Datasheet ADT7461 (ON Semiconductor) - 19
| Manufacturer | ON Semiconductor |
| Description | +-1C Temperature Monitor with Series Resistance Cancellation |
| Pages / Page | 20 / 19 — ADT7461. PACKAGE DIMENSIONS. SOIC−8 NB. −X−. −Y−. MILLIMETERS. INCHES. … |
| Revision | 8 |
| File Format / Size | PDF / 275 Kb |
| Document Language | English |
ADT7461. PACKAGE DIMENSIONS. SOIC−8 NB. −X−. −Y−. MILLIMETERS. INCHES. DIM. MIN. MAX. N X 45. SEATING. PLANE. −Z−. SOLDERING FOOTPRINT*
Model Line for this Datasheet
Text Version of Document
ADT7461 PACKAGE DIMENSIONS SOIC−8 NB
CASE 751−07 ISSUE AK NOTES: 1. DIMENSIONING AND TOLERANCING PER
−X−
ANSI Y14.5M, 1982.
A
2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
8 5
PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR
B S
0.25 (0.010) M Y M PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL
1
IN EXCESS OF THE D DIMENSION AT
4 −Y− K
MAXIMUM MATERIAL CONDITION. 6. 751−01 THRU 751−06 ARE OBSOLETE. NEW STANDARD IS 751−07.
MILLIMETERS INCHES G DIM MIN MAX MIN MAX A
4.80 5.00 0.189 0.197
C N X 45
_
B
3.80 4.00 0.150 0.157
SEATING C
1.35 1.75 0.053 0.069
PLANE D
0.33 0.51 0.013 0.020
−Z− G
1.27 BSC 0.050 BSC
H
0.10 0.25 0.004 0.010 0.10 (0.004)
J
0.19 0.25 0.007 0.010
H M J D K
0.40 1.27 0.016 0.050
M
0 8 0 8 _ _ _ _
N
0.25 0.50 0.010 0.020
S
5.80 6.20 0.228 0.244 0.25 (0.010) M Z Y S X S
SOLDERING FOOTPRINT*
1.52 0.060 7.0 4.0 0.275 0.155 0.6 1.270 0.024 0.050 SCALE 6:1 ǒ mm Ǔ inches *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com 19
CASE 751−07 ISSUE AK NOTES: 1. DIMENSIONING AND TOLERANCING PER
−X−
ANSI Y14.5M, 1982.
A
2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
8 5
PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR
B S
0.25 (0.010) M Y M PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL
1
IN EXCESS OF THE D DIMENSION AT
4 −Y− K
MAXIMUM MATERIAL CONDITION. 6. 751−01 THRU 751−06 ARE OBSOLETE. NEW STANDARD IS 751−07.
MILLIMETERS INCHES G DIM MIN MAX MIN MAX A
4.80 5.00 0.189 0.197
C N X 45
_
B
3.80 4.00 0.150 0.157
SEATING C
1.35 1.75 0.053 0.069
PLANE D
0.33 0.51 0.013 0.020
−Z− G
1.27 BSC 0.050 BSC
H
0.10 0.25 0.004 0.010 0.10 (0.004)
J
0.19 0.25 0.007 0.010
H M J D K
0.40 1.27 0.016 0.050
M
0 8 0 8 _ _ _ _
N
0.25 0.50 0.010 0.020
S
5.80 6.20 0.228 0.244 0.25 (0.010) M Z Y S X S
SOLDERING FOOTPRINT*
1.52 0.060 7.0 4.0 0.275 0.155 0.6 1.270 0.024 0.050 SCALE 6:1 ǒ mm Ǔ inches *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com 19