Datasheet MCP6561, MCP6561R, MCP6561U, MCP6562, MCP6564 (Microchip) - 10

ManufacturerMicrochip
Description1.8V Low-Power Push-Pull Output Comparator
Pages / Page46 / 10 — MCP6561/1R/1U/2/4. Note:. 1000. 30%. 100mV Over-Drive. VCM = VSS. VCM = …
File Format / SizePDF / 1.2 Mb
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MCP6561/1R/1U/2/4. Note:. 1000. 30%. 100mV Over-Drive. VCM = VSS. VCM = VDD/2. Avg. = 200 µV/V. 100. 25%. VDD. DD = 1.8. . V. 8 , tPLH

MCP6561/1R/1U/2/4 Note: 1000 30% 100mV Over-Drive VCM = VSS VCM = VDD/2 Avg = 200 µV/V 100 25% VDD DD = 1.8  V 8 , tPLH

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Text Version of Document

MCP6561/1R/1U/2/4 Note:
Unless otherwise indicated, VDD = +1.8V to +5.5V, VSS = GND, TA = +25°C, VIN+ = VDD/2, VIN– = GND, RL = 10 k to VDD/2, and CL = 25 pF.
1000 30% 100mV Over-Drive VCM = VSS VCM = VDD/2 Avg. = 200 µV/V 100 25% ) VDD DD = 1.8 . V 8 , tPLH ) StDev= 94 µV/V s µ VDD DD = 1.8 . V 8 , tPHL PH % 3588 units ( 20% y 10 la ces ( e VDD = 5.5V, tPLH n 15% D VDD = 5.5V, tPHL 1 rre rop. 10% P ccu 0.1 O 5% 0.01 0% 0. 1 001 01.0 01 1 0 0.0 1 1000 1 10000 10 100000 10 1E+ 10 06 00 -600 -400 -200 0 200 400 600 Capacitive Load (nf) PSRR (µV/V) FIGURE 2-31:
Propagation Delay vs.
FIGURE 2-34:
Power Supply Rejection Capacitive Load. Ratio (PSRR).
1E+1 10 1 m 30% V V CM = VDD/2 to VDD+ 0.2V CM = -0.2V to VDD + 0.2V 1E+09 Avg. = 0.6 mV ) 1m Avg. = 0.7 mV ) StDev= 1 mV StDev= 0.1 mV % t (A 1E+0 10 7 µ n 20% rre ces ( u 1E+0 100 5 n TA= -40°C n VCM = -0.2V to VDD/2 T t C A= +25°C rre Avg. = 0.5 mV u 1E+03 1n TA= +85°C 10% StDev= 0.1 mV VDD= 1.8V T ccu Inp A= +125°C O 3588 units 1E+0 10 1 p 1E 0. -0 1 1 p 0% -0.8 -0.6 -0.4 -0.2 0 -5 -4 -3 -2 -1 0 1 2 3 4 5 Input Voltage (V) CMRR (mV/V) FIGURE 2-32:
Input Bias Current vs. Input
FIGURE 2-35:
Common-mode Rejection Voltage vs Temperature. Ratio (CMRR).
80 30% Input Referred V = V /2 to V + 0.3V V = -0.3V to V + 0.3V CM DD DD CM DD Avg. = 0.03 mV Avg. = 0.1 mV 78 V StDev= 0.7 mV StDev= 0.4 mV B) CM = VSS ) d V % DD = 1.8V to 5.5V ( 20% R 76 PSRR R ces ( S n /P VCM = -0.3V to VDD/2 74 rre Avg. = 0.2 mV RR CMRR 10% VDD= 5.5V ccu StDev= 0.4 mV 3588 units CM 72 V O CM = -0.3V to VDD + 0.3V VDD = 5.5V 70 0% -50 -25 0 25 50 75 100 125 -2.5 -2.0 -1.5 -1.0 -0.5 0.0 0.5 1.0 1.5 2.0 2.5 Temperature (°C) CMRR (mV/V) FIGURE 2-33:
Common-mode Rejection
FIGURE 2-36:
Common-mode Rejection Ratio and Power Supply Rejection Ratio vs. Ratio (CMRR). Temperature. DS22139C-page 10  2009-2013 Microchip Technology Inc. Document Outline MCP6561/1R/1U/2/4 1.0 Electrical Characteristics 1.1 Maximum Ratings 1.2 Test Circuit Configuration FIGURE 1-1: AC and DC Test Circuit for the Push-Pull Output Comparators. 2.0 Typical Performance Curves FIGURE 2-1: Input Offset Voltage. FIGURE 2-2: Input Offset Voltage Drift. FIGURE 2-3: Input vs. Output Signal, No Phase Reversal. FIGURE 2-4: Input Hysteresis Voltage. FIGURE 2-5: Input Hysteresis Voltage Drift - Linear Temp. Co. (TC1). FIGURE 2-6: Input Hysteresis Voltage Drift - Quadratic Temp. Co. (TC2). FIGURE 2-7: Input Offset Voltage vs. Temperature. FIGURE 2-8: Input Offset Voltage vs. Common-mode Input Voltage. FIGURE 2-9: Input Offset Voltage vs. Common-mode Input Voltage. FIGURE 2-10: Input Hysteresis Voltage vs. Temperature. FIGURE 2-11: Input Hysteresis Voltage vs. Common-mode