Datasheet LM73100 (Texas Instruments) - 4
| Manufacturer | Texas Instruments |
| Description | 2.7 -23 V, 5.5 A Integrated Ideal Diode with Input Reverse Polarity and Overvoltage Protection |
| Pages / Page | 52 / 4 — LM7310. www.ti.com. 6 Specifications 6.1 Absolute Maximum Ratings. … |
| File Format / Size | PDF / 5.1 Mb |
| Document Language | English |
LM7310. www.ti.com. 6 Specifications 6.1 Absolute Maximum Ratings. Parameter. Pin. MIN. MAX. UNIT. 6.2 ESD Ratings. VALUE
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LM7310
SNOSDC0A – OCTOBER 2020 – REVISED DECEMBER 2020
www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
Parameter Pin MIN MAX UNIT
max (–15, V Maximum Input Voltage Range, –40 ℃ ≤ T OUT - J ≤ 125 ℃ 28 V 21) VIN IN Maximum Input Voltage Range, –10 ℃ ≤ TJ ≤ 125 ℃ max (–15, VOUT - 28 V 22) Maximum Output Voltage Range, –40 ℃ ≤ TJ ≤ 125 ℃ –0.3 min (28, VIN + 21) VOUT OUT Maximum Output Voltage Range, –10 ℃ ≤ TJ ≤ 125 ℃ –0.3 min (28, VIN + 22) VOUT,PLS Minimum Output Voltage Pulse (< 1 µs) OUT –0.8 VEN/UVLO Maximum Enable Pin Voltage Range (2) EN/UVLO –0.3 6.5 V VOVLO Maximum OVLO Pin Voltage Range (2) OVLO –0.3 6.5 V VdVdT Maximum dVdT Pin Voltage Range dVdt Internally Limited V VPGTH Maximum PGTH Pin Voltage Range (2) PGTH –0.3 6.5 V VPG Maximum PG Pin Voltage Range PG –0.3 6.5 V VIMON Maximum IMON Pin Voltage Range IMON 1.8 V IMAX Maximum Continuous Switch Current IN to OUT 5.5 A TJ Junction temperature Internally Limited °C TLEAD Maximum Lead Temperature 300 °C TSTG Storage temperature –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) If this pin has a pull-up up to VIN, it is recommended to use a resistance of 350 kΩ or higher to limit the current under conditions where IN can be exposed to reverse polarity.
6.2 ESD Ratings VALUE UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±2000 V(ESD) Electrostatic discharge V Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) ±500 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process precautions. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 4 Submit Document Feedback Copyright © 2020 Texas Instruments Incorporated Product Folder Links: LM7310 Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Revision History 5 Pin Configuration and Functions 6 Specifications 6.1 Absolute Maximum Ratings 6.2 ESD Ratings 6.3 Recommended Operating Conditions 6.4 Thermal Information 6.5 Electrical Characteristics 6.6 Timing Requirements 6.7 Switching Characteristics 6.8 Typical Characteristics 7 Detailed Description 7.1 Overview 7.2 Functional Block Diagram 7.3 Feature Description 7.3.1 Input Reverse Polarity Protection 7.3.2 Undervoltage Protection (UVLO & UVP) 7.3.3 Overvoltage Lockout (OVLO) 7.3.4 Inrush Current control and Fast-trip 7.3.4.1 Slew Rate (dVdt) and Inrush Current Control 7.3.4.2 Fast-Trip During Steady State 7.3.5 Analog Load Current Monitor Output 7.3.6 Reverse Current Protection 7.3.7 Overtemperature Protection (OTP) 7.3.8 Fault Response 7.3.9 Power Good Indication (PG) 7.4 Device Functional Modes 8 Application and Implementation 8.1 Application Information 8.2 Single Device, Self-Controlled 8.2.1 Typical Application 8.2.1.1 Design Requirements 8.2.1.2 Detailed Design Procedure 8.2.1.2.1 Setting Undervoltage and Overvoltage Thresholds 8.2.1.2.2 Setting Output Voltage Rise Time (tR) 8.2.1.2.3 Setting Power Good Assertion Threshold 8.2.1.2.4 Setting Analog Current Monitor Voltage (IMON) Range 8.2.1.3 Application Curves 8.3 Active ORing 8.4 Priority Power MUXing 8.5 USB PD Port Protection 8.6 Parallel Operation 9 Power Supply Recommendations 9.1 Transient Protection 10 Layout 10.1 Layout Guidelines 10.2 Layout Example 11 Device and Documentation Support 11.1 Documentation Support 11.1.1 Related Documentation 11.2 Receiving Notification of Documentation Updates 11.3 Support Resources 11.4 Trademarks 11.5 Electrostatic Discharge Caution 11.6 Glossary 12 Mechanical, Packaging, and Orderable Information
LM7310
SNOSDC0A – OCTOBER 2020 – REVISED DECEMBER 2020
www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
Parameter Pin MIN MAX UNIT
max (–15, V Maximum Input Voltage Range, –40 ℃ ≤ T OUT - J ≤ 125 ℃ 28 V 21) VIN IN Maximum Input Voltage Range, –10 ℃ ≤ TJ ≤ 125 ℃ max (–15, VOUT - 28 V 22) Maximum Output Voltage Range, –40 ℃ ≤ TJ ≤ 125 ℃ –0.3 min (28, VIN + 21) VOUT OUT Maximum Output Voltage Range, –10 ℃ ≤ TJ ≤ 125 ℃ –0.3 min (28, VIN + 22) VOUT,PLS Minimum Output Voltage Pulse (< 1 µs) OUT –0.8 VEN/UVLO Maximum Enable Pin Voltage Range (2) EN/UVLO –0.3 6.5 V VOVLO Maximum OVLO Pin Voltage Range (2) OVLO –0.3 6.5 V VdVdT Maximum dVdT Pin Voltage Range dVdt Internally Limited V VPGTH Maximum PGTH Pin Voltage Range (2) PGTH –0.3 6.5 V VPG Maximum PG Pin Voltage Range PG –0.3 6.5 V VIMON Maximum IMON Pin Voltage Range IMON 1.8 V IMAX Maximum Continuous Switch Current IN to OUT 5.5 A TJ Junction temperature Internally Limited °C TLEAD Maximum Lead Temperature 300 °C TSTG Storage temperature –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) If this pin has a pull-up up to VIN, it is recommended to use a resistance of 350 kΩ or higher to limit the current under conditions where IN can be exposed to reverse polarity.
6.2 ESD Ratings VALUE UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±2000 V(ESD) Electrostatic discharge V Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) ±500 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process precautions. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 4 Submit Document Feedback Copyright © 2020 Texas Instruments Incorporated Product Folder Links: LM7310 Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Revision History 5 Pin Configuration and Functions 6 Specifications 6.1 Absolute Maximum Ratings 6.2 ESD Ratings 6.3 Recommended Operating Conditions 6.4 Thermal Information 6.5 Electrical Characteristics 6.6 Timing Requirements 6.7 Switching Characteristics 6.8 Typical Characteristics 7 Detailed Description 7.1 Overview 7.2 Functional Block Diagram 7.3 Feature Description 7.3.1 Input Reverse Polarity Protection 7.3.2 Undervoltage Protection (UVLO & UVP) 7.3.3 Overvoltage Lockout (OVLO) 7.3.4 Inrush Current control and Fast-trip 7.3.4.1 Slew Rate (dVdt) and Inrush Current Control 7.3.4.2 Fast-Trip During Steady State 7.3.5 Analog Load Current Monitor Output 7.3.6 Reverse Current Protection 7.3.7 Overtemperature Protection (OTP) 7.3.8 Fault Response 7.3.9 Power Good Indication (PG) 7.4 Device Functional Modes 8 Application and Implementation 8.1 Application Information 8.2 Single Device, Self-Controlled 8.2.1 Typical Application 8.2.1.1 Design Requirements 8.2.1.2 Detailed Design Procedure 8.2.1.2.1 Setting Undervoltage and Overvoltage Thresholds 8.2.1.2.2 Setting Output Voltage Rise Time (tR) 8.2.1.2.3 Setting Power Good Assertion Threshold 8.2.1.2.4 Setting Analog Current Monitor Voltage (IMON) Range 8.2.1.3 Application Curves 8.3 Active ORing 8.4 Priority Power MUXing 8.5 USB PD Port Protection 8.6 Parallel Operation 9 Power Supply Recommendations 9.1 Transient Protection 10 Layout 10.1 Layout Guidelines 10.2 Layout Example 11 Device and Documentation Support 11.1 Documentation Support 11.1.1 Related Documentation 11.2 Receiving Notification of Documentation Updates 11.3 Support Resources 11.4 Trademarks 11.5 Electrostatic Discharge Caution 11.6 Glossary 12 Mechanical, Packaging, and Orderable Information
