Datasheet LTC3376 (Analog Devices) - 2
| Manufacturer | Analog Devices |
| Description | 20V, 4-Channel Buck DC/DC with 8x Configurable 1.5A Power Stages |
| Pages / Page | 28 / 2 — ABSOLUTE MAXIMUM RATINGS. PIN CONFIGURATION. (Note 1). ORDER INFORMATION. … |
| File Format / Size | PDF / 1.7 Mb |
| Document Language | English |
ABSOLUTE MAXIMUM RATINGS. PIN CONFIGURATION. (Note 1). ORDER INFORMATION. PART MARKING*. PACKAGE. MSL. TEMPERATURE RANGE. PART NUMBER
Model Line for this Datasheet
Text Version of Document
LTC3376
ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION (Note 1)
V TOP VIEW CC, VINA-H ... –0.3V to 22V FB1-4+, RUN1-4, CFG1-3, EXTV 1 2 3 4 5 6 7 8 CC, PGOOD1-4, INTVCC, INTVCC_P, SYNC/MODE .. –0.3V to 6V A CFG0, RT, TEMP, IMON1-4 ..–0.3V to (INTVCC + 0.3V) BSTA SWA VINA PGNDA PGNDH VINH SWH BSTH INTVCC – INTVCC_P ... –0.3V to 0.3V B FB1-4– ... –0.3V to 0.3V SWB BSTB INTVCC VCC GND INTVCC_P BSTG SWG I C PGOOD1-4..5mA VINB FB1– EXTVCC RUN4 FB4– RUN1 TEMP VING Operating Junction Temperature D (Notes 2, 3) .. –40°C to 125°C PGNDB PGOOD1 FB1+ IMON1 FB4+ IMON4 PGOOD4 PGNDG Storage Temperature Range .. –65°C to 150°C E Maximum Reflow (Package Body) Temperature ... 260ºC PGNDC PGOOD2 FB2+ IMON2 FB3+ IMON3 PGOOD3 PGNDF F VINC FB2– CFG0 RUN3 FB3– RUN2 CFG3 VINF G SWC BSTC SYNC/MODE CFG2 RT CFG1 BSTF SWF H BSTD SWD VIND PGNDD PGNDE VINE SWE BSTE BGA PACKAGE 64-Lead (7.00mm × 7.00mm × 1.34mm) TJMAX = 125°C, θJA = 35°C/W, 0.8mm Ball Pitch θJCTOP = 23˚C/W, θJCBOTTOM = 16˚C/W θ Values Determined per JESD51-12
ORDER INFORMATION PART MARKING* PACKAGE MSL TEMPERATURE RANGE PART NUMBER PAD OR BALL FINISH DEVICE FINISH CODE TYPE RATING (SEE NOTE 2)
LTC3376EY#PBF LTC3376 –40°C to 125°C SAC305 (RoHS) e1 BGA 3 LTC3376IY#PBF LTC3376 –40°C to 125°C • Contact the factory for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Pad or ball finish code is per IPC/JEDEC J-STD-609. Procedures • Device temperature grade is indicated by a label on the shipping container. • LGA and BGA Package and Tray Drawings
ELECTRICAL CHARACTERISTICS The
l
denotes the specifications which apply over the specified operating temperature range, otherwise specifications are at TA = 25°C (Note 2). VCC = VINA-H = 12V, RT tied to INTVCC, VFB1-4¯ = 0V, unless otherwise stated. SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
VCC VCC Voltage Range l 3 20 V IVCC VCC Input Supply Current, EXTVCC = 0V All Bucks in Shutdown 9 15 µA 1 Buck on, Sleeping, V + FB = 0.41V 61 90 µA Each Additional Buck, Sleeping 17 30 µA 1 Buck on (Configured to 1 Power Stage), 4.5 mA SYNC/MODE = INTVCC (Note 3) VCC Input Supply Current, EXTVCC = 3.3V At Least One Buck On 7 12 µA Rev 0 2 For more information www.analog.com Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Electrical Characteristics Pin Configuration Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Package Description Typical Application Related Parts
ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION (Note 1)
V TOP VIEW CC, VINA-H ... –0.3V to 22V FB1-4+, RUN1-4, CFG1-3, EXTV 1 2 3 4 5 6 7 8 CC, PGOOD1-4, INTVCC, INTVCC_P, SYNC/MODE .. –0.3V to 6V A CFG0, RT, TEMP, IMON1-4 ..–0.3V to (INTVCC + 0.3V) BSTA SWA VINA PGNDA PGNDH VINH SWH BSTH INTVCC – INTVCC_P ... –0.3V to 0.3V B FB1-4– ... –0.3V to 0.3V SWB BSTB INTVCC VCC GND INTVCC_P BSTG SWG I C PGOOD1-4..5mA VINB FB1– EXTVCC RUN4 FB4– RUN1 TEMP VING Operating Junction Temperature D (Notes 2, 3) .. –40°C to 125°C PGNDB PGOOD1 FB1+ IMON1 FB4+ IMON4 PGOOD4 PGNDG Storage Temperature Range .. –65°C to 150°C E Maximum Reflow (Package Body) Temperature ... 260ºC PGNDC PGOOD2 FB2+ IMON2 FB3+ IMON3 PGOOD3 PGNDF F VINC FB2– CFG0 RUN3 FB3– RUN2 CFG3 VINF G SWC BSTC SYNC/MODE CFG2 RT CFG1 BSTF SWF H BSTD SWD VIND PGNDD PGNDE VINE SWE BSTE BGA PACKAGE 64-Lead (7.00mm × 7.00mm × 1.34mm) TJMAX = 125°C, θJA = 35°C/W, 0.8mm Ball Pitch θJCTOP = 23˚C/W, θJCBOTTOM = 16˚C/W θ Values Determined per JESD51-12
ORDER INFORMATION PART MARKING* PACKAGE MSL TEMPERATURE RANGE PART NUMBER PAD OR BALL FINISH DEVICE FINISH CODE TYPE RATING (SEE NOTE 2)
LTC3376EY#PBF LTC3376 –40°C to 125°C SAC305 (RoHS) e1 BGA 3 LTC3376IY#PBF LTC3376 –40°C to 125°C • Contact the factory for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Pad or ball finish code is per IPC/JEDEC J-STD-609. Procedures • Device temperature grade is indicated by a label on the shipping container. • LGA and BGA Package and Tray Drawings
ELECTRICAL CHARACTERISTICS The
l
denotes the specifications which apply over the specified operating temperature range, otherwise specifications are at TA = 25°C (Note 2). VCC = VINA-H = 12V, RT tied to INTVCC, VFB1-4¯ = 0V, unless otherwise stated. SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
VCC VCC Voltage Range l 3 20 V IVCC VCC Input Supply Current, EXTVCC = 0V All Bucks in Shutdown 9 15 µA 1 Buck on, Sleeping, V + FB = 0.41V 61 90 µA Each Additional Buck, Sleeping 17 30 µA 1 Buck on (Configured to 1 Power Stage), 4.5 mA SYNC/MODE = INTVCC (Note 3) VCC Input Supply Current, EXTVCC = 3.3V At Least One Buck On 7 12 µA Rev 0 2 For more information www.analog.com Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Electrical Characteristics Pin Configuration Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Package Description Typical Application Related Parts
