Datasheet LND150, LND250 (Microchip) - 6

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LND150/LND250 3.0 PIN DESCRIPTION
The details on the pins of LND150/LND250 are listed on Table 3-1, Table 3-2 and Table 3-3. Refer to
Package Types
for the location of pins.
TABLE 3-1: TO-92 PIN FUNCTION TABLE Pin Number Pin Name Description
1 SOURCE SOURCE 2 GATE GATE 3 DRAIN DRAIN
TABLE 3-2: SOT-23 PIN FUNCTION TABLE Pin Number Pin Name Description
1 GATE GATE 2 DRAIN DRAIN 3 SOURCE SOURCE
TABLE 3-3: SOT-89 PIN FUNCTION TABLE Pin Number Pin Name Description
1 GATE GATE 2, 4 SOURCE SOURCE 3 DRAIN DRAIN DS20005454A-page 6  2018 Microchip Technology Inc. Document Outline N-Channel Depletion-Mode DMOS FETs Features Applications General Description Package Types 1.0 Electrical Characteristics Absolute Maximum Ratings† DC Electrical Characteristics AC Electrical Characteristics Temperature Specifications Thermal Characteristics 2.0 Typical Performance Curves FIGURE 2-1: Output Characteristics. FIGURE 2-2: Transconductance vs. Drain Current. FIGURE 2-3: Maximum Rated Safe Operating Area. FIGURE 2-4: Saturation Characteristics. FIGURE 2-5: Power Dissipation vs. Ambient Temperature. FIGURE 2-6: Thermal Response Characteristics. FIGURE 2-7: BVDSS Variation with Temperature. FIGURE 2-8: Transfer Characteristics. FIGURE 2-9: Capacitance vs. Drain-to- Source Voltage. FIGURE 2-10: Drain Current vs. RSOURCE. FIGURE 2-11: VGS(OFF) and RDS Variation with Temperature. FIGURE 2-12: Gate Drive Dynamic Characteristics. 3.0 Pin Description TABLE 3-1: TO-92 Pin Function Table TABLE 3-2: SOT-23 Pin Function Table TABLE 3-3: SOT-89 Pin Function Table 4.0 Functional Description FIGURE 4-1: Switching Waveforms and Test Circuit. TABLE 4-1: Product Summary 5.0 Packaging Information 5.1 Package Marking Information Appendix A: Revision History Revision A (August 2018) Product Identification System Worldwide Sales and Service