Datasheet TB67B000AHG (Toshiba) - 3
| Manufacturer | Toshiba |
| Description | Bi-CMOS Power Integrated Circuit Multi-Chip Package (MCP). High voltage 3-Phase Full-Wave PWM Brushless Motor Driver |
| Pages / Page | 31 / 3 — Pin Assignment |
| File Format / Size | PDF / 460 Kb |
| Document Language | English |
Pin Assignment
Model Line for this Datasheet
Text Version of Document
TB67B000AHG
Pin Assignment
IS3 VBB W BSV BSU IS1 PGND BSW V U IS2 VREG 30 29 28 27 26 25 24 23 22 21 20 19 (Die pad) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 FG LA OSCR HUP HVP HWP V FGC refout CW/CCW VSP SGND TR HUM HVM HWM SS Idc VCC Note: Die pad on the package surface and PGND are connected. When using the heat sink, handle it not to short to the IC pins. When applying the different potential with GND level to the heat sink, insulate with die pad and the heat sink. 3 2019-05-30 Document Outline TOSHIBA Bi-CMOS Power Integrated Circuit Multi-Chip Package (MCP) High voltage 3-Phase Full-Wave PWM Brushless Motor Driver Features Block Diagram Pin Assignment Pin Description Input/Output Equivalent Circuits Absolute Maximum Ratings (Ta = 25 C) Operating conditions (Ta = 25 C) Power Dissipation Electrical Characteristics (Ta = 25 C) Functional Description 1. Basic Operation 2. Voltage Command (VSP) Signal and Bootstrap Voltage Regulation 3. Dead Time Insertion (cross conduction protection) 4. Lead Angle Control 5. PWM Carrier Frequency 6. Position Detecting Pin <Hall device input> <Hall IC input> 7. Rotating Pulse Output Timing Chart of FG Signal 8. Protection-related Functions 9. Motor-lock detection Timing Chart Timing Chart 1: Output waveform of sine-wave PWM drive Timing Chart 2: Output waveform of sine-wave PWM drive Timing Chart 3: Output waveform of wide-angle commutation Timing Chart 4: Output waveform of wide-angle commutation Timing Chart 5: Output waveform of square-wave drive Timing Chart 6: Output waveform of square-wave drive Timing Chart 7: Output waveform of square-wave drive Timing Chart 8: Output waveform of square-wave drive Application Circuit Example External Parts Package Dimensions Notes on Contents IC Usage Considerations Notes on handling of ICs PD MAX – Ta 40 Power dissipation PD MAX (W) 30 20 10 0 0 25 50 75 100 125 150 Ambient temperature Ta ( C) ① INFINITE HEAT SINK : R(j-c = 1 C/W ② When mounted on the board (74.2 × 114.3 × 1.6 mm, Cu20%), HEAT SINK (10 × 10 × 1 mm, Cu) : R(j-a = 17 C/W ③ When mounted on the board (74.2 × 114.3 × 1.6 mm, Cu20%) : R(j-a = 35 C/W ④ IC only : R(j-a = 53 C/W PWM Duty (1) (2) (3) 92% 2.1 V 1.0 V 5.4 V VSP (4) 7.3 V 8.2 V 10 V (1) (2) (3) 2.1 V 1.0 V 5.4 V VSP (4) 7.3 V 8.2 V 10 V PWM Duty (Upper phase) *95% (typ.) *2.4% (typ.) RESTRICTIONS ON PRODUCT USE
Pin Assignment
IS3 VBB W BSV BSU IS1 PGND BSW V U IS2 VREG 30 29 28 27 26 25 24 23 22 21 20 19 (Die pad) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 FG LA OSCR HUP HVP HWP V FGC refout CW/CCW VSP SGND TR HUM HVM HWM SS Idc VCC Note: Die pad on the package surface and PGND are connected. When using the heat sink, handle it not to short to the IC pins. When applying the different potential with GND level to the heat sink, insulate with die pad and the heat sink. 3 2019-05-30 Document Outline TOSHIBA Bi-CMOS Power Integrated Circuit Multi-Chip Package (MCP) High voltage 3-Phase Full-Wave PWM Brushless Motor Driver Features Block Diagram Pin Assignment Pin Description Input/Output Equivalent Circuits Absolute Maximum Ratings (Ta = 25 C) Operating conditions (Ta = 25 C) Power Dissipation Electrical Characteristics (Ta = 25 C) Functional Description 1. Basic Operation 2. Voltage Command (VSP) Signal and Bootstrap Voltage Regulation 3. Dead Time Insertion (cross conduction protection) 4. Lead Angle Control 5. PWM Carrier Frequency 6. Position Detecting Pin <Hall device input> <Hall IC input> 7. Rotating Pulse Output Timing Chart of FG Signal 8. Protection-related Functions 9. Motor-lock detection Timing Chart Timing Chart 1: Output waveform of sine-wave PWM drive Timing Chart 2: Output waveform of sine-wave PWM drive Timing Chart 3: Output waveform of wide-angle commutation Timing Chart 4: Output waveform of wide-angle commutation Timing Chart 5: Output waveform of square-wave drive Timing Chart 6: Output waveform of square-wave drive Timing Chart 7: Output waveform of square-wave drive Timing Chart 8: Output waveform of square-wave drive Application Circuit Example External Parts Package Dimensions Notes on Contents IC Usage Considerations Notes on handling of ICs PD MAX – Ta 40 Power dissipation PD MAX (W) 30 20 10 0 0 25 50 75 100 125 150 Ambient temperature Ta ( C) ① INFINITE HEAT SINK : R(j-c = 1 C/W ② When mounted on the board (74.2 × 114.3 × 1.6 mm, Cu20%), HEAT SINK (10 × 10 × 1 mm, Cu) : R(j-a = 17 C/W ③ When mounted on the board (74.2 × 114.3 × 1.6 mm, Cu20%) : R(j-a = 35 C/W ④ IC only : R(j-a = 53 C/W PWM Duty (1) (2) (3) 92% 2.1 V 1.0 V 5.4 V VSP (4) 7.3 V 8.2 V 10 V (1) (2) (3) 2.1 V 1.0 V 5.4 V VSP (4) 7.3 V 8.2 V 10 V PWM Duty (Upper phase) *95% (typ.) *2.4% (typ.) RESTRICTIONS ON PRODUCT USE
