1 2.80 W1 2.80
Note:
1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. This Land Pattern Design is based on the IPC-7351 guidelines. 3. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to be 60 µm minimum, all the way around the pad. 4. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release. 5. The stencil thickness should be 0.101 mm (4 mils). 6. The ratio of stencil aperture to land pad size can be 1:1 for all perimeter pads. 7. A 2x2 array of 1.10 mm x 1.10 mm openings on a 1.30 mm pitch can be used for the center ground pad. 8. A No-Clean, Type-3 solder paste is recommended. 9. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. 10.
Above notes and stencil design are shared as recommendations only. A customer or user may find it necessary to use different parameters and fine tune their SMT process as required for their application and tooling. silabs.com
| Building a more connected world. Rev. 1.0 | 69 Document Outline 1. Feature List 2. Ordering Information 3. System Overview 3.1 Introduction 3.2 Radio 3.2.1 Antenna Interface 3.2.2 Fractional-N Frequency Synthesizer 3.2.3 Receiver Architecture 3.2.4 Transmitter Architecture 3.2.5 Packet and State Trace 3.2.6 Data Buffering 3.2.7 Radio Controller (RAC) 3.3 General Purpose Input/Output (GPIO) 3.4 Clocking 3.4.1 Clock Management Unit (CMU) 3.4.2 Internal and External Oscillators 3.5 Counters/Timers and PWM 3.5.1 Timer/Counter (TIMER) 3.5.2 Low Energy Timer (LETIMER) 3.5.3 Real Time Clock with Capture (RTCC) 3.5.4 Back-Up Real Time Counter 3.5.5 Watchdog Timer (WDOG) 3.6 Communications and Other Digital Peripherals 3.6.1 Universal Synchronous/Asynchronous Receiver/Transmitter (USART) 3.6.2 Inter-Integrated Circuit Interface (I2C) 3.6.3 Peripheral Reflex System (PRS) 3.7 Security Features 3.7.1 Standard Security 3.7.2 True Random Number Generator 3.8 Analog 3.8.1 Analog Comparator (ACMP) 3.8.2 Analog to Digital Converter (ADC) 3.9 Reset Management Unit (RMU) 3.10 Core and Memory 3.10.1 Processor Core 3.10.2 Memory System Controller (MSC) 3.10.3 Linked Direct Memory Access Controller (LDMA) 3.11 Memory Map 3.12 Configuration Summary 4. Electrical Specifications 4.1 Electrical Characteristics 4.1.1 Absolute Maximum Ratings 4.1.2 General Operating Conditions 4.1.3 Thermal Characteristics 4.1.4 Current Consumption 4.1.4.1 MCU current consumption at 1.8V 4.1.4.2 MCU current consumption at 3.0V 4.1.4.3 Radio current consumption at 1.8V 4.1.4.4 Radio current consumption at 3.0V 4.1.5 2.4 GHz RF Transceiver Characteristics 4.1.5.1 RF Transmitter Characteristics 4.1.5.2 RF Receiver Characteristics 4.1.6 Flash Characteristics 4.1.7 Wake Up, Entry, and Exit times 4.1.8 Oscillators 4.1.8.1 High Frequency Crystal Oscillator 4.1.8.2 Low Frequency Crystal Oscillator 4.1.8.3 High Frequency RC Oscillator (HFRCO) 4.1.8.4 Fast Start_Up RC Oscillator (FSRCO) 4.1.8.5 Low Frequency RC Oscillator 4.1.8.6 Ultra Low Frequency RC Oscillator 4.1.9 GPIO Pins (3V GPIO pins) 4.1.10 Analog to Digital Converter (ADC) 4.1.11 Analog Comparator (ACMP) 4.1.12 Temperature Sense 4.1.13 Brown Out Detectors 4.1.13.1 DVDD BOD 4.1.13.2 LE DVDD BOD 4.1.13.3 AVDD and VIO BODs 4.1.14 SPI Electrical Specifications 4.1.14.1 SPI Master Timing 4.1.14.2 SPI Slave Timing 4.1.15 I2C Electrical Specifications 4.1.15.1 I2C Standard-mode (Sm) 4.1.15.2 I2C Fast-mode (Fm) 4.1.15.3 I2C Fast-mode Plus (Fm+) 4.2 Typical Performance Curves 4.2.1 Supply Current 4.2.2 2.4 GHz Radio 5. Typical Connection Diagrams 5.1 Power 5.2 RF Matching Networks 5.2.1 2.4 GHz 0 dBm Matching Network 5.2.2 2.4 GHz 10 dBm Matching Network 5.2.3 2.4 GHz 20 dBm Matching Network 5.3 Other Connections 6. Pin Definitions 6.1 QFN32 2.4GHz Device Pinout 6.2 Alternate Function Table 6.3 Analog Peripheral Connectivity 6.4 Digital Peripheral Connectivity 7. QFN32 Package Specifications 7.1 QFN32 Package Dimensions 7.2 QFN32 PCB Land Pattern 7.3 QFN32 Package Marking 8. Revision History