Datasheet ADN2892 (Analog Devices) - 5
| Manufacturer | Analog Devices |
| Description | 3.3 V 4.25 Gb/s Limiting Amplifier |
| Pages / Page | 16 / 5 — Data Sheet. ADN2892. ABSOLUTE MAXIMUM RATINGS Table 2. THERMAL … |
| Revision | C |
| File Format / Size | PDF / 458 Kb |
| Document Language | English |
Data Sheet. ADN2892. ABSOLUTE MAXIMUM RATINGS Table 2. THERMAL RESISTANCE. Parameter. Rating. Table 3. Package Type. θJA. Unit. ESD CAUTION
Model Line for this Datasheet
Text Version of Document
Data Sheet ADN2892 ABSOLUTE MAXIMUM RATINGS Table 2. THERMAL RESISTANCE Parameter Rating
θJA is specified for 4-layer PCB with exposed paddle soldered Power Supply Voltage 4.2 V to GND. Minimum Voltage (All Inputs and Outputs) VEE − 0.4 V Maximum Voltage (All Inputs and Outputs) VCC + 0.4 V
Table 3.
Storage Temperature −65°C to +150°C
Package Type θJA Unit
Operating Temperature Range −40°C to +95°C 3 mm × 3 mm, 16-lead LFCSP 28 °C/W Production Soldering Temperature J-STD-20 Junction Temperature 125°C
ESD CAUTION
Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. C | Page 5 of 16 Document Outline Features Applications General Description Functional Block Diagram Specifications Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Theory of Operation Limiting Amplifier Input Buffer CML Output Buffer Loss-of-Signal (LOS) Detector Received Signal Strength Indicator (RSSI) Squelch Mode BW_SEL (Bandwidth Selection) Mode LOS_INV (Lose of Signal_Invert) Mode Applications Information PCB Design Guidelines Output Buffer Power Supply and Ground Planes PCB Layout Soldering Guidelines for the LFCSP Pad Coating and Pb-Free Soldering Outline Dimensions Ordering Guide
θJA is specified for 4-layer PCB with exposed paddle soldered Power Supply Voltage 4.2 V to GND. Minimum Voltage (All Inputs and Outputs) VEE − 0.4 V Maximum Voltage (All Inputs and Outputs) VCC + 0.4 V
Table 3.
Storage Temperature −65°C to +150°C
Package Type θJA Unit
Operating Temperature Range −40°C to +95°C 3 mm × 3 mm, 16-lead LFCSP 28 °C/W Production Soldering Temperature J-STD-20 Junction Temperature 125°C
ESD CAUTION
Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. C | Page 5 of 16 Document Outline Features Applications General Description Functional Block Diagram Specifications Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Theory of Operation Limiting Amplifier Input Buffer CML Output Buffer Loss-of-Signal (LOS) Detector Received Signal Strength Indicator (RSSI) Squelch Mode BW_SEL (Bandwidth Selection) Mode LOS_INV (Lose of Signal_Invert) Mode Applications Information PCB Design Guidelines Output Buffer Power Supply and Ground Planes PCB Layout Soldering Guidelines for the LFCSP Pad Coating and Pb-Free Soldering Outline Dimensions Ordering Guide