Input Voltage. FIGURE 2-12: Input Hysteresis Voltage vs. Common-mode Input Voltage. FIGURE 2-13: Input Offset Voltage vs. Supply Voltage vs. Temperature. FIGURE 2-14: Quiescent Current. FIGURE 2-15: Quiescent Current vs. Common-mode Input Voltage. FIGURE 2-16: Input Hysteresis Voltage vs. Supply Voltage vs. Temperature. FIGURE 2-17: Quiescent Current vs. Supply Voltage vs Temperature. FIGURE 2-18: Quiescent Current vs. Common-mode Input Voltage. FIGURE 2-19: Quiescent Current vs. Toggle Frequency. FIGURE 2-20: Output Headroom vs. Output Current. FIGURE 2-21: Low-to-High and High-to- Low Propagation Delays. FIGURE 2-22: Short Circuit Current vs. Supply Voltage vs. Temperature. FIGURE 2-23: Output Headroom vs.Output Current. FIGURE 2-24: Low-to-High and High-to- Low Propagation Delays . FIGURE 2-25: Propagation Delay Skew. FIGURE 2-26: Propagation Delay vs. Supply Voltage. FIGURE 2-27: Propagation Delay vs. Common-mode Input Voltage. FIGURE 2-28: Propagation Delay vs. Temperature. FIGURE 2-29: Propagation Delay vs. Input Over-Drive. FIGURE 2-30: Propagation Delay vs. Common-mode Input Voltage. FIGURE 2-31: Propagation Delay vs. Capacitive Load. FIGURE 2-32: Input Bias Current vs. Input Voltage vs Temperature. FIGURE 2-33: Common-mode Rejection Ratio and Power Supply Rejection Ratio vs. Temperature. FIGURE 2-34: Power Supply Rejection Ratio (PSRR). FIGURE 2-35: Common-mode Rejection Ratio (CMRR). FIGURE 2-36: Common-mode Rejection Ratio (CMRR). FIGURE 2-37: Output Jitter vs. Input Frequency. FIGURE 2-38: Input Offset Current and Input Bias Current vs. Temperature. FIGURE 2-39: Input Offset Current and Input Bias Current vs. Common-mode Input Voltage vs. Temperature. 3.0 Pin Descriptions TABLE 3-1: Pin Function Table 3.1 Analog Inputs 3.2 Digital Outputs 3.3 Power Supply (VSS and VDD) 4.0 Applications Information 4.1 Comparator Inputs 4.1.1 Normal Operation FIGURE 4-1: The MCP6561/1R/1U/2/4 Comparators’ Internal Hysteresis Eliminates Output Chatter Caused by Input Noise Voltage. 4.1.2 Input Voltage and Current Limits FIGURE 4-2: Simplified Analog Input ESD Structures. FIGURE 4-3: Protecting the Analog Inputs. 4.1.3 Phase Reversal 4.2 Push-Pull Output 4.3 Externally Set Hysteresis 4.3.1 Non-Inverting Circuit FIGURE 4-4: Non-inverting Circuit with Hysteresis for Single-Supply. FIGURE 4-5: Hysteresis Diagram for the Non-inverting Circuit. 4.3.2 Inverting Circuit FIGURE 4-6: Inverting Circuit With Hysteresis. FIGURE 4-7: Hysteresis Diagram for the Inverting Circuit. FIGURE 4-8: Thevenin Equivalent Circuit. 4.4 Bypass Capacitors 4.5 Capacitive Loads 4.6 PCB Surface Leakage FIGURE 4-9: Example Guard Ring Layout for Inverting Circuit. 4.7 PCB Layout Technique FIGURE 4-10: Recommended Layout. 4.8 Unused Comparators FIGURE 4-11: Unused Comparators. 4.9 Typical Applications 4.9.1 Precise Comparator FIGURE 4-12: Precise Inverting Comparator. 4.9.2 Windowed Comparator FIGURE 4-13: Windowed Comparator. 4.9.3 Bistable Multivibrator FIGURE 4-14: Bistable Multivibrator. 5.0 Design Aids 5.1 Microchip Advanced Part Selector (MAPS) 5.2 Analog Demonstration and Evaluation Boards 5.3 Application Notes 6.0 Packaging Information 6.1 Package Marking Information Appendix A: Revision History Product Identification System Trademarks Worldwide Sales and Service
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