Datasheet AD7414, AD7415 (Analog Devices) - 5

Data Sheet AD7414/ AD7415 ABSOLUTE MAXIMUM RATINGS Table 2.
Stresses at or above those listed under Absolute Maximum
Parameter Rating
Ratings may cause permanent damage to the product. This is a VDD to GND −0.3 V to +7 V stress rating only; functional operation of the product at these SDA Input Voltage to GND −0.3 V to +7 V or any other conditions above those indicated in the operational SDA Output Voltage to GND −0.3 V to +7 V section of this specification is not implied. Operation beyond SCL Input Voltage to GND −0.3 V to +7 V the maximum operating conditions for extended periods may ALERT Output Voltage to GND −0.3 V to +7 V affect product reliability. Operating Temperature Range −40°C to +125°C
ESD CAUTION
Storage Temperature Range −65°C to +150°C Junction Temperature 150°C 5-Lead SOT-23 (RJ-5) Power Dissipation1, 2 WMAX = (TJMAX − TA)/θJA Thermal Impedance3 θJA, Junction-to-Ambient (still air) 240°C/W 6-Lead SOT-23 (RJ-6) Power Dissipation1, 2 WMAX = (TJMAX − TA)/θJA Thermal Impedance3 θJA, Junction-to-Ambient (still air) 190.4°C/W 8-Lead MSOP (RM-8) Power Dissipation1, 2 WMAX = (TJMAX − TA)/θJA Thermal Impedance3 θJA, Junction-to-Ambient (still air) 205.9°C/W θJC, Junction-to-Case 43.74°C/W IR Reflow Soldering Peak Temperature 220°C (0°C/5°C) Time at Peak Temperature 10 sec to 20 sec Ramp-up Rate 3°C/s max Ramp-down Rate −6°C/s max Ramp from 25°C to Peak Temperature 6 minutes max IR Reflow Soldering in Pb-Free Package Peak Temperature 260°C (0°C) Time at Peak Temperature 20 sec to 40 sec Ramp Rate 3°C/s max Ramp-Down Rate −6°C/s max Ramp from 25°C to Peak Temperature 8 minutes max 1 Values relate to package being used on a standard 2-layer PCB. 2 TA = ambient temperature. 3 Junction-to-case resistance is applicable to components featuring a preferential flow direction, such as components mounted on a heat sink. Junction-to-ambient resistance is more useful for air-cooled, PCB-mounted components. Rev. G | Page 5 of 19 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM PRODUCT HIGHLIGHTS TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS THEORY OF OPERATION CIRCUIT INFORMATION FUNCTIONAL DESCRIPTION MEASUREMENT TECHNIQUE TEMPERATURE DATA FORMAT INTERNAL REGISTER STRUCTURE ADDRESS POINTER REGISTER CONFIGURATION REGISTER (ADDRESS 0x01) TEMPERATURE VALUE REGISTER (ADDRESS 0x00) AD7414 THIGH REGISTER (ADDRESS 0X02) AD7414 TLOW REGISTER (ADDRESS 0x03) SERIAL INTERFACE SERIAL BUS ADDRESS WRITE MODE Writing to the Address Pointer Register for a Subsequent Read Writing a Single Byte of Data to the Configuration Register, THIGH Register, or TLOW Register READ MODE SMBUS ALERT POWER-ON DEFAULTS OPERATING MODES Mode 1 Mode 2 POWER VS. THROUGHPUT Mode 1 Mode 2 MOUNTING THE AD7414/AD7415 SUPPLY DECOUPLING TEMPERATURE ACCURACY VS. SUPPLY TYPICAL TEMPERATURE ERROR GRAPH OUTLINE DIMENSIONS ORDERING GUIDE