Datasheet AD829 (Analog Devices) - 5
| Manufacturer | Analog Devices |
| Description | High Speed, Low Noise Video Op Amp |
| Pages / Page | 20 / 5 — Data Sheet. AD829. ABSOLUTE MAXIMUM RATINGS Table 2. METALLIZATION PHOTO. … |
| Revision | I |
| File Format / Size | PDF / 381 Kb |
| Document Language | English |
Data Sheet. AD829. ABSOLUTE MAXIMUM RATINGS Table 2. METALLIZATION PHOTO. Parameter. Rating. OFFSET NULL. +VS. –IN. OUTPUT. 0.054. (1.37)
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Data Sheet AD829 ABSOLUTE MAXIMUM RATINGS Table 2. METALLIZATION PHOTO Parameter Rating OFFSET NULL OFFSET NULL 1 8 +VS
Supply Voltage ±18 V
7
Internal Power Dissipation1 8-Lead PDIP (N) 1.3 W 8-Lead SOIC (R) 0.9 W
–IN 2
8-Lead CERDIP (Q) 1.3 W
OUTPUT 6
20-Terminal LCC (E) 0.8 W Differential Input Voltage
0.054
2 ±6 V
(1.37)
Output Short-Circuit Duration Indefinite
CCOMP 5
Storage Temperature Range
+IN
8-Lead CERDIP (Q) and 20-Terminal LCC (E) −65°C to +150°C
3 –VS
8-Lead PDIP (N) and 8-Lead SOIC (R) −65°C to +125°C
4
Operating Temperature Range AD829J 0°C to 70°C
0.067 (1.70)
003 AD829A −40°C to +125°C
SUBSTRATE CONNECTED TO +VS
00880- AD829S −55°C to +125°C Figure 3. Metallization Photo; Contact Factory for Latest Dimensions, Lead Temperature (Soldering, 60 sec) 300°C Dimensions Shown in Inches and (Millimeters)
2.5
1 Maximum internal power dissipation is specified so that TJ does not exceed 150°C at an ambient temperature of 25°C. 2 If the differential voltage exceeds 6 V, external series protection resistors
2.0 PDIP
should be added to limit the input current.
LCC
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress
1.5
rating only; functional operation of the device at these or any other conditions above those indicated in the operational
1.0 CERDIP
section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
SOIC
device reliability.
0.5 MAXIMUM POWER DISSIPATION (W) THERMAL CHARACTERISTICS
00880-004
0 –55 –45 –35 –25 –15 –5 5 15 25 35 45 55 65 75 85 95 105 115 125 Table 3. AMBIENT TEMPERATURE (
°
C) Package Type θJA Unit
Figure 4. Maximum Power Dissipation vs. Temperature 8-Lead PDIP (N) 100 (derates at 8.7 mW/°C) °C/W 8-Lead CERDIP (Q) 110 (derates at 8.7 mW/°C) °C/W 20-Lead LCC (E) 77 °C/W
ESD CAUTION
8-Lead SOIC (R) 125 (derates at 6 mW/°C) °C/W Rev. I | Page 5 of 20 Document Outline Features General Description Connection Diagram Product Highlights Revision History Specifications Absolute Maximum Ratings Thermal Characteristics Metallization Photo ESD Caution Typical Performance Characteristics Test Circuits Theory of Operation Externally Compensating the AD829 Shunt Compensation Current Feedback Compensation Low Error Video Line Driver High Gain Video Bandwidth, 3-Op-Amp Instrumentation Amplifier Outline Dimensions Ordering Guide
Data Sheet AD829 ABSOLUTE MAXIMUM RATINGS Table 2. METALLIZATION PHOTO Parameter Rating OFFSET NULL OFFSET NULL 1 8 +VS
Supply Voltage ±18 V
7
Internal Power Dissipation1 8-Lead PDIP (N) 1.3 W 8-Lead SOIC (R) 0.9 W
–IN 2
8-Lead CERDIP (Q) 1.3 W
OUTPUT 6
20-Terminal LCC (E) 0.8 W Differential Input Voltage
0.054
2 ±6 V
(1.37)
Output Short-Circuit Duration Indefinite
CCOMP 5
Storage Temperature Range
+IN
8-Lead CERDIP (Q) and 20-Terminal LCC (E) −65°C to +150°C
3 –VS
8-Lead PDIP (N) and 8-Lead SOIC (R) −65°C to +125°C
4
Operating Temperature Range AD829J 0°C to 70°C
0.067 (1.70)
003 AD829A −40°C to +125°C
SUBSTRATE CONNECTED TO +VS
00880- AD829S −55°C to +125°C Figure 3. Metallization Photo; Contact Factory for Latest Dimensions, Lead Temperature (Soldering, 60 sec) 300°C Dimensions Shown in Inches and (Millimeters)
2.5
1 Maximum internal power dissipation is specified so that TJ does not exceed 150°C at an ambient temperature of 25°C. 2 If the differential voltage exceeds 6 V, external series protection resistors
2.0 PDIP
should be added to limit the input current.
LCC
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress
1.5
rating only; functional operation of the device at these or any other conditions above those indicated in the operational
1.0 CERDIP
section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
SOIC
device reliability.
0.5 MAXIMUM POWER DISSIPATION (W) THERMAL CHARACTERISTICS
00880-004
0 –55 –45 –35 –25 –15 –5 5 15 25 35 45 55 65 75 85 95 105 115 125 Table 3. AMBIENT TEMPERATURE (
°
C) Package Type θJA Unit
Figure 4. Maximum Power Dissipation vs. Temperature 8-Lead PDIP (N) 100 (derates at 8.7 mW/°C) °C/W 8-Lead CERDIP (Q) 110 (derates at 8.7 mW/°C) °C/W 20-Lead LCC (E) 77 °C/W
ESD CAUTION
8-Lead SOIC (R) 125 (derates at 6 mW/°C) °C/W Rev. I | Page 5 of 20 Document Outline Features General Description Connection Diagram Product Highlights Revision History Specifications Absolute Maximum Ratings Thermal Characteristics Metallization Photo ESD Caution Typical Performance Characteristics Test Circuits Theory of Operation Externally Compensating the AD829 Shunt Compensation Current Feedback Compensation Low Error Video Line Driver High Gain Video Bandwidth, 3-Op-Amp Instrumentation Amplifier Outline Dimensions Ordering Guide
