Datasheet ADP1872, ADP1873 (Analog Devices) - 5
| Manufacturer | Analog Devices |
| Description | Synchronous Current-Mode with Constant On-Time, PWM Buck Controller |
| Pages / Page | 40 / 5 — Data Sheet. ADP1872/ADP1873. ABSOLUTE MAXIMUM RATINGS Table 2. Parameter. … |
| Revision | B |
| File Format / Size | PDF / 1.7 Mb |
| Document Language | English |
Data Sheet. ADP1872/ADP1873. ABSOLUTE MAXIMUM RATINGS Table 2. Parameter. Rating. THERMAL RESISTANCE. Table 3. Thermal Resistance
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Data Sheet ADP1872/ADP1873 ABSOLUTE MAXIMUM RATINGS Table 2.
Absolute maximum ratings apply individually only, not in combination. Unless otherwise specified, all other voltages are
Parameter Rating
referenced to PGND. VDD to GND −0.3 V to +6 V VIN to PGND −0.3 V to +28 V
THERMAL RESISTANCE
FB, COMP/EN to GND −0.3 V to (VDD + 0.3 V) θJA is specified for the worst-case conditions, that is, a device DRVL to PGND −0.3 V to (VDD + 0.3 V) soldered in a circuit board for surface-mount packages. SW to PGND −0.3 V to +28 V SW to PGND −2 V pulse (20 ns)
Table 3. Thermal Resistance
BST to SW −0.6 V to (VDD + 0.3 V)
Package Type θJA Unit
BST to PGND −0.3 V to +28 V θJA (10-Lead MSOP) DRVH to SW −0.3 V to VDD 2-Layer Board 213.1 °C/W PGND to GND ±0.3 V 4-Layer Board 171.7 °C/W Operating Junction Temperature −40°C to +125°C Range Storage Temperature Range −65°C to +150°C
BOUNDARY CONDITION
Soldering Conditions JEDEC J-STD-020 In determining the values given in Table 2 and Table 3, natural Maximum Soldering Lead 300°C convection was used to transfer heat to a 4-layer evaluation board. Temperature (10 sec) Stresses above those listed under Absolute Maximum Ratings
ESD CAUTION
may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Rev. B | Page 5 of 40 Document Outline Features Applications Typical Applications Circuit General Description Revision History Specifications Absolute Maximum Ratings Thermal Resistance Boundary Condition ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics ADP1872/ADP1873 Block Digram Theory of Operation Startup Soft Start Precision Enable Circuitry Undervoltage Lockout Thermal Shutdown Programming Resistor (RES) Detect Circuit Valley Current-Limit Setting Hiccup Mode During Short Circuit Synchronous Rectifier Power Saving Mode (PSM) Version (ADP1873) Timer Operation Pseudo-Fixed Frequency Applications Information Feedback Resistor Divider Inductor Selection Output Ripple Voltage (ΔVRR) Output Capacitor Selection Compensation Network Output Filter Impedance (ZFILT) Error Amplifier Output Impedance (ZCOMP) Error Amplifier Gain (GM) Current-Sense Loop Gain (GCS) Crossover Frequency Efficiency Consideration Channel Conduction Loss MOSFET Driver Loss MOSFET Switching Loss Body Diode Conduction Loss Inductor Loss Input Capacitor Selection Thermal Considerations Design Example Input Capacitor Inductor Current Limit Programming Output Capacitor Feedback Resistor Network Setup Compensation Network Loss Calculations External Component Recommendations Layout Considerations IC Section (Left Side of Evaluation Board) Power Section Differential Sensing Typical Application Circuits Dual-Input, 300 kHz High Current Application Circuit Single-Input, 600 kHz Application Circuit Dual-Input, 300 kHz High Current Application Circuit Outline Dimensions Ordering Guide
Data Sheet ADP1872/ADP1873 ABSOLUTE MAXIMUM RATINGS Table 2.
Absolute maximum ratings apply individually only, not in combination. Unless otherwise specified, all other voltages are
Parameter Rating
referenced to PGND. VDD to GND −0.3 V to +6 V VIN to PGND −0.3 V to +28 V
THERMAL RESISTANCE
FB, COMP/EN to GND −0.3 V to (VDD + 0.3 V) θJA is specified for the worst-case conditions, that is, a device DRVL to PGND −0.3 V to (VDD + 0.3 V) soldered in a circuit board for surface-mount packages. SW to PGND −0.3 V to +28 V SW to PGND −2 V pulse (20 ns)
Table 3. Thermal Resistance
BST to SW −0.6 V to (VDD + 0.3 V)
Package Type θJA Unit
BST to PGND −0.3 V to +28 V θJA (10-Lead MSOP) DRVH to SW −0.3 V to VDD 2-Layer Board 213.1 °C/W PGND to GND ±0.3 V 4-Layer Board 171.7 °C/W Operating Junction Temperature −40°C to +125°C Range Storage Temperature Range −65°C to +150°C
BOUNDARY CONDITION
Soldering Conditions JEDEC J-STD-020 In determining the values given in Table 2 and Table 3, natural Maximum Soldering Lead 300°C convection was used to transfer heat to a 4-layer evaluation board. Temperature (10 sec) Stresses above those listed under Absolute Maximum Ratings
ESD CAUTION
may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Rev. B | Page 5 of 40 Document Outline Features Applications Typical Applications Circuit General Description Revision History Specifications Absolute Maximum Ratings Thermal Resistance Boundary Condition ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics ADP1872/ADP1873 Block Digram Theory of Operation Startup Soft Start Precision Enable Circuitry Undervoltage Lockout Thermal Shutdown Programming Resistor (RES) Detect Circuit Valley Current-Limit Setting Hiccup Mode During Short Circuit Synchronous Rectifier Power Saving Mode (PSM) Version (ADP1873) Timer Operation Pseudo-Fixed Frequency Applications Information Feedback Resistor Divider Inductor Selection Output Ripple Voltage (ΔVRR) Output Capacitor Selection Compensation Network Output Filter Impedance (ZFILT) Error Amplifier Output Impedance (ZCOMP) Error Amplifier Gain (GM) Current-Sense Loop Gain (GCS) Crossover Frequency Efficiency Consideration Channel Conduction Loss MOSFET Driver Loss MOSFET Switching Loss Body Diode Conduction Loss Inductor Loss Input Capacitor Selection Thermal Considerations Design Example Input Capacitor Inductor Current Limit Programming Output Capacitor Feedback Resistor Network Setup Compensation Network Loss Calculations External Component Recommendations Layout Considerations IC Section (Left Side of Evaluation Board) Power Section Differential Sensing Typical Application Circuits Dual-Input, 300 kHz High Current Application Circuit Single-Input, 600 kHz Application Circuit Dual-Input, 300 kHz High Current Application Circuit Outline Dimensions Ordering Guide
