Datasheet BSN254, BSN254A (NXP) - 7

ManufacturerNXP
DescriptionN-channel enhancement mode vertical D-MOS transistor
Pages / Page12 / 7 — PACKAGE OUTLINE. Plastic single-ended leaded (through hole) package; 3 …
File Format / SizePDF / 75 Kb
Document LanguageEnglish

PACKAGE OUTLINE. Plastic single-ended leaded (through hole) package; 3 leads (on-circle). SOT54 variant

PACKAGE OUTLINE Plastic single-ended leaded (through hole) package; 3 leads (on-circle) SOT54 variant

Text Version of Document

Philips Semiconductors Product specification N-channel enhancement mode BSN254; BSN254A vertical D-MOS transistor
PACKAGE OUTLINE Plastic single-ended leaded (through hole) package; 3 leads (on-circle) SOT54 variant
c L2 E d A L b
1 2
e1 D e
3
b1 L1 0 2.5 5 mm scale
DIMENSIONS (mm are the original dimensions) L (1) L UNIT 2 A b b c D d E e e L 1 1 1 max max
5.2 0.48 0.66 0.45 4.8 1.7 4.2 14.5 mm 2.54 1.27 2.5 2.5 5.0 0.40 0.56 0.40 4.4 1.4 3.6 12.7
Notes
1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic and terminal irregularities.
REFERENCES OUTLINE EUROPEAN ISSUE DATE VERSION PROJECTION IEC JEDEC EIAJ
SOT54 variant TO-92 variant SC-43 98-03-26 2002 Feb 19 7 Document Outline FEATURES APPLICATIONS DESCRIPTION QUICK REFERENCE DATA PINNING LIMITING VALUES THERMAL CHARACTERISTICS CHARACTERISTICS PACKAGE OUTLINE SOT54 variant DATA SHEET STATUS DEFINITIONS DISCLAIMERS