Datasheet DPS368 (Infineon) - 20

ManufacturerInfineon
DescriptionXENSIV™ DPS368 - ultra small waterproof pressure sensor, environmentally protected against water (IPx8), dust & humidity
Pages / Page44 / 20 — DPS368. Digital interfaces. Figure 10. Application Circuit Example using …
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DPS368. Digital interfaces. Figure 10. Application Circuit Example using the SPI 3-wire with interrupt interface. Table 11

DPS368 Digital interfaces Figure 10 Application Circuit Example using the SPI 3-wire with interrupt interface Table 11

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DPS368 Digital interfaces Figure 10 Application Circuit Example using the SPI 3-wire with interrupt interface Table 11 Component Values Component Symbol Values Unit Note / Test Condition Min. Typ. Max.
Pull-up/down Resistor R1, R2 10 KΩ R3 100 KΩ R3 is optional and will set the address to 0x76 instead of 0x77. Supply Blocking Capacitor C1, C2 100 100 nF The blocking capacitors should be placed as close to the package pins as possible.
5.3 IIR filtering
The air pressure is slowly changing due to weather conditions or short term changing like air turbulence created by a fan, slamming a door or window. All these disturbances can be suppressed or triggered on the software application level by implementing different IIR filtering. Same sensor can be used by different software applications applying different IIR filtering to the raw data like low pass, high pass or band pass filtering.
6 Digital interfaces
The measurement data, calibration coefficients, Product ID and configuration registers can be accessed through both the I2C and SPI serial interfaces. The SPI interface can configured to operate in 3-wire or 4-wire mode. In I2C and SPI 3-wire, an interrupt output can be implemented on the SDO pin. The SPI interface support mode '11' only ( CPOL=CPHA='1' ) in 4-wire and 3-wire configuration. The following commands are supported: single byte write, single byte read and multiple byte read using auto increment from a specified start address. The interface selection is done based on CSB pin status. If CSB is connected to VDDIO, the I2C interface is active. If CSB is low, the SPI interface is active. After the CSB has been pulled down once the I2C interface is disabled until the next power-on-reset. Preliminary datasheet 20 v1.0 2019-03-14 Document Outline Product Description Features Typical applications Product Validation Table of contents 1 Definitions, acronyms and abbreviations 1.1 Definitions 2 Pin Configuration and Block Diagram 2.1 Pin Configuration and Description 2.2 Block Diagram 3 Specifications 3.1 Operating Range 3.2 Absolute Maximum Ratings 3.3 Current Consumption 3.4 Temperature Transfer Function 3.5 Pressure Transfer Function 3.6 Timing Characteristics 4 Functional Description 4.1 Operating Modes 4.2 Mode transition diagram 4.3 Start-up sequence 4.4 Measurement Precision and Rate 4.5 Sensor Interface 4.6 Interrupt 4.7 Result Register Operation 4.8 FIFO Operation 4.9 Calibration and Measurement Compensation 4.9.1 How to Calculate Compensated Pressure Values 4.9.2 How to Calculate Compensated Temperature Values 4.9.3 Compensation Scale Factors 4.9.4 Pressure and Temperature calculation flow 5 Applications 5.1 Measurement Settings and Use Case Examples 5.2 Application Circuit Example 5.3 IIR filtering 6 Digital interfaces 6.1 I2C Interface 6.2 SPI Interface 6.3 Interface parameters specification 6.3.1 General interface parameters 6.3.1.1 I2C timings 6.3.1.2 SPI timings 7 Register Map 8 Register description 8.1 Pressure Data (PRS_Bn) 8.1.1 PRS_B2 8.1.2 PRS_B1 8.1.3 PRS_B0 8.2 Temperature Data (TMP_Tn) 8.2.1 TMP_B2 8.2.2 TMP_B1 8.2.3 TMP_B0 8.3 Pressure Configuration (PRS_CFG) 8.4 Temperature Configuration(TMP_CFG) 8.5 Sensor Operating Mode and Status (MEAS_CFG) 8.6 Interrupt and FIFO configuration (CFG_REG) 8.7 Interrupt Status (INT_STS) 8.8 FIFO Status (FIFO_STS) 8.9 Soft Reset and FIFO flush (RESET) 8.10 Product and Revision ID (ID) 8.11 Calibration Coefficients (COEF) 8.12 Coefficient Source 9 Package Dimensions 9.1 Package drawing 10 Footprint and stencil recommendation 11 Reflow soldering and board assembly 12 Package Handling Revision history Disclaimer