Datasheet ADA4806-1 (Analog Devices) - 8

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ADA4806-1 Data Sheet ABSOLUTE MAXIMUM RATINGS Table 5.
The quiescent power dissipation is the voltage between the supply
Parameter Rating
pins (VS) multiplied by the quiescent current (IS). Supply Voltage 11 V PD = Quiescent Power + (Total Drive Power − Load Power) Power Dissipation See Figure 3  V V  V 2 Common-Mode Input Voltage −V = × + × − D P (V I ) S OUT OUT S − 0.7 V to +VS + 0.7 V S S   Differential Input Voltage ±1 V  2 RL  RL Storage Temperature Range −65°C to +125°C RMS output voltages must be considered. If RL is referenced Operating Temperature Range −40°C to +125°C to −VS, as in single-supply operation, the total drive power is Lead Temperature (Soldering, 10 sec) 300°C VS × IOUT. If the rms signal levels are indeterminate, consider the Junction Temperature 150°C worst case, when VOUT = VS/4 for RL to midsupply. Stresses at or above those listed under Absolute Maximum V 2 / 4 P = V × I + D ( S S ) ( S ) Ratings may cause permanent damage to the product. This is a RL stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational In single-supply operation with RL referenced to −VS, the worst section of this specification is not implied. Operation beyond case is VOUT = VS/2. the maximum operating conditions for extended periods may Airflow increases heat dissipation, effectively reducing θJA. affect product reliability. Additionally, more metal directly in contact with the package
THERMAL RESISTANCE
leads and exposed pad from metal traces, through holes, ground, and power planes reduces θJA. θJA is specified for the worst case conditions, that is, θJA is specified for a device soldered in a circuit board for surface-mount packages. Figure 3 shows the maximum safe power dissipation in the Table 6 lists the θ package vs. the ambient temperature on a JEDEC standard, JA for the ADA4806-1. 4-layer board. θJA values are approximations.
Table 6. Thermal Resistance 1.0 Package Type θ TJ = 150°C JA Unit 0.9 )
8-Lead SOT-23 209.1 °C/W
(W 0.8 N IO MAXIMUM POWER DISSIPATION T 0.7 PA
The maximum safe power dissipation for the ADA4806-1 is
0.6 ISSI D
limited by the associated rise in junction temperature (T
0.5
J) on
ER
the die. At approximately 150°C, which is the glass transition
W 0.4
temperature, the properties of the plastic change. Even temporarily
M PO 0.3
exceeding this temperature limit may change the stresses that the
MU XI 0.2
package exerts on the die, permanently shifting the parametric
MA 0.1
performance of the ADA4806-1. Exceeding a junction temperature of 175°C for an extended period of time can result in changes in
0
600
–50 –30 –10 10 30 50 70 90 110 130
silicon devices, potentially causing degradation or loss of
AMBIENT TEMPERATURE (°C)
13391- functionality. Figure 3. Maximum Power Dissipation vs. Ambient Temperature for a 4-Layer Board The power dissipated in the package (PD) is the sum of the quiescent power dissipation and the power dissipated in the die
ESD CAUTION
due to the ADA4806-1 output load drive. Rev. A | Page 8 of 24 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION TYPICAL APPLICATIONS CIRCUIT TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ±5 V SUPPLY 5 V SUPPLY 3 V SUPPLY ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE MAXIMUM POWER DISSIPATION ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS TEST CIRCUITS THEORY OF OPERATION AMPLIFIER DESCRIPTION INPUT PROTECTION SHUTDOWN/SLEEP MODE OPERATION NOISE CONSIDERATIONS APPLICATIONS INFORMATION SLEW ENHANCEMENT EFFECT OF FEEDBACK RESISTOR ON FREQUENCY RESPONSE COMPENSATING PEAKING IN LARGE SIGNAL FREQUENCY RESPONSE DRIVING LOW POWER, HIGH RESOLUTION SUCCESSIVE APPROXIMATION REGISTER (SAR) ADCs DYNAMIC POWER SCALING SINGLE-ENDED TO DIFFERENTIAL CONVERSION LAYOUT CONSIDERATIONS Ground Plane Power Supply Bypassing OUTLINE DIMENSIONS ORDERING GUIDE