Datasheet LTM4663 (Analog Devices) - 2
| Manufacturer | Analog Devices |
| Description | Ultrathin 1.5A µModule Thermoelectric Cooler (TEC) Regulator |
| Pages / Page | 22 / 2 — ABSOLUTE MAXIMUM RATINGS. PIN CONFIGURATION. (Note 1). ORDER INFORMATION. … |
| File Format / Size | PDF / 2.1 Mb |
| Document Language | English |
ABSOLUTE MAXIMUM RATINGS. PIN CONFIGURATION. (Note 1). ORDER INFORMATION. PART MARKING*. PACKAGE. MSL. TEMPERATURE RANGE. PART NUMBER
Model Line for this Datasheet
Text Version of Document
LTM4663
ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION (Note 1)
TOP VIEW PVIN, SVIN ... –0.3V to 5.75V 1 2 3 4 5 VLDR, VPWM .. –0.3V to PVIN T GNDP SW PV FB, TSET, PAMPN, SFB, IN VLDR GNDL A VLIM/SD, ILIM, EN/SY .. –0.3V to SVIN VPWM SW PVIN VLDR GNDL TAMPOUT, PAMPOUT, ITEC, VTEC ... –0.3V to 5.75V B VREF ... –0.3V to 3V SFB VTEC ITEC TFB TAMPOUT Operating Junction Temperature C (Note 2) .. –40°C to 125°C GNDA EN/SY PAMPOUT PAMPN NC D Storage Temperature Range .. –55°C to 125°C VREF SVIN ILIM VLIM/SD TSET Peak Solder Reflow Body Temperature ...260°C E LGA PACKAGE 25-LEAD (3.5mm × 4mm × 1.3mm) TJMAX = 125°C, θJCtop = 34°C/W , θJCbottom = 12°C/W, θJA = 36°C/W WEIGHT = 60mg NOTES: 1) θJC VALUES ARE DETERMINED BY SIMULATION PER JESD51 CONDITIONS. 2) θJA VALUE IS OBTAINED WITH DEMO BOARD. 3) REFER TO PAGES 16, 17 FOR LAB MEASUREMENT AND DE-RATING INFORMATION.
ORDER INFORMATION PART MARKING* PACKAGE MSL TEMPERATURE RANGE PART NUMBER PAD FINISH DEVICE FINISH CODE TYPE RATING (SEE NOTE 2)
LTM4663EV#PBF –40°C to 125°C Au (RoHS) 4663V v LGA 3 LTM4663IV#PBF –40°C to 125°C • Contact the factory for parts specified with wider operating temperature • Recommended LGA Assembly and Manufacturing Procedures ranges. *Pad finish code is per IPC/JEDEC J-STD-609. • LGA Package and Tray Drawings
ELECTRICAL CHARACTERISTICS The
l
denotes the specifications which apply over the specified operating temperature range, otherwise specifications are at TA = 25°C (Note 2), PVIN = SVIN = 5V, per the typical application. SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
PVIN Power Input Voltage l 2.7 5.5 V SVIN Signal Input Voltage l 2.7 5.5 V IQ(SVIN) Input Supply Bias Current PWM Not Switching 3.8 5.5 mA Shutdown, EN/SY = GND 480 700 µA UVLO Undervoltage Lockout SVIN Rising 2.45 2.55 2.65 V UVLO_HYS UVLO Hysteresis 80 mV VREF Reference Voltage 2.475 2.5 2.525 V VTEC Max TEC Differential Voltage No Load l 93% • PVIN V ITEC Max TEC Current l 1.5 A ISFB SFB Bias Current (Note 3) 1 µA tSS Soft-Start Time 150 ms VLIM/SD Shutdown Voltage Threshold 0.07 V Rev. 0 2 For more information www.analog.com Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Electrical Characteristics Pin Configuration Typical Performance Characteristics Pin Functions Block Diagram Decoupling Requirements Operation Applications Information Typical Applications Package Description Package Photo Package Description Design Resources Related Parts
ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION (Note 1)
TOP VIEW PVIN, SVIN ... –0.3V to 5.75V 1 2 3 4 5 VLDR, VPWM .. –0.3V to PVIN T GNDP SW PV FB, TSET, PAMPN, SFB, IN VLDR GNDL A VLIM/SD, ILIM, EN/SY .. –0.3V to SVIN VPWM SW PVIN VLDR GNDL TAMPOUT, PAMPOUT, ITEC, VTEC ... –0.3V to 5.75V B VREF ... –0.3V to 3V SFB VTEC ITEC TFB TAMPOUT Operating Junction Temperature C (Note 2) .. –40°C to 125°C GNDA EN/SY PAMPOUT PAMPN NC D Storage Temperature Range .. –55°C to 125°C VREF SVIN ILIM VLIM/SD TSET Peak Solder Reflow Body Temperature ...260°C E LGA PACKAGE 25-LEAD (3.5mm × 4mm × 1.3mm) TJMAX = 125°C, θJCtop = 34°C/W , θJCbottom = 12°C/W, θJA = 36°C/W WEIGHT = 60mg NOTES: 1) θJC VALUES ARE DETERMINED BY SIMULATION PER JESD51 CONDITIONS. 2) θJA VALUE IS OBTAINED WITH DEMO BOARD. 3) REFER TO PAGES 16, 17 FOR LAB MEASUREMENT AND DE-RATING INFORMATION.
ORDER INFORMATION PART MARKING* PACKAGE MSL TEMPERATURE RANGE PART NUMBER PAD FINISH DEVICE FINISH CODE TYPE RATING (SEE NOTE 2)
LTM4663EV#PBF –40°C to 125°C Au (RoHS) 4663V v LGA 3 LTM4663IV#PBF –40°C to 125°C • Contact the factory for parts specified with wider operating temperature • Recommended LGA Assembly and Manufacturing Procedures ranges. *Pad finish code is per IPC/JEDEC J-STD-609. • LGA Package and Tray Drawings
ELECTRICAL CHARACTERISTICS The
l
denotes the specifications which apply over the specified operating temperature range, otherwise specifications are at TA = 25°C (Note 2), PVIN = SVIN = 5V, per the typical application. SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
PVIN Power Input Voltage l 2.7 5.5 V SVIN Signal Input Voltage l 2.7 5.5 V IQ(SVIN) Input Supply Bias Current PWM Not Switching 3.8 5.5 mA Shutdown, EN/SY = GND 480 700 µA UVLO Undervoltage Lockout SVIN Rising 2.45 2.55 2.65 V UVLO_HYS UVLO Hysteresis 80 mV VREF Reference Voltage 2.475 2.5 2.525 V VTEC Max TEC Differential Voltage No Load l 93% • PVIN V ITEC Max TEC Current l 1.5 A ISFB SFB Bias Current (Note 3) 1 µA tSS Soft-Start Time 150 ms VLIM/SD Shutdown Voltage Threshold 0.07 V Rev. 0 2 For more information www.analog.com Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Electrical Characteristics Pin Configuration Typical Performance Characteristics Pin Functions Block Diagram Decoupling Requirements Operation Applications Information Typical Applications Package Description Package Photo Package Description Design Resources Related Parts
