Datasheet ADCMP609 (Analog Devices) - 4
| Manufacturer | Analog Devices |
| Description | Rail-to-Rail, Fast, Low Power 2.5 V to 5.5 V, Single-Supply TTL/CMOS Comparator |
| Pages / Page | 12 / 4 — ADCMP609. Data Sheet. ABSOLUTE MAXIMUM RATINGS Table 2. Parameter. … |
| Revision | C |
| File Format / Size | PDF / 265 Kb |
| Document Language | English |
ADCMP609. Data Sheet. ABSOLUTE MAXIMUM RATINGS Table 2. Parameter. Rating. THERMAL RESISTANCE. Table 3. Package Type. θJA. Unit
Model Line for this Datasheet
Text Version of Document
ADCMP609 Data Sheet ABSOLUTE MAXIMUM RATINGS Table 2.
Stresses at or above those listed under Absolute Maximum
Parameter Rating
Ratings may cause permanent damage to the product. This is a Supply Voltages stress rating only; functional operation of the product at these Supply Voltage (VCC to Ground) −0.5 V to +6.0 V or any other conditions above those indicated in the operational Supply Differential −6.0 V to +6.0 V section of this specification is not implied. Operation beyond Input Voltages the maximum operating conditions for extended periods may Input Voltage −0.5 V to VCC + 0.5 V affect product reliability. Differential Input Voltage ±(VCC + 0.5 V) Maximum Input/Output Current ±50 mA
THERMAL RESISTANCE
Shutdown Pin Applied Voltage (SDN to Ground) −0.5 V to VCC + 0.5 V θJA is specified for the worst-case conditions, that is, a device Maximum Input/Output Current ±50 mA soldered in a circuit board for surface-mount packages. Hysteresis Control Pin
Table 3.
Applied Voltage (HYS to Ground) −0.5 V to VCC + 0.5 V
1
Maximum Input/Output Current ±50 mA
Package Type θJA Unit
Output Current ±50 mA ADCMP609 8-Lead MSOP 130 °C/W Operating Temperature 1 Measurement in still air. Ambient Temperature Range −40°C to +125°C Junction Temperature 150°C
ESD CAUTION
Storage Temperature Range −65°C to +150°C Rev. C | Page 4 of 12 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ELECTRICAL CHARACTERISTICS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS APPLICATIONS INFORMATION POWER/GROUND LAYOUT AND BYPASSING TTL-/CMOS-COMPATIBLE OUTPUT STAGE OPTIMIZING PERFORMANCE COMPARATOR PROPAGATION DELAY DISPERSION COMPARATOR HYSTERESIS CROSSOVER BIAS POINT MINIMUM INPUT SLEW RATE REQUIREMENT TYPICAL APPLICATIONS CIRCUITS OUTLINE DIMENSIONS ORDERING GUIDE
Stresses at or above those listed under Absolute Maximum
Parameter Rating
Ratings may cause permanent damage to the product. This is a Supply Voltages stress rating only; functional operation of the product at these Supply Voltage (VCC to Ground) −0.5 V to +6.0 V or any other conditions above those indicated in the operational Supply Differential −6.0 V to +6.0 V section of this specification is not implied. Operation beyond Input Voltages the maximum operating conditions for extended periods may Input Voltage −0.5 V to VCC + 0.5 V affect product reliability. Differential Input Voltage ±(VCC + 0.5 V) Maximum Input/Output Current ±50 mA
THERMAL RESISTANCE
Shutdown Pin Applied Voltage (SDN to Ground) −0.5 V to VCC + 0.5 V θJA is specified for the worst-case conditions, that is, a device Maximum Input/Output Current ±50 mA soldered in a circuit board for surface-mount packages. Hysteresis Control Pin
Table 3.
Applied Voltage (HYS to Ground) −0.5 V to VCC + 0.5 V
1
Maximum Input/Output Current ±50 mA
Package Type θJA Unit
Output Current ±50 mA ADCMP609 8-Lead MSOP 130 °C/W Operating Temperature 1 Measurement in still air. Ambient Temperature Range −40°C to +125°C Junction Temperature 150°C
ESD CAUTION
Storage Temperature Range −65°C to +150°C Rev. C | Page 4 of 12 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ELECTRICAL CHARACTERISTICS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS APPLICATIONS INFORMATION POWER/GROUND LAYOUT AND BYPASSING TTL-/CMOS-COMPATIBLE OUTPUT STAGE OPTIMIZING PERFORMANCE COMPARATOR PROPAGATION DELAY DISPERSION COMPARATOR HYSTERESIS CROSSOVER BIAS POINT MINIMUM INPUT SLEW RATE REQUIREMENT TYPICAL APPLICATIONS CIRCUITS OUTLINE DIMENSIONS ORDERING GUIDE
