Datasheet UCC33420 (Texas Instruments) - 6
| Manufacturer | Texas Instruments |
| Description | 5V/5V 1.5W 3kVrms isolated DC-DC module with integrated transformer |
| Pages / Page | 37 / 6 — UCC33420. www.ti.com. 6.4 Thermal Information. VSON-FCRLF. THERMAL … |
| File Format / Size | PDF / 2.4 Mb |
| Document Language | English |
UCC33420. www.ti.com. 6.4 Thermal Information. VSON-FCRLF. THERMAL METRIC. UNIT. 12 PINS. 6.5 Power Ratings. PARAMETER. TEST CONDITIONS
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UCC33420
SLUSFK1E – JANUARY 2024 – REVISED FEBRUARY 2025
www.ti.com 6.4 Thermal Information VSON-FCRLF THERMAL METRIC
(1)
UNIT 12 PINS
RθJA Junction-to-ambient thermal resistance 59.7 °C/W RθJC(top) Junction-to-case (top) thermal resistance 7.35 °C/W RθJB Junction-to-board thermal resistance 25.6 °C/W ΨJA Junction-to-ambient characterization parameter 58.0 °C/W ΨJT Junction-to-top characterization parameter 9.2 °C/W ΨJB Junction-to-board characterization parameter 26.8 °C/W (1) The thermal resistances (R) are based on JEDEC board, and the characterization parameters (Ψ) are based on the EVM described in the Layout section. For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
6.5 Power Ratings
VVINP = 5.0V, CIN1 = COUT1 = 15nF, CIN2 = 10µF, COUT2 = 22µF SEL connected to VCC, VEN/FLT = 5.0V, TA = 25°C.
PARAMETER TEST CONDITIONS VALUE UNIT
PD Power dissipation IVCC = 300 mA 1050 mW PDP Power dissipation by driver side (primary) IVCC = 300 mA 360 mW PDS Power dissipation by rectifier side (secondary) IVCC = 300 mA 290 mW PDT Power dissipation by transformer IVCC = 300 mA 400 mW
6.6 Insulation Specifications PARAMETER TEST CONDITIONS VALUE UNIT General
CLR External clearance (1) Shortest terminal-to-terminal distance through air > 4.1 mm CPG External creepage (1) Shortest terminal-to-terminal distance across the > 4.1 mm package surface DTI Distance through the insulation Minimum internal gap (internal clearance) > 50 µm CTI Comparative tracking index DIN EN 60112 (VDE 0303-11); IEC 60112 > 600 V Material group According to IEC 60664-1 I Rated mains voltage ≤ 300VRMS I-III Overvoltage category Rated mains voltage ≤ 600VRMS I-II Rated mains voltage ≤ 1000VRMS I-I
DIN EN IEC60747-17 (VDE 0884-17)
(2) VIORM Maximum repetitive peak isolation voltage AC voltage (bipolar) 1159 VPK AC voltage (sine wave) Time dependent dielectric 820 VRMS V breakdown (TDDB) test IOWM Maximum working isolation voltage DC voltage 1000 VDC VTEST = VIOTM, t = 60s (qualification) 4243 VPK VIOTM Maximum transient isolation voltage VTEST = 1.2 × VIOTM , t = 1s (100%) production 5091 VPK VIMP Impulse Voltage (3) Tested in air, 1.2/50µs waveform per IEC 62368-1 5000 VPK VIOSM Maximum surge isolation voltage (4) Tested in oil (qualification test), 6500 V 1.2/50µs waveform per IEC 62368-1. PK 6 Submit Document Feedback Copyright © 2025 Texas Instruments Incorporated Product Folder Links: UCC33420 Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Device Comparison 5 Pin Configuration and Functions 6 Specifications 6.1 Absolute Maximum Ratings 6.2 ESD Ratings 6.3 Recommended Operating Conditions 6.4 Thermal Information 6.5 Power Ratings 6.6 Insulation Specifications 6.7 Safety-Related Certifications 6.8 Safety Limiting Values 6.9 Electrical Characteristics 6.10 Typical Characteristics 7 Detailed Description 7.1 Overview 7.2 Functional Block Diagram 7.3 Feature Description 7.3.1 Enable and Disable 7.3.2 Output Voltage Soft-Start 7.3.3 Output Voltage Steady-State Regulation 7.3.4 Protection Features 7.3.4.1 Input Under-Voltage and Over-Voltage Lockout 7.3.4.2 Output Under-Voltage Protection 7.3.4.3 Output Over-Voltage Protection 7.3.4.4 Over-Temperature Protection 7.3.4.5 Fault Reporting and Auto-Restart 7.3.5 VCC Load Recommended Operating Area 7.3.6 Electromagnetic Compatibility (EMC) Considerations 7.4 Device Functional Modes 8 Application and Implementation 8.1 Application Information 8.2 Typical Application 8.2.1 Design Requirements 8.2.2 Detailed Design Procedure 8.3 Power Supply Recommendations 8.4 Layout 8.4.1 Layout Guidelines 8.4.2 Layout Example 9 Device and Documentation Support 9.1 Device Support 9.1.1 Third-Party Products Disclaimer 9.2 Documentation Support 9.2.1 Related Documentation 9.3 Receiving Notification of Documentation Updates 9.4 Support Resources 9.5 Trademarks 9.6 Electrostatic Discharge Caution 9.7 Glossary 10 Revision History 11 Mechanical and Packaging Information
UCC33420
SLUSFK1E – JANUARY 2024 – REVISED FEBRUARY 2025
www.ti.com 6.4 Thermal Information VSON-FCRLF THERMAL METRIC
(1)
UNIT 12 PINS
RθJA Junction-to-ambient thermal resistance 59.7 °C/W RθJC(top) Junction-to-case (top) thermal resistance 7.35 °C/W RθJB Junction-to-board thermal resistance 25.6 °C/W ΨJA Junction-to-ambient characterization parameter 58.0 °C/W ΨJT Junction-to-top characterization parameter 9.2 °C/W ΨJB Junction-to-board characterization parameter 26.8 °C/W (1) The thermal resistances (R) are based on JEDEC board, and the characterization parameters (Ψ) are based on the EVM described in the Layout section. For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
6.5 Power Ratings
VVINP = 5.0V, CIN1 = COUT1 = 15nF, CIN2 = 10µF, COUT2 = 22µF SEL connected to VCC, VEN/FLT = 5.0V, TA = 25°C.
PARAMETER TEST CONDITIONS VALUE UNIT
PD Power dissipation IVCC = 300 mA 1050 mW PDP Power dissipation by driver side (primary) IVCC = 300 mA 360 mW PDS Power dissipation by rectifier side (secondary) IVCC = 300 mA 290 mW PDT Power dissipation by transformer IVCC = 300 mA 400 mW
6.6 Insulation Specifications PARAMETER TEST CONDITIONS VALUE UNIT General
CLR External clearance (1) Shortest terminal-to-terminal distance through air > 4.1 mm CPG External creepage (1) Shortest terminal-to-terminal distance across the > 4.1 mm package surface DTI Distance through the insulation Minimum internal gap (internal clearance) > 50 µm CTI Comparative tracking index DIN EN 60112 (VDE 0303-11); IEC 60112 > 600 V Material group According to IEC 60664-1 I Rated mains voltage ≤ 300VRMS I-III Overvoltage category Rated mains voltage ≤ 600VRMS I-II Rated mains voltage ≤ 1000VRMS I-I
DIN EN IEC60747-17 (VDE 0884-17)
(2) VIORM Maximum repetitive peak isolation voltage AC voltage (bipolar) 1159 VPK AC voltage (sine wave) Time dependent dielectric 820 VRMS V breakdown (TDDB) test IOWM Maximum working isolation voltage DC voltage 1000 VDC VTEST = VIOTM, t = 60s (qualification) 4243 VPK VIOTM Maximum transient isolation voltage VTEST = 1.2 × VIOTM , t = 1s (100%) production 5091 VPK VIMP Impulse Voltage (3) Tested in air, 1.2/50µs waveform per IEC 62368-1 5000 VPK VIOSM Maximum surge isolation voltage (4) Tested in oil (qualification test), 6500 V 1.2/50µs waveform per IEC 62368-1. PK 6 Submit Document Feedback Copyright © 2025 Texas Instruments Incorporated Product Folder Links: UCC33420 Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Device Comparison 5 Pin Configuration and Functions 6 Specifications 6.1 Absolute Maximum Ratings 6.2 ESD Ratings 6.3 Recommended Operating Conditions 6.4 Thermal Information 6.5 Power Ratings 6.6 Insulation Specifications 6.7 Safety-Related Certifications 6.8 Safety Limiting Values 6.9 Electrical Characteristics 6.10 Typical Characteristics 7 Detailed Description 7.1 Overview 7.2 Functional Block Diagram 7.3 Feature Description 7.3.1 Enable and Disable 7.3.2 Output Voltage Soft-Start 7.3.3 Output Voltage Steady-State Regulation 7.3.4 Protection Features 7.3.4.1 Input Under-Voltage and Over-Voltage Lockout 7.3.4.2 Output Under-Voltage Protection 7.3.4.3 Output Over-Voltage Protection 7.3.4.4 Over-Temperature Protection 7.3.4.5 Fault Reporting and Auto-Restart 7.3.5 VCC Load Recommended Operating Area 7.3.6 Electromagnetic Compatibility (EMC) Considerations 7.4 Device Functional Modes 8 Application and Implementation 8.1 Application Information 8.2 Typical Application 8.2.1 Design Requirements 8.2.2 Detailed Design Procedure 8.3 Power Supply Recommendations 8.4 Layout 8.4.1 Layout Guidelines 8.4.2 Layout Example 9 Device and Documentation Support 9.1 Device Support 9.1.1 Third-Party Products Disclaimer 9.2 Documentation Support 9.2.1 Related Documentation 9.3 Receiving Notification of Documentation Updates 9.4 Support Resources 9.5 Trademarks 9.6 Electrostatic Discharge Caution 9.7 Glossary 10 Revision History 11 Mechanical and Packaging Information