Datasheet TMP114 (Texas Instruments) - 3
| Manufacturer | Texas Instruments |
| Description | Ultra-Thin, 1.2-V to 1.8-V Supply, High Accuracy Digital Temperature Sensor with I2C Interface |
| Pages / Page | 43 / 3 — TMP114. www.ti.com. 5 Pin Configuration and Functions. Figure 5-1. YMT … |
| File Format / Size | PDF / 1.4 Mb |
| Document Language | English |
TMP114. www.ti.com. 5 Pin Configuration and Functions. Figure 5-1. YMT Package 4-Pin PicoStar Top View
Model Line for this Datasheet
Text Version of Document
TMP114 www.ti.com
SNIS214 – JUNE 2021
5 Pin Configuration and Functions
1 2 A VDD GND B SDA SCL
Figure 5-1. YMT Package 4-Pin PicoStar Top View Table 5-1. Pin Functions PIN I/O DESCRIPTION NAME NO.
VDD A1 I Supply voltage
TION
GND A2 — Ground SDA B1 IO Serial data input and open-drain output. Requires a pullup resistor
MA
SCL B2 I Serial clock
R NCE INFO A V AD
Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 3 Product Folder Links: TMP114 Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Revision History 5 Pin Configuration and Functions 6 Specifications 6.1 Absolute Maximum Ratings 6.2 ESD Ratings 6.3 Recommended Operating Conditions 6.4 Thermal Information 6.5 Electrical Characteristics 6.6 I2C Interface Timing 6.7 Two-Wire Timing Diagram 7 Detailed Description 7.1 Overview 7.2 Functional Block Diagram 7.3 Feature Description 7.3.1 Cyclic Redundancy Check (CRC) 7.3.2 Temperature Limits 7.3.3 Slew Rate Warning 7.3.4 NIST Traceability 7.4 Device Functional Modes 7.4.1 Continuous Conversion Mode 7.4.2 Shutdown Mode 7.4.2.1 One-Shot Temperature Conversions 7.5 Programming 7.5.1 Temperature Data Format 7.5.2 I2C and SMBus Interface 7.5.3 Device Address 7.5.4 Bus Transactions 7.5.4.1 Auto-Increment 7.5.4.2 Writes 7.5.4.2.1 CRC Enabled Writes 7.5.4.3 Reads 7.5.4.3.1 CRC Enabled Reads 7.5.4.4 General Call Reset Function 7.5.4.5 Time-Out Function 7.5.4.6 I2C in I3C Mixed Fast Mode 7.5.4.7 Cyclic Redundancy Check Implementation 7.6 Register Map 8 Application and Implementation 8.1 Application Information 8.2 Typical Application 8.2.1 Design Requirements 8.2.2 Detailed Design Procedure 9 Power Supply Recommendations 10 Layout 10.1 Layout Guidelines 10.2 Layout Example 11 Device and Documentation Support 11.1 Receiving Notification of Documentation Updates 11.2 Support Resources 11.3 Trademarks 11.4 Electrostatic Discharge Caution 11.5 Glossary 12 Mechanical, Packaging, and Orderable Information 12.1 Tape and Reel Information
SNIS214 – JUNE 2021
5 Pin Configuration and Functions
1 2 A VDD GND B SDA SCL
Figure 5-1. YMT Package 4-Pin PicoStar Top View Table 5-1. Pin Functions PIN I/O DESCRIPTION NAME NO.
VDD A1 I Supply voltage
TION
GND A2 — Ground SDA B1 IO Serial data input and open-drain output. Requires a pullup resistor
MA
SCL B2 I Serial clock
R NCE INFO A V AD
Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 3 Product Folder Links: TMP114 Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Revision History 5 Pin Configuration and Functions 6 Specifications 6.1 Absolute Maximum Ratings 6.2 ESD Ratings 6.3 Recommended Operating Conditions 6.4 Thermal Information 6.5 Electrical Characteristics 6.6 I2C Interface Timing 6.7 Two-Wire Timing Diagram 7 Detailed Description 7.1 Overview 7.2 Functional Block Diagram 7.3 Feature Description 7.3.1 Cyclic Redundancy Check (CRC) 7.3.2 Temperature Limits 7.3.3 Slew Rate Warning 7.3.4 NIST Traceability 7.4 Device Functional Modes 7.4.1 Continuous Conversion Mode 7.4.2 Shutdown Mode 7.4.2.1 One-Shot Temperature Conversions 7.5 Programming 7.5.1 Temperature Data Format 7.5.2 I2C and SMBus Interface 7.5.3 Device Address 7.5.4 Bus Transactions 7.5.4.1 Auto-Increment 7.5.4.2 Writes 7.5.4.2.1 CRC Enabled Writes 7.5.4.3 Reads 7.5.4.3.1 CRC Enabled Reads 7.5.4.4 General Call Reset Function 7.5.4.5 Time-Out Function 7.5.4.6 I2C in I3C Mixed Fast Mode 7.5.4.7 Cyclic Redundancy Check Implementation 7.6 Register Map 8 Application and Implementation 8.1 Application Information 8.2 Typical Application 8.2.1 Design Requirements 8.2.2 Detailed Design Procedure 9 Power Supply Recommendations 10 Layout 10.1 Layout Guidelines 10.2 Layout Example 11 Device and Documentation Support 11.1 Receiving Notification of Documentation Updates 11.2 Support Resources 11.3 Trademarks 11.4 Electrostatic Discharge Caution 11.5 Glossary 12 Mechanical, Packaging, and Orderable Information 12.1 Tape and Reel Information
