Datasheet VSC7428-12 (Microchip) - 676
| Manufacturer | Microchip |
| Description | 11-Port L2 Ethernet Switch with 8 Integrated 10/100 Cu PHYs and Embedded MIPS CPU |
| Pages / Page | 721 / 676 — Figure 110 •. VCore-III CPU ROM/Flash Write Timing Diagram. Table 853 • |
| File Format / Size | PDF / 4.6 Mb |
| Document Language | English |
Figure 110 •. VCore-III CPU ROM/Flash Write Timing Diagram. Table 853 •

Model Line for this Datasheet
Text Version of Document
Electrical Specifications
Figure 110 • VCore-III CPU ROM/Flash Write Timing Diagram
WAITCC HLDCC PI_Clk CSCC PI_Addr[3:0] PI_nWR tSU(nCS) tCS(LOW) tH(nCS) PI_nCS PI_nOE PI_Data[7:0] tREL(nDone) PI_nDone The timing related to VCore-III external PI access is programmable. The programmable delays adjust timing in steps of the PI_Clk period. The PI_Clk period is determined by the dividers in the HSIO::PLL5G_CFG0 and ICPU_CFG::PI_MST_CFG registers. The default settings correspond to a PI_Clk period of 297.6 ns. The condition used for these specifications corresponds to a PI_Clk period of 22.4 ns. Additionally, the default delay settings are used for WAITCC(1), CSCC(1), OECC(0) and HLDCC(0) as defined by the PI_MST_CTRL registers.
Table 853 • VCore-III CPU External PI Write Timing Specifications Parameter Symbol Minimum Maximum Unit Condition
Address/control setup time to chip tSU(nCS) 18 ns CL = 30 pF select(1) Address/control hold time from chip tH(nCS) –4 ns CL = 30 pF select(2) Chip select low(3) tCS(low) 18 23 ns CL = 30 pF Data setup time to chip select high tSU(D) 15 ns CL = 30 pF PI_nDone release after chip select tREL(nDone) 0 ns CL = 30 pF high(4) 1. The minimum setup time of PI_ADDR[3:0]/PI_nBE[1:0]/PI_nWR to PI_nCSlow may be expressed as WAITCC × 22.4 ns – 4 ns = 18.4 ns. 2. The minimum hold time of PI_ADDR[3:0]/PI_nBE[1:0]/PI_nWR from PI_nCS high may be expressed as HLDCC × 22.4 ns – 4 ns = –4 ns. 3. The maximum PI_nCS low time may expressed as (WAITCC + 1 – CSCC) × 22.4 ns = 22.4 ns. The minimum is maximum 4 ns less than the maximum. 4. The interface can operate in a device-paced mode according to the PI_MST_CTRL registers. Device-paced mode allows slow devices to delay the access cycle termination beyond the WAITCC setting. A timeout can be specified in the PI_MST_CTRL registers to terminate access cycles from non-responsive external devices.In device-paced mode, PI_nDone must be released after PI_nCS is observed high and before the next access cycle is started. Slow devices may require HLDCC to be adjusted accordingly. VMDS-10441 VSC7428-12 Datasheet Revision 4.1 646 Document Outline 1 Revision History 1.1 Revision 4.1 1.2 Revision 4.0 2 Introduction 2.1 Register Notation 2.2 Standard References 2.3 Terms and Abbreviations 3 Product Overview 3.1 General Features 3.1.1 Layer-2 Switching 3.1.2 Multicast 3.1.3 Carrier Ethernet 3.1.4 Quality of Service 3.1.5 Security 3.1.6 Management 3.2 Applications 3.3 Related Products 3.4 Functional Overview 3.4.1 Frame Arrival 3.4.2 Basic and Advanced Frame Classification 3.4.3 VCAP-II Vitesse Content Aware Processor 3.4.4 Policing 3.4.5 Layer-2 Forwarding 3.4.6 Shared Queue System and Egress Scheduler 3.4.7 Rewriter and Frame Departure 3.4.8 CPU Port Module 3.4.9 Synchronous Ethernet and Precision Time Protocol 3.4.10 CPU System and Interfaces 4 Functional Descriptions 4.1 Port Modules 4.1.1 Port Module Numbering and Macro Connections 4.1.2 MAC 4.1.3 PCS 4.2 SERDES1G 4.2.1 SERDES1G Basic Configuration 4.2.2 SERDES1G Loopback Modes 4.2.3 Synchronous Ethernet 4.2.4 SERDES1G Deserializer Configuration 4.2.5 SERDES1G Serializer Configuration 4.2.6 SERDES1G Input Buffer Configuration 4.2.7 SERDES1G Output Buffer Configuration 4.2.8 SERDES1G Clock and Data Recovery (CDR) in 100BASE-FX 4.2.9 SERDES1G Energy Efficient Ethernet 4.2.10 SERDES1G Data Inversion 4.3 SERDES6G 4.3.1 SERDES6G Basic Configuration 4.3.2 SERDES6G Loopback Modes 4.3.3 Synchronous Ethernet 4.3.4 SERDES6G Deserializer Configuration 4.3.5 SERDES6G Serializer Configuration 4.3.6 SERDES6G Input Buffer Configuration 4.3.7 SERDES6G Output Buffer Configuration 4.3.8 SERDES6G Clock and Data Recovery (CDR) in 100BASE-FX 4.3.9 SERDES6G Energy Efficient Ethernet 4.3.10 SERDES6G Data Inversion 4.3.11 SERDES6G Signal Detection Enhancements 4.3.12 SERDES6G High-Speed I/O Configuration Bus 4.4 Copper Transceivers 4.4.1 Register Access 4.4.2 Cat5 Twisted Pair Media Interface 4.4.3 LED Interface 4.4.4 Ethernet Inline Powered Devices 4.4.5 IEEE 802.3af PoE Support 4.4.6 ActiPHY™ Power Management 4.4.7 Testing Features 4.4.8 VeriPHY Cable Diagnostics 4.5 Statistics 4.6 Classifier 4.6.1 General Data Extraction Setup 4.6.2 Frame Acceptance Filtering 4.6.3 QoS, DP, and DSCP Classification 4.6.4 VLAN Classification 4.6.5 Link Aggregation Code Generation 4.6.6 CPU Forwarding Determination 4.7 VCAP-II 4.7.1 Port Configuration 4.7.2 VCAP IS1 4.7.3 VCAP IS2 4.7.4 VCAP ES0 4.7.5 Range Checkers 4.7.6 VCAP-II Configuration 4.7.7 Advanced VCAP Operations 4.8 Analyzer 4.8.1 MAC Table 4.8.2 VLAN Table 4.8.3 Forwarding Engine 4.8.4 Analyzer Monitoring 4.9 Policers and Ingress Shapers 4.9.1 Policers 4.9.2 Ingress Shapers 4.10 Shared Queue System 4.10.1 Buffer Management 4.10.2 Frame Reference Management 4.10.3 Resource Depletion Condition 4.10.4 Configuration Example 4.10.5 Watermark Programming and Consumption Monitoring 4.10.6 Advanced Resource Management 4.10.7 Ingress Pause Request Generation 4.10.8 