Datasheet AD8099 (Analog Devices) - 24
| Manufacturer | Analog Devices |
| Description | Ultralow Distortion, High Speed 0.95nV/√Hz Voltage Noise Op Amp |
| Pages / Page | 26 / 24 — AD8099. Data Sheet. OUTLINE DIMENSIONS. 5.00. 2.29. 4.90 4.80. 0.356. … |
| Revision | E |
| File Format / Size | PDF / 581 Kb |
| Document Language | English |
AD8099. Data Sheet. OUTLINE DIMENSIONS. 5.00. 2.29. 4.90 4.80. 0.356. 6.20. 4.00. 6.00. 3.90. 5.80. 3.80. 0.457. FOR PROPER CONNECTION OF. 1.27 BSC
Model Line for this Datasheet
Text Version of Document
AD8099 Data Sheet OUTLINE DIMENSIONS 5.00 2.29 4.90 4.80 0.356 8 5 6.20 4.00 6.00 3.90 2.29 5.80 3.80 0.457 1 4 FOR PROPER CONNECTION OF 1.27 BSC BOTTOM VIEW THE EXPOSED PAD, REFER TO 3.81 REF THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TOP VIEW SECTION OF THIS DATA SHEET. 1.75 1.65 0.50 45° 1.35 1.25 0.25 0.25 0.17 0.10 MAX SEATING PLANE 0.05 NOM 8° 0.51 1.04 REF COPLANARITY 0° 1.27 0.31 0.10 0.40 B 1- 1 -20 -02 COMPLIANT TO JEDEC STANDARDS MS-012-A A 06
Figure 77. 8-Lead Standard Small Outline Package with Exposed Pad [SOIC_N_EP] Narrow Body (RD-8-1) Dimensions shown in millimeters
1.84 3.10 1.74 3.00 SQ 1.64 2.90 0.50 BSC 5 8 PIN 1 INDEX EXPOSED 1.55 AREA PAD 1.45 1.35 0.50 0.40 0.30 4 1 PIN 1 TOP VIEW BOTTOM VIEW INDICATOR (R 0.15) 0.80 FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO 0.75 0.05 MAX THE PIN CONFIGURATION AND 0.70 0.02 NOM FUNCTION DESCRIPTIONS COPLANARITY SECTION OF THIS DATA SHEET. SEATING 0.30 0.08 PLANE 0.25 0.203 REF 0.20 010-A COMPLIANT TO JEDEC STANDARDS MO-229-WEED 12-07-2
Figure 78. 8-Lead Lead Frame Chip Scale Package [LFCSP] 3 mm × 3 mm Body and 0.75 mm Package Height (CP-8-13) Dimensions shown in millimeters
ORDERING GUIDE Model1 Temperature Range Package Description Package Option Branding Ordering Quantity
AD8099ARDZ −40°C to +125°C 8-Lead SOIC_N_EP RD-8-1 98 AD8099ARDZ-REEL −40°C to +125°C 8-Lead SOIC_N_EP RD-8-1 2,500 AD8099ARDZ-REEL7 −40°C to +125°C 8-Lead SOIC_N_EP RD-8-1 1,000 AD8099ACPZ-R2 −40°C to +125°C 8-Lead LFCSP CP-8-13 HDB 250 AD8099ACPZ-REEL −40°C to +125°C 8-Lead LFCSP CP-8-13 HDB 5,000 AD8099ACPZ-REEL7 −40°C to +125°C 8-Lead LFCSP CP-8-13 HDB 1,500 1 Z = RoHS Compliant Part. Rev. E | Page 24 of 26 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION CONNECTION DIAGRAMS REVISION HISTORY SPECIFICATIONS SPECIFICATIONS WITH ±5 V SUPPLY SPECIFICATIONS WITH +5 V SUPPLY ABSOLUTE MAXIMUM RATINGS MAXIMUM POWER DISSIPATION ESD CAUTION TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION USING THE AD8099 CIRCUIT COMPONENTS RECOMMENDED VALUES CIRCUIT CONFIGURATIONS PERFORMANCE vs. COMPONENT VALUES TOTAL OUTPUT NOISE CALCULATIONS AND DESIGN INPUT BIAS CURRENT AND DC OFFSET PIN AND INPUT BIAS CANCELLATION 16-BIT ADC DRIVER CIRCUIT CONSIDERATIONS PCB Layout Parasitics Grounding Power Supply Bypassing Component Selection DESIGN TOOLS AND TECHNICAL SUPPORT OUTLINE DIMENSIONS ORDERING GUIDE
Figure 77. 8-Lead Standard Small Outline Package with Exposed Pad [SOIC_N_EP] Narrow Body (RD-8-1) Dimensions shown in millimeters
1.84 3.10 1.74 3.00 SQ 1.64 2.90 0.50 BSC 5 8 PIN 1 INDEX EXPOSED 1.55 AREA PAD 1.45 1.35 0.50 0.40 0.30 4 1 PIN 1 TOP VIEW BOTTOM VIEW INDICATOR (R 0.15) 0.80 FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO 0.75 0.05 MAX THE PIN CONFIGURATION AND 0.70 0.02 NOM FUNCTION DESCRIPTIONS COPLANARITY SECTION OF THIS DATA SHEET. SEATING 0.30 0.08 PLANE 0.25 0.203 REF 0.20 010-A COMPLIANT TO JEDEC STANDARDS MO-229-WEED 12-07-2
Figure 78. 8-Lead Lead Frame Chip Scale Package [LFCSP] 3 mm × 3 mm Body and 0.75 mm Package Height (CP-8-13) Dimensions shown in millimeters
ORDERING GUIDE Model1 Temperature Range Package Description Package Option Branding Ordering Quantity
AD8099ARDZ −40°C to +125°C 8-Lead SOIC_N_EP RD-8-1 98 AD8099ARDZ-REEL −40°C to +125°C 8-Lead SOIC_N_EP RD-8-1 2,500 AD8099ARDZ-REEL7 −40°C to +125°C 8-Lead SOIC_N_EP RD-8-1 1,000 AD8099ACPZ-R2 −40°C to +125°C 8-Lead LFCSP CP-8-13 HDB 250 AD8099ACPZ-REEL −40°C to +125°C 8-Lead LFCSP CP-8-13 HDB 5,000 AD8099ACPZ-REEL7 −40°C to +125°C 8-Lead LFCSP CP-8-13 HDB 1,500 1 Z = RoHS Compliant Part. Rev. E | Page 24 of 26 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION CONNECTION DIAGRAMS REVISION HISTORY SPECIFICATIONS SPECIFICATIONS WITH ±5 V SUPPLY SPECIFICATIONS WITH +5 V SUPPLY ABSOLUTE MAXIMUM RATINGS MAXIMUM POWER DISSIPATION ESD CAUTION TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION USING THE AD8099 CIRCUIT COMPONENTS RECOMMENDED VALUES CIRCUIT CONFIGURATIONS PERFORMANCE vs. COMPONENT VALUES TOTAL OUTPUT NOISE CALCULATIONS AND DESIGN INPUT BIAS CURRENT AND DC OFFSET PIN AND INPUT BIAS CANCELLATION 16-BIT ADC DRIVER CIRCUIT CONSIDERATIONS PCB Layout Parasitics Grounding Power Supply Bypassing Component Selection DESIGN TOOLS AND TECHNICAL SUPPORT OUTLINE DIMENSIONS ORDERING GUIDE
