Datasheet RT2378-20 (Analog Devices) - 4

ManufacturerAnalog Devices
DescriptionRadiation Tolerant 20-Bit, 1Msps, Low Power Plastic Package SAR ADC
Pages / Page10 / 4 — Digi. Tal inpuTs anD DigiTal ouTpuTs The. denotes the specifications …
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Digi. Tal inpuTs anD DigiTal ouTpuTs The. denotes the specifications which apply over the

Digi Tal inpuTs anD DigiTal ouTpuTs The denotes the specifications which apply over the

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RT2378-20
Digi Tal inpuTs anD DigiTal ouTpuTs The
l
denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. (Note 4) SYMBOL PARAMETER CONDITIONS SUB GROUP MIN TYP MAX UNITS
VIH High Level Input Voltage l 1, 2, 3 0.8 • OVDD V VIL Low Level Input Voltage l 1, 2, 3 0.2 • OVDD V IIN Digital Input Current VIN = 0V to OVDD l 1, 2, 3 –10 10 µA CIN Digital Input Capacitance 5 pF VOH High Level Output Voltage IO = –500µA l 1, 2, 3 OVDD – 0.2 V VOL Low Level Output Voltage IO = 500µA l 1, 2, 3 0.2 V IOZ Hi-Z Output Leakage Current VOUT = 0V to OVDD l 1, 2, 3 –10 10 µA ISOURCE Output Source Current VOUT = 0V –10 mA ISINK Output Sink Current VOUT = OVDD 10 mA
p ower requireMenTs The
l
denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. (Note 4) SYMBOL PARAMETER CONDITIONS SUB GROUP MIN TYP MAX UNITS
VDD Supply Voltage l 1, 2, 3 2.375 2.5 2.625 V OVDD Supply Voltage l 1, 2, 3 1.71 5.25 V IVDD Supply Current 1Msps Sample Rate l 1, 2, 3 8.4 10 mA IOVDD Supply Current 1Msps Sample Rate (CL = 20pF) 0.2 mA IPD Power Down Mode Conversion Done (IVDD + IOVDD + IREF) l 1, 2, 3 1 90 µA PD Power Dissipation 1Msps Sample Rate 1 21 25 mW Power Down Mode Conversion Done (IVDD + IOVDD + IREF) 1 2.5 225 µW
a Dc TiMing characTerisTics The
l
denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. (Note 4) SYMBOL PARAMETER CONDITIONS SUB GROUP MIN TYP MAX UNITS
fSMPL Maximum Sampling Frequency l 9, 10, 11 1 Msps tCONV Conversion Time l 9, 10, 11 615 675 ns tACQ Acquisition Time tACQ = tCYC – tCONV – tBUSYLH l 312 ns (Note 10) tCYC Time Between Conversions l 9, 10, 11 1 µs tCNVH CNV High Time l 9, 10, 11 20 ns tBUSYLH CNV↑ to BUSY Delay CL = 20pF l 9, 10, 11 13 ns tCNVL Minimum Low Time for CNV (Note 11) l 9, 10, 11 20 ns tQUIET SCK Quiet Time from CNV↑ (Note 10) l 20 ns tSCK SCK Period (Notes 11, 12) l 9, 10, 11 10 ns tSCKH SCK High Time l 9, 10, 11 4 ns tSCKL SCK Low Time l 9, 10, 11 4 ns tSSDISCK SDI Setup Time From SCK↑ (Note 11) l 9, 10, 11 4 ns tHSDISCK SDI Hold Time From SCK↑ (Note 11) l 9, 10, 11 1 ns tSCKCH SCK Period in Chain Mode tSCKCH = tSSDISCK + tDSDO l 9, 10, 11 13.5 ns (Note 11) rt237820fa 4 For more information www.linear.com Document Outline Features Description Typical Application Absolute Maximum Ratings Pin Configuration Electrical Characteristics Converter Characteristics Dynamic Accuracy Reference Input Digital Inputs and Digital Outputs Power Requirements ADC Timing Characteristics Typical Performance Characteristics
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