Tail Dropping 4.10.9 Test Utilities 4.10.10 Energy Efficient Ethernet 4.11 Scheduler and Shaper 4.11.1 Egress Shapers 4.11.2 Deficit Weighted Round Robin 4.11.3 Shaping and DWRR Scheduling Examples 4.12 Rewriter 4.12.1 VLAN Editing 4.12.2 DSCP Remarking 4.12.3 FCS Updating 4.12.4 CPU Extraction Header Insertion 4.13 CPU Port Module 4.13.1 Frame Extraction 4.13.2 Frame Injection 4.13.3 Network Processor Interface (NPI) 4.14 Layer-1 Timing 4.15 Hardware Timestamping 4.15.1 Timestamp Classification 4.15.2 One-Second Timer 4.15.3 Delay Timer 4.15.4 Time of Day Counter 4.16 Clocking and Reset 5 VCore-III System and CPU Interface 5.1 VCore-III Configurations 5.2 Clocking and Reset 5.2.1 Watchdog Timer 5.3 Shared Bus 5.3.1 Shared Bus Arbitration 5.3.2 SI Memory Region 5.3.3 PI Memory Region 5.3.4 Device-Paced Mode 5.3.5 DDR2 Memory Region 5.3.6 Switch Core Registers Memory Region 5.3.7 VCore-III Registers Memory Region 5.4 VCore-III CPU 5.4.1 Big Endian Support 5.4.2 Software Debug and Development 5.5 Manual Frame Injection and Extraction 5.5.1 Manual Frame Extraction 5.5.2 Manual Frame Injection 5.5.3 Frame Interrupts 5.6 Frame DMA 5.6.1 DMA Control Block Structures 5.6.2 Extraction 5.6.3 Injection 5.6.4 Frame DMA Interrupt 5.7 External CPU Support 5.7.1 Register Access and Multimaster Systems 5.7.2 Serial Interface in Slave Mode 5.7.3 Parallel Interface in Slave Mode 5.7.4 MIIM Interface in Slave Mode 5.7.5 Access to the VCore-III Shared Bus 5.7.6 Mailbox and Semaphores 5.8 VCore-III System Peripherals 5.8.1 Timers 5.8.2 UART 5.8.3 Two-Wire Serial Interface 5.8.4 MII Management Controller 5.8.5 GPIO Controller 5.8.6 Serial GPIO Controller 5.8.7 FAN Controller 5.8.8 Interrupt Controller 6 Features 6.1 Port Mapping 6.1.1 Port Mapping 6.2 Switch Control 6.2.1 Switch Initialization 6.3 Port Module Control 6.3.1 MAC Configuration Port Mode Control 6.3.2 SerDes Configuration Port Mode Control 6.3.3 Port Reset Procedure 6.3.4 Port Counters 6.4 Layer-2 Switch 6.4.1 Basic Switching 6.4.2 Standard VLAN Operation 6.4.3 Provider Bridges and Q-in-Q Operation 6.4.4 Private VLANs 6.4.5 Asymmetric VLANs 6.4.6 Spanning Tree Protocols 6.4.7 IEEE 802.1X: Network Access Control 6.4.8 Link Aggregation 6.4.9 Simple Network Management Protocol (SNMP) 6.4.10 Mirroring 6.5 IGMP and MLD Snooping 6.5.1 IGMP and MLD Snooping Configuration 6.5.2 IP Multicast Forwarding Configuration 6.6 Quality of Service (QoS) 6.6.1 Basic QoS Configuration 6.6.2 IPv4 and IPv6 DSCP Remarking 6.6.3 Voice over IP (VoIP) 6.7 VCAP Applications 6.7.1 Notation for Control Lists Entries 6.7.2 Ingress Control Lists 6.7.3 Access Control Lists 6.7.4 Source IP Filter (SIP Filter) 6.7.5 DHCP Application 6.7.6 ARP Filtering 6.7.7 Ping Policing 6.7.8 TCP SYN Policing 6.8 CPU Extraction and Injection 6.8.1 Forwarding to CPU 6.8.2 Frame Extraction 6.8.3 Frame Injection 6.8.4 Frame Extraction and Injection Using An External CPU 6.9 Audio Video Bridging 6.10 Energy Efficient Ethernet 6.11 Carrier Ethernet Overview 6.11.1 Customer Bridge and Provider Bridge 6.11.2 MEF Services 6.11.3 MEF Bandwidth Profiles 6.11.4 MEF Service Attributes 6.11.5 Service Concept 6.11.6 Service Examples 6.11.7 Quality of Service Delivery 6.11.8 OAM and Protection Switching 6.11.9 Synchronous Ethernet Operation 6.11.10 IEEE 1588 Operation 7 Registers 7.1 Targets and Base Addresses 7.2 DEVCPU_ORG 7.2.1 DEVCPU_ORG:ORG 7.3 SYS 7.3.1 SYS:SYSTEM 7.3.2 SYS:SCH 7.3.3 SYS:SCH_LB 7.3.4 SYS:RES_CTRL 7.3.5 SYS:PAUSE_CFG 7.3.6 SYS:MMGT 7.3.7 SYS:MISC 7.3.8 SYS:STAT 7.3.9 SYS:PTP 7.3.10 SYS:POL 7.3.11 SYS:POL_MISC 7.3.12 SYS:ISHP 7.4 ANA 7.4.1 ANA:ANA 7.4.2 ANA:ANA_TABLES 7.4.3 ANA:PORT 7.4.4 ANA:COMMON 7.5 REW 7.5.1 REW:PORT 7.5.2 REW:COMMON 7.6 VCAP_CORE 7.6.1 VCAP_CORE:VCAP_CORE_CFG 7.6.2 VCAP_CORE:VCAP_CORE_CACHE 7.6.3 VCAP_CORE:VCAP_CORE_STICKY 7.6.4 VCAP_CORE:VCAP_CONST 7.6.5 VCAP_CORE:TCAM_BIST 7.7 VCAP_CORE 7.7.1 VCAP_CORE:VCAP_CORE_CFG 7.7.2 VCAP_CORE:VCAP_CORE_CACHE 7.7.3 VCAP_CORE:VCAP_CORE_STICKY 7.7.4 VCAP_CORE:VCAP_CONST 7.7.5 VCAP_CORE:TCAM_BIST 7.8 VCAP_CORE 7.8.1 VCAP_CORE:VCAP_CORE_CFG 7.8.2 VCAP_CORE:VCAP_CORE_CACHE 7.8.3 VCAP_CORE:VCAP_CORE_STICKY 7.8.4 VCAP_CORE:VCAP_CONST 7.8.5 VCAP_CORE:TCAM_BIST 7.9 DEVCPU_GCB 7.9.1 DEVCPU_GCB:CHIP_REGS 7.9.2 DEVCPU_GCB:SW_REGS 7.9.3 DEVCPU_GCB:VCORE_ACCESS 7.9.4 DEVCPU_GCB:GPIO 7.9.5 DEVCPU_GCB:DEVCPU_RST_REGS 7.9.6 DEVCPU_GCB:MIIM 7.9.7 DEVCPU_GCB:MIIM_READ_SCAN 7.9.8 DEVCPU_GCB:RAM_STAT 7.9.9 DEVCPU_GCB:MISC 7.9.10 DEVCPU_GCB:SIO_CTRL 7.9.11 DEVCPU_GCB:FAN_CFG 7.9.12 DEVCPU_GCB:FAN_STAT 7.9.13 DEVCPU_GCB:PTP_CFG 7.9.14 DEVCPU_GCB:PTP_STAT 7.9.15 DEVCPU_GCB:PTP_TIMERS 7.9.16 DEVCPU_GCB:MEMITGR 7.10 DEVCPU_QS 7.10.1 DEVCPU_QS:XTR 7.10.2 DEVCPU_QS:INJ 7.11 DEVCPU_PI 7.11.1 DEVCPU_PI:PI 7.12 HSIO 7.12.1 HSIO:PLL5G_CFG 7.12.2 HSIO:PLL5G_STATUS 7.12.3 HSIO:RCOMP_STATUS 7.12.4 HSIO:SYNC_ETH_CFG 7.12.5 HSIO:SERDES1G_ANA_CFG 7.12.6 HSIO:SERDES1G_DIG_CFG 7.12.7 HSIO:SERDES1G_DIG_STATUS 7.12.8 HSIO:MCB_SERDES1G_CFG 7.12.9 HSIO:SERDES6G_ANA_CFG 7.12.10 HSIO:SERDES6G_DIG_CFG 7.12.11 HSIO:MCB_SERDES6G_CFG 7.13 DEV_GMII 7.13.1 DEV_GMII:PORT_MODE 7.13.2 DEV_GMII:MAC_CFG_STATUS 7.14 DEV 7.14.1 DEV:DEV_CFG_STATUS 7.14.2 DEV:PORT_MODE 7.14.3 DEV:MAC_CFG_STATUS 7.14.4 DEV:PCS1G_CFG_STATUS 7.14.5 DEV:PCS1G_TSTPAT_CFG_STATUS 7.14.6 DEV:PCS_FX100_CONFIGURATION 7.14.7 DEV:PCS_FX100_STATUS 7.15 ICPU_CFG 7.15.1 ICPU_CFG:CPU_SYSTEM_CTRL 7.15.2 ICPU_CFG:PI_MST 7.15.3 ICPU_CFG:SPI_MST 7.15.4 ICPU_CFG:INTR 7.15.5 ICPU_CFG:GPDMA 7.15.6 ICPU_CFG:INJ_FRM_SPC 7.15.7 ICPU_CFG:TIMERS 7.15.8 ICPU_CFG:MEMCTRL 7.15.9 ICPU_CFG:TWI_DELAY 7.16 UART 7.16.1 UART:UART 7.17 TWI 7.17.1 TWI:TWI 7.18 SBA 7.18.1 SBA:SBA 7.19 GPDMA 7.19.1 GPDMA:CH 7.19.2 GPDMA:INTR 7.19.3 GPDMA:MISC 7.20 PHY 7.20.1 PHY:PHY_STD 7.20.2 PHY:PHY_EXT1 7.20.3 PHY:PHY_EXT2 7.20.4 PHY:PHY_GP 7.20.5 PHY:PHY_EEE 8 Electrical Specifications 8.1 DC Characteristics 8.1.1 Internal Pull-Up or Pull-Down Resistors 8.1.2 Reference Clock 8.1.3 DDR2 SDRAM Interface 8.1.4 SGMII DC Definitions and Test Circuits 8.1.5 Enhanced SerDes Interface 8.1.6 SerDes (SGMII) Interface 8.1.7 MIIM, GPIO, SI, JTAG, and Miscellaneous Signals 8.1.8 Thermal Diode 8.2 AC Characteristics 8.2.1 Reference Clock 8.2.2 Reset Timing 8.2.3 DDR2 SDRAM Signal 8.2.4 Enhanced SerDes Interface 8.2.5 SerDes (SGMII) Interface 8.2.6 MII Management 8.2.7 Serial CPU Interface (SI) Master Mode 8.2.8 Serial CPU Interface (SI) for Slave Mode 8.2.9 Parallel Interface (PI) Master Mode 8.2.10 Parallel Interface (PI) Slave Mode 8.2.11 JTAG Interface 8.2.12 Serial Inputs/Outputs 8.2.13 Recovered Clock Outputs 8.2.14 Two-Wire Serial Interface 8.2.15 IEEE 1588 Time Tick Output 8.3 Current and Power Consumption 8.3.1 Current Consumption 8.3.2 Power Consumption 8.3.3 Power Supply Sequencing 8.4 Operating Conditions 8.5 Stress Ratings 9 Pin Descriptions 9.1 Pin Diagram 9.2 Pins by Function 9.2.1 Analog Bias Signals 9.2.2 DDR2 SDRAM Interface 9.2.3 General-Purpose I/O 9.2.4 JTAG Interface 9.2.5 MII Management Interface 9.2.6 Miscellaneous Signals 9.2.7 Parallel Interface 9.2.8 Power Supplies and Ground 9.2.9 Serial CPU Interface 9.2.10 SerDes Interface 9.2.11 Enhanced SerDes Interface 9.2.12 System Clock Interface 9.2.13 Twisted Pair Interface 9.3 Pins by Number 9.4 Pins by Name 10 Package Information 10.1 Package Drawing 10.2 Thermal Specifications 10.3 Moisture Sensitivity 11 Design Guidelines 11.1 Power Supplies 11.2 Power Supply Decoupling 11.3 Reference Clock 11.3.1 Single-Ended RefClk Input 11.4 Interfaces 11.4.1 General Recommendations 11.4.2 SGMII Interface 11.4.3 Parallel Interface 11.4.4 Serial Interface 11.4.5 Enhanced SerDes Interface 11.4.6 Two-Wire Serial Interface 11.4.7 DDR2 SDRAM Interface 11.4.8 Thermal Diode External Connection 12 Design Considerations 12.1 10BASE-T Mode Unable to Re-establish Link 12.2 Software Script for Link Performance 12.3 10BASE-T Signal Amplitude 12.4 Clause 45 Register 7.60 12.5 Clause 45 Register 3.22 12.6 Clause 45 Register 3.1 12.7 Clause 45 Register Address Post-Increment 12.8 IEEE1588 Out of Sync Situation 12.8.1 Copper Port (internal CuPHY 10-11 and External PHYs Without Timestamping) 12.8.2 Serdes Port (SFP) 13 Ordering Information