Datasheet LM317 (Texas Instruments) - 6

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LM317
SLVS044Z – SEPTEMBER 1997 – REVISED APRIL 2025
www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1) (2)
MIN MAX UNIT
Power dissipation Internally limited Input-output voltage differential −0.3 40 V Storage temperature, Tstg −65 150 °C Operating virtual junction temperature, TJ (legacy chip) −65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications.
6.2 ESD Ratings VALUE UNIT Legacy New Chip Chip
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2500 ±3000 V(ESD) Electrostatic discharge V Charged device model (CDM), per JEDEC specification JESD22- C101(2) ±1000 NA (1) JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions MIN MAX UNIT
VO Output voltage 1.25 37 V VI – VO Input-to-output differential voltage 3 40 V IO Output current 0.01 1.5 A TJ Operating virtual junction temperature 0 125 °C 6 Submit Document Feedback Copyright © 2025 Texas Instruments Incorporated Product Folder Links: LM317 Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Device Comparison Table 5 Pin Configuration and Functions 6 Specifications 6.1 Absolute Maximum Ratings 6.2 ESD Ratings 6.3 Recommended Operating Conditions 6.4 Thermal Information (Legacy Chip) 6.5 Thermal Information (New Chip) 6.6 Electrical Characteristics 6.7 Typical Characteristics 7 Detailed Description 7.1 Overview 7.2 Functional Block Diagram 7.3 Feature Description 7.3.1 NPN Darlington Output Drive 7.3.2 Overload Block 7.3.3 Programmable Feedback 7.4 Device Functional Modes 7.4.1 Normal Operation 7.4.2 Operation With Low Input Voltage 7.4.3 Operation at Light Loads 7.4.4 Operation In Self Protection 8 Application and Implementation 8.1 Application Information 8.2 Typical Application 8.2.1 Design Requirements 8.2.2 Detailed Design Procedure 8.2.3 Application Curves 8.3 System Examples 8.3.1 0V to 30V Regulator Circuit 8.3.2 Adjustable Regulator Circuit With Improved Ripple Rejection 8.3.3 Precision Current-Limiter Circuit 8.3.4 Tracking Preregulator Circuit 8.3.5 1.25V to 20V Regulator Circuit With Minimum Program Current 8.3.6 Battery-Charger Circuit 8.3.7 50mA, Constant-Current, Battery-Charger Circuit 8.3.8 Slow Turn-On 15V Regulator Circuit 8.3.9 AC Voltage-Regulator Circuit 8.3.10 Current-Limited 6V Charger Circuit 8.3.11 Adjustable 4A