Datasheet TDA7056B (NXP) - 3
| Manufacturer | NXP |
| Description | 5 W mono BTL audio amplifier with DC volume control |
| Pages / Page | 15 / 3 — BLOCK DIAGRAM. TDA7056B. PINNING. SYMBOL. PIN. DESCRIPTION |
| File Format / Size | PDF / 96 Kb |
| Document Language | English |
BLOCK DIAGRAM. TDA7056B. PINNING. SYMBOL. PIN. DESCRIPTION
Model Line for this Datasheet
Text Version of Document
NXP Semiconductors Product specification 5 W mono BTL audio amplifier with DC TDA7056B volume control
BLOCK DIAGRAM
VP handbook, full pagewidth 2 1 n.c.
TDA7056B
9 n.c. I + i 6 positive output 3 input 5 DC volume control I – i 8 negative output STABILIZER TEMPERATURE V PROTECTION ref 4 7 MSA708 - 1 signal power ground ground Fig.1 Block diagram.
PINNING SYMBOL PIN DESCRIPTION
n.c. 1 not connected handbook, halfpage n.c. 1 VP 2 positive supply voltage V 2 P VI 3 voltage input V 3 GND1 4 signal ground I GND1 VC 5 DC volume control 4 OUT+ 6 positive output VC 5
TDA7056B
GND2 7 power ground OUT 6 OUT 8 negative output GND2 7 n.c. 9 not connected OUT 8 n.c. 9 MSA707 Fig.2 Pin configuration. 1997 Aug 15 3 Document Outline Features General description Quick reference data Ordering information Block diagram Pinning Functional description Power dissipation Limiting values Thermal characteristics Characteristics Test and application information Package outline Soldering Introduction Soldering by dipping or by wave Repairing soldered joints Data sheet status Definitions Disclaimers
BLOCK DIAGRAM
VP handbook, full pagewidth 2 1 n.c.
TDA7056B
9 n.c. I + i 6 positive output 3 input 5 DC volume control I – i 8 negative output STABILIZER TEMPERATURE V PROTECTION ref 4 7 MSA708 - 1 signal power ground ground Fig.1 Block diagram.
PINNING SYMBOL PIN DESCRIPTION
n.c. 1 not connected handbook, halfpage n.c. 1 VP 2 positive supply voltage V 2 P VI 3 voltage input V 3 GND1 4 signal ground I GND1 VC 5 DC volume control 4 OUT+ 6 positive output VC 5
TDA7056B
GND2 7 power ground OUT 6 OUT 8 negative output GND2 7 n.c. 9 not connected OUT 8 n.c. 9 MSA707 Fig.2 Pin configuration. 1997 Aug 15 3 Document Outline Features General description Quick reference data Ordering information Block diagram Pinning Functional description Power dissipation Limiting values Thermal characteristics Characteristics Test and application information Package outline Soldering Introduction Soldering by dipping or by wave Repairing soldered joints Data sheet status Definitions Disclaimers
