NSI50350ADT4GTYPICAL PERFORMANCE CURVES (Minimum DENKA K1 @ 900 mm2, 1.5 mm Al, 2kV Thermally conductive dielectric, 2 oz. Cu, or equivalent) 450 500 TA = −40°C TA = 25°C 400 450 T ≈−0.894 mA/°C typ A = 25°C 350 ≈−0.860 mA/°C typ 400 T 300 A = 85°C ≈−0.508 mA/°C typ 350 250 TE CURRENT (mA) A T 200 A = 125°C 300 TJ, maximum die temperature limit 175°C 150 250 , PULSE CURRENT (mA) 100 , STEADY ST I reg(P) 200 50 DC Test Steady State, Still AirNon−Repetitive Pulse Test 0 150 I reg(SS) 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Vak, ANODE−CATHODE VOLTAGE (V) Vak, ANODE−CATHODE VOLTAGE (V) Figure 2. Steady State Current (Ireg(SS)) vs.Figure 3. Pulse Current (Ireg(P)) vs.Anode−Cathode Voltage (Vak)Anode−Cathode Voltage (Vak) 390 430 Vak @ 7.5 V Vak @ 7.5 V 380 420 T T A = 25°C A = 25°C 370 410 TION (mA) 360 400 TE CURRENT (mA) 390 A 350 380 340 370 330 360 , STEADY ST 320 , CURRENT REGULA 350 I reg I reg(SS) 310 340 375 385 395 405 415 425 435 445 455 465 475 0 50 100 150 200 250 300 350 Ireg(P), PULSE CURRENT (mA) TIME (s) Figure 4. Steady State Current vs. PulseFigure 5. Current Regulation vs. TimeCurrent Testing 16000 2500 mm2, Denka K1, 2 oz 14000 12000 1600 mm2, Denka K1, 2 oz TION (mW) 10000 A 8000 6000 4000 , POWER DISSIP 900 mm2, Denka K1, 2 oz DP 2000 1000 mm2, FR4, 3 oz 400 mm2, Denka K1, 2 oz 0 −40 −20 0 20 40 60 80 100 120 TA, AMBIENT TEMPERATURE (°C) Figure 6. Power Dissipation vs. AmbientTemperature @ TJ = 175 5 Chttp://onsemi.com4