Datasheet MC33039, NCV33039 (ON Semiconductor) - 8
| Manufacturer | ON Semiconductor |
| Description | High performance closed-loop speed control adapter for use in brushless DC motor control systems |
| Pages / Page | 11 / 8 — PACKAGE DIMENSIONS. PDIP−8. SCALE 1:1. NOTE 8. END VIEW. TOP VIEW. WITH … |
| File Format / Size | PDF / 362 Kb |
| Document Language | English |
PACKAGE DIMENSIONS. PDIP−8. SCALE 1:1. NOTE 8. END VIEW. TOP VIEW. WITH LEADS CONSTRAINED. NOTE 5. INCHES. MILLIMETERS. DIM. MIN. MAX. e/2. NOTE 3
Model Line for this Datasheet
Text Version of Document
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS PDIP−8
CASE 626−05 ISSUE P DATE 22 APR 2015
SCALE 1:1 D A
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
E
2. CONTROLLING DIMENSION: INCHES. 3. DIMENSIONS A, A1 AND L ARE MEASURED WITH THE PACK-
H
AGE SEATED IN JEDEC SEATING PLANE GAUGE GS−3.
8 5
4. DIMENSIONS D, D1 AND E1 DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS ARE NOT TO EXCEED 0.10 INCH.
E1
5. DIMENSION E IS MEASURED AT A POINT 0.015 BELOW DATUM PLANE H WITH THE LEADS CONSTRAINED PERPENDICULAR
1 4
TO DATUM C. 6. DIMENSION eB IS MEASURED AT THE LEAD TIPS WITH THE
NOTE 8
LEADS UNCONSTRAINED.
c b2
7. DATUM PLANE H IS COINCIDENT WITH THE BOTTOM OF THE
B END VIEW
LEADS, WHERE THE LEADS EXIT THE BODY.
TOP VIEW WITH LEADS CONSTRAINED
8. PACKAGE CONTOUR IS OPTIONAL (ROUNDED OR SQUARE CORNERS).
NOTE 5 INCHES MILLIMETERS A2 DIM MIN MAX MIN MAX e/2 A A
−−−− 0.210 −−− 5.33
NOTE 3 A1
0.015 −−−− 0.38 −−−
A2
0.115 0.195 2.92 4.95
L b
0.014 0.022 0.35 0.56
b2
0.060 TYP 1.52 TYP
C
0.008 0.014 0.20 0.36
SEATING D
0.355 0.400 9.02 10.16
A1 PLANE D1
0.005 −−−− 0.13 −−−
C E
0.300 0.325 7.62 8.26
M E1
0.240 0.280 6.10 7.11
D1 e
0.100 BSC 2.54 BSC
e eB eB
−−−− 0.430 −−− 10.92
L
0.115 0.150 2.92 3.81
8X b END VIEW M
−−−− 10 ° −−− 10 ° 0.010 M C A
SIDE VIEW
M B M
NOTE 6 GENERIC MARKING DIAGRAM*
STYLE 1: PIN 1. AC IN 2. DC + IN XXXXXXXXX 3. DC − IN AWL 4. AC IN 5. GROUND YYWWG 6. OUTPUT 7. AUXILIARY 8. VCC XXXX = Specific Device Code A = Assembly Location WL = Wafer Lot YY = Year WW = Work Week G = Pb−Free Package *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “G”, may or may not be present. Some products may not follow the Generic Marking.
DOCUMENT NUMBER: 98ASB42420B
Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DESCRIPTION: PDIP−8 PAGE 1 OF 1 onsemi
and are trademarks of Semiconductor Components Industries, LLC dba
onsemi
or its subsidiaries in the United States and/or other countries.
onsemi
reserves the right to make changes without further notice to any products herein.
onsemi
makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does
onsemi
assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
onsemi
does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com
PACKAGE DIMENSIONS PDIP−8
CASE 626−05 ISSUE P DATE 22 APR 2015
SCALE 1:1 D A
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
E
2. CONTROLLING DIMENSION: INCHES. 3. DIMENSIONS A, A1 AND L ARE MEASURED WITH THE PACK-
H
AGE SEATED IN JEDEC SEATING PLANE GAUGE GS−3.
8 5
4. DIMENSIONS D, D1 AND E1 DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS ARE NOT TO EXCEED 0.10 INCH.
E1
5. DIMENSION E IS MEASURED AT A POINT 0.015 BELOW DATUM PLANE H WITH THE LEADS CONSTRAINED PERPENDICULAR
1 4
TO DATUM C. 6. DIMENSION eB IS MEASURED AT THE LEAD TIPS WITH THE
NOTE 8
LEADS UNCONSTRAINED.
c b2
7. DATUM PLANE H IS COINCIDENT WITH THE BOTTOM OF THE
B END VIEW
LEADS, WHERE THE LEADS EXIT THE BODY.
TOP VIEW WITH LEADS CONSTRAINED
8. PACKAGE CONTOUR IS OPTIONAL (ROUNDED OR SQUARE CORNERS).
NOTE 5 INCHES MILLIMETERS A2 DIM MIN MAX MIN MAX e/2 A A
−−−− 0.210 −−− 5.33
NOTE 3 A1
0.015 −−−− 0.38 −−−
A2
0.115 0.195 2.92 4.95
L b
0.014 0.022 0.35 0.56
b2
0.060 TYP 1.52 TYP
C
0.008 0.014 0.20 0.36
SEATING D
0.355 0.400 9.02 10.16
A1 PLANE D1
0.005 −−−− 0.13 −−−
C E
0.300 0.325 7.62 8.26
M E1
0.240 0.280 6.10 7.11
D1 e
0.100 BSC 2.54 BSC
e eB eB
−−−− 0.430 −−− 10.92
L
0.115 0.150 2.92 3.81
8X b END VIEW M
−−−− 10 ° −−− 10 ° 0.010 M C A
SIDE VIEW
M B M
NOTE 6 GENERIC MARKING DIAGRAM*
STYLE 1: PIN 1. AC IN 2. DC + IN XXXXXXXXX 3. DC − IN AWL 4. AC IN 5. GROUND YYWWG 6. OUTPUT 7. AUXILIARY 8. VCC XXXX = Specific Device Code A = Assembly Location WL = Wafer Lot YY = Year WW = Work Week G = Pb−Free Package *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “G”, may or may not be present. Some products may not follow the Generic Marking.
DOCUMENT NUMBER: 98ASB42420B
Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DESCRIPTION: PDIP−8 PAGE 1 OF 1 onsemi
and are trademarks of Semiconductor Components Industries, LLC dba
onsemi
or its subsidiaries in the United States and/or other countries.
onsemi
reserves the right to make changes without further notice to any products herein.
onsemi
makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does
onsemi
assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
onsemi
does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com