Preliminary Datasheet EPC2152 (Efficient Power Conversion) - 4
| Manufacturer | Efficient Power Conversion |
| Description | 80 V, 12.5 A ePower Stage |
| Pages / Page | 15 / 4 — EPC2152 – 80 V, 12.5 A ePower™ Stage. PRELIMINARY. Absolute Maximum … |
| File Format / Size | PDF / 1.7 Mb |
| Document Language | English |
EPC2152 – 80 V, 12.5 A ePower™ Stage. PRELIMINARY. Absolute Maximum Ratings. Symbol. Parameter. Min. Max. Units. ESD Ratings
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EPC2152 – 80 V, 12.5 A ePower™ Stage PRELIMINARY Absolute Maximum Ratings
Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur and device reliability may be affected. Al voltage parameters are absolute voltages referenced to GND unless indicated otherwise. All ratings are specified at TA = 25˚C.
Symbol Parameter Min Max Units
VIN Input Voltage (VIN to GND) 80 V VSW Output Switching Node (SW to GND) 80 V VDD Low Side Supply Voltage (VDD to GND) 14 V VBOOT - VSW High Side Supply Voltage (VBOOT to SW) 14 V HSin High Side Logic Input (HSin to GND) 5.5 V LSin Low Side Logic Input (LSin to GND) 5.5 V TJ Junction Temperature -40 150 C TSTG Storage Temperature -40 150 C
ESD Ratings Symbol Parameter Min Max Units
HBM Human-body model (JEDEC JS-001) +/-1000 V CDM Charged-device model (JEDEC JESD22-C101) +/-500 V
Thermal Characteristics
RθJA is determined with the device mounted on 1 in2 of copper pad, single layer 2 oz copper on FR4 board.
Symbol Parameter Typ Units
RθJC Thermal Resistance, Junction to Case 0.47 °C/W RθJB Thermal Resistance, Junction to Board 3 °C/W RθJA Thermal Resistance, Junction to Ambient 46 °C/W
Recommended Operating Conditions
For proper operation the device should be used within the recommended conditions. Al voltage parameters are absolute voltages referenced to GND unless indicated otherwise. Al ratings are specified at TA = 25˚C.
Symbol Parameter Min Typ Max Units
VIN Input Voltage (VIN to GND) 0 60 V V (3) SW Output Switching Node (SW to GND) -2.5 60 V VDD Low Side Supply Voltage (VDD to GND) 11 12 13 V VBOOT - VSW High Side Supply Voltage (VBOOT to VSW) 11 12 13 V HSin High Side Logic Input (HSin to GND) 0 5 (4) V LSin Low Side Logic Input (LSin to GND) 0 5 (4) V
Subject to Change without Notice www.epc-co.com COPYRIGHT 2020 Rev 1.1 Page 4
Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur and device reliability may be affected. Al voltage parameters are absolute voltages referenced to GND unless indicated otherwise. All ratings are specified at TA = 25˚C.
Symbol Parameter Min Max Units
VIN Input Voltage (VIN to GND) 80 V VSW Output Switching Node (SW to GND) 80 V VDD Low Side Supply Voltage (VDD to GND) 14 V VBOOT - VSW High Side Supply Voltage (VBOOT to SW) 14 V HSin High Side Logic Input (HSin to GND) 5.5 V LSin Low Side Logic Input (LSin to GND) 5.5 V TJ Junction Temperature -40 150 C TSTG Storage Temperature -40 150 C
ESD Ratings Symbol Parameter Min Max Units
HBM Human-body model (JEDEC JS-001) +/-1000 V CDM Charged-device model (JEDEC JESD22-C101) +/-500 V
Thermal Characteristics
RθJA is determined with the device mounted on 1 in2 of copper pad, single layer 2 oz copper on FR4 board.
Symbol Parameter Typ Units
RθJC Thermal Resistance, Junction to Case 0.47 °C/W RθJB Thermal Resistance, Junction to Board 3 °C/W RθJA Thermal Resistance, Junction to Ambient 46 °C/W
Recommended Operating Conditions
For proper operation the device should be used within the recommended conditions. Al voltage parameters are absolute voltages referenced to GND unless indicated otherwise. Al ratings are specified at TA = 25˚C.
Symbol Parameter Min Typ Max Units
VIN Input Voltage (VIN to GND) 0 60 V V (3) SW Output Switching Node (SW to GND) -2.5 60 V VDD Low Side Supply Voltage (VDD to GND) 11 12 13 V VBOOT - VSW High Side Supply Voltage (VBOOT to VSW) 11 12 13 V HSin High Side Logic Input (HSin to GND) 0 5 (4) V LSin Low Side Logic Input (LSin to GND) 0 5 (4) V
Subject to Change without Notice www.epc-co.com COPYRIGHT 2020 Rev 1.1 Page 4
