Datasheet MAX31889 (Maxim) - 2
| Manufacturer | Maxim |
| Description | ±0.25°C Accurate I2C Temperature Sensor |
| Pages / Page | 31 / 2 — Absolute Maximum Ratings. Package Information. μDFN. Thermal Resistance, … |
| File Format / Size | PDF / 585 Kb |
| Document Language | English |
Absolute Maximum Ratings. Package Information. μDFN. Thermal Resistance, Four-Layer Board:
Model Line for this Datasheet
Text Version of Document
MAX31889 ±0.25°C Accurate I2C Temperature Sensor
Absolute Maximum Ratings
VDD to GND .. -0.3V to +6V Operating Temperature Range ...-40°C to 125°C GPIOx to GND .. -0.3V to +6V Junction Temperature ... +150°C SDA,SCL to GND ... -0.3V to +6V Storage Temperature Range ..-65°C to +150°C Continuous Power Dissipation (Multilayer Board μDFN, TA = +70 Lead Temperature (soldering, 10s) ..+300°C °C, derate 5.47mW/°C above 70°C ) .. 437.25mW/°C Soldering Temperature (reflow) ..+260°C Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Package Information μDFN
Package Code L622+2 Outline Number 21-100397 Land Pattern Number 90-100138
Thermal Resistance, Four-Layer Board:
Junction to Ambient (θJA) 182.96°C/W Junction to Case (θJC) 50.75°C/W For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. 19-100693 www.maximintegrated.com Maxim Integrated | 2 Document Outline General Description Applications Benefits and Features Simplified Block Diagram Absolute Maximum Ratings Package Information μDFN Electrical Characteristics Electrical Characteristics (continued) Typical Operating Characteristics Typical Operating Characteristics (continued) Pin Configuration μDFN Pin Description Functional Diagrams Detailed Description Operation Measuring Temperature Alarm Signaling GPIO I2C I2C Slave Address I2C/SMBus Compatible Serial Interface Detailed I2C Timing Diagram Bit Transfer START and STOP Conditions Early STOP Conditions Acknowledge Bit I2C Write Data Format I2C Read Data Format FIFO Description Register Map Register Map Register Details STATUS (0x0) INTERRUPT ENABLE (0x1) FIFO WRITE POINTER (0x04) FIFO READ POINTER (0x05) FIFO OVERFLOW COUNTER (0x06) FIFO DATA COUNTER (0x07) FIFO DATA (0x08) FIFO CONFIGURATION 1 (0x09) FIFO CONFIGURATION 2 (0x0A) SYSTEM CONTROL (0x0C) ALARM HIGH MSB (0x10) ALARM HIGH LSB (0x11) ALARM LOW MSB (0x12) ALARM LOW LSB (0x13) TEMP SENSOR SETUP (0x14) GPIO SETUP (0x20) GPIO CONTROL (0x21) ROM ID 1 (0x31) ROM ID 2 (0x32) ROM ID 3 (0x33) ROM ID 4 (0x34) ROM ID 5 (0x35) ROM ID 6 (0x36) PART IDENTIFIER (0xFF) Applications Information Measurement Considerations Typical Application Circuit Ordering Information Revision History
Absolute Maximum Ratings
VDD to GND .. -0.3V to +6V Operating Temperature Range ...-40°C to 125°C GPIOx to GND .. -0.3V to +6V Junction Temperature ... +150°C SDA,SCL to GND ... -0.3V to +6V Storage Temperature Range ..-65°C to +150°C Continuous Power Dissipation (Multilayer Board μDFN, TA = +70 Lead Temperature (soldering, 10s) ..+300°C °C, derate 5.47mW/°C above 70°C ) .. 437.25mW/°C Soldering Temperature (reflow) ..+260°C Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Package Information μDFN
Package Code L622+2 Outline Number 21-100397 Land Pattern Number 90-100138
Thermal Resistance, Four-Layer Board:
Junction to Ambient (θJA) 182.96°C/W Junction to Case (θJC) 50.75°C/W For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. 19-100693 www.maximintegrated.com Maxim Integrated | 2 Document Outline General Description Applications Benefits and Features Simplified Block Diagram Absolute Maximum Ratings Package Information μDFN Electrical Characteristics Electrical Characteristics (continued) Typical Operating Characteristics Typical Operating Characteristics (continued) Pin Configuration μDFN Pin Description Functional Diagrams Detailed Description Operation Measuring Temperature Alarm Signaling GPIO I2C I2C Slave Address I2C/SMBus Compatible Serial Interface Detailed I2C Timing Diagram Bit Transfer START and STOP Conditions Early STOP Conditions Acknowledge Bit I2C Write Data Format I2C Read Data Format FIFO Description Register Map Register Map Register Details STATUS (0x0) INTERRUPT ENABLE (0x1) FIFO WRITE POINTER (0x04) FIFO READ POINTER (0x05) FIFO OVERFLOW COUNTER (0x06) FIFO DATA COUNTER (0x07) FIFO DATA (0x08) FIFO CONFIGURATION 1 (0x09) FIFO CONFIGURATION 2 (0x0A) SYSTEM CONTROL (0x0C) ALARM HIGH MSB (0x10) ALARM HIGH LSB (0x11) ALARM LOW MSB (0x12) ALARM LOW LSB (0x13) TEMP SENSOR SETUP (0x14) GPIO SETUP (0x20) GPIO CONTROL (0x21) ROM ID 1 (0x31) ROM ID 2 (0x32) ROM ID 3 (0x33) ROM ID 4 (0x34) ROM ID 5 (0x35) ROM ID 6 (0x36) PART IDENTIFIER (0xFF) Applications Information Measurement Considerations Typical Application Circuit Ordering Information Revision History
