Datasheet ADG1208, ADG1209 (Analog Devices) - 9
| Manufacturer | Analog Devices |
| Description | Low Capacitance, 4-/8-Channel, ±15 V/+12 V iCMOS Multiplexers |
| Pages / Page | 21 / 9 — Data Sheet. ADG1208/ADG1209. VSS 1. 12 GND. S1 2. ADG1208. 11 VDD. TOP … |
| Revision | E |
| File Format / Size | PDF / 415 Kb |
| Document Language | English |
Data Sheet. ADG1208/ADG1209. VSS 1. 12 GND. S1 2. ADG1208. 11 VDD. TOP VIEW. S2 3. 10 S5. (Not to Scale). S3 4
Model Line for this Datasheet
Text Version of Document
Data Sheet ADG1208/ADG1209 N 0 1 2 E A A A 61 51 41 31 VSS 1 12 GND S1 2 ADG1208 11 VDD TOP VIEW S2 3 10 S5 (Not to Scale) S3 4 9 S6 5 6 7 8 4 8 7 S D S S 1. THE EXPOSED PAD IS CONNECTED INTERNALLY. FOR INCREASED RELIABILITY OF THE SOLDER JOINTS AND MAXIMUM THERMAL CAPABILITY,
04 0
IT IS RECOMMENDED THAT THE PAD BE
3- 71
SOLDERED TO THE SUBSTRATE, VSS.
05 Figure 5. 16-Lead LFCSP Pin Configuration (ADG1208)
Table 5. 16-Lead LFCSP Pin Function Descriptions (ADG1208) Pin No. Mnemonic Description
1 VSS Most Negative Power Supply Potential. In single-supply applications, it can be connected to ground. 2 S1 Source Terminal 1. Can be an input or an output. 3 S2 Source Terminal 2. Can be an input or an output. 4 S3 Source Terminal 3. Can be an input or an output. 5 S4 Source Terminal 4. Can be an input or an output. 6 D Drain Terminal. Can be an input or an output. 7 S8 Source Terminal 8. Can be an input or an output. 8 S7 Source Terminal 7. Can be an input or an output. 9 S6 Source Terminal 6. Can be an input or an output. 10 S5 Source Terminal 5. Can be an input or an output. 11 VDD Most Positive Power Supply Potential. 12 GND Ground (0 V) Reference. 13 A2 Logic Control Input. 14 A1 Logic Control Input. 15 A0 Logic Control Input. 16 EN Active High Digital Input. When low, the device is disabled and all switches are off. When high, Ax logic inputs determine on switches. EPAD Exposed Pad. The exposed pad is connected internally. For increased reliability of the solder joints and maximum thermal capability, it is recommended that the pad be soldered to the substrate, VSS.
Table 6. ADG1208 Truth Table A2 A1 A0 EN On Switch
X X X 0 None 0 0 0 1 1 0 0 1 1 2 0 1 0 1 3 0 1 1 1 4 1 0 0 1 5 1 0 1 1 6 1 1 0 1 7 1 1 1 1 8 Rev. E | Page 9 of 21 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAMS GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS DUAL SUPPLY SINGLE SUPPLY ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS TERMINOLOGY TEST CIRCUITS OUTLINE DIMENSIONS ORDERING GUIDE
04 0
IT IS RECOMMENDED THAT THE PAD BE
3- 71
SOLDERED TO THE SUBSTRATE, VSS.
05 Figure 5. 16-Lead LFCSP Pin Configuration (ADG1208)
Table 5. 16-Lead LFCSP Pin Function Descriptions (ADG1208) Pin No. Mnemonic Description
1 VSS Most Negative Power Supply Potential. In single-supply applications, it can be connected to ground. 2 S1 Source Terminal 1. Can be an input or an output. 3 S2 Source Terminal 2. Can be an input or an output. 4 S3 Source Terminal 3. Can be an input or an output. 5 S4 Source Terminal 4. Can be an input or an output. 6 D Drain Terminal. Can be an input or an output. 7 S8 Source Terminal 8. Can be an input or an output. 8 S7 Source Terminal 7. Can be an input or an output. 9 S6 Source Terminal 6. Can be an input or an output. 10 S5 Source Terminal 5. Can be an input or an output. 11 VDD Most Positive Power Supply Potential. 12 GND Ground (0 V) Reference. 13 A2 Logic Control Input. 14 A1 Logic Control Input. 15 A0 Logic Control Input. 16 EN Active High Digital Input. When low, the device is disabled and all switches are off. When high, Ax logic inputs determine on switches. EPAD Exposed Pad. The exposed pad is connected internally. For increased reliability of the solder joints and maximum thermal capability, it is recommended that the pad be soldered to the substrate, VSS.
Table 6. ADG1208 Truth Table A2 A1 A0 EN On Switch
X X X 0 None 0 0 0 1 1 0 0 1 1 2 0 1 0 1 3 0 1 1 1 4 1 0 0 1 5 1 0 1 1 6 1 1 0 1 7 1 1 1 1 8 Rev. E | Page 9 of 21 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAMS GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS DUAL SUPPLY SINGLE SUPPLY ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS TERMINOLOGY TEST CIRCUITS OUTLINE DIMENSIONS ORDERING GUIDE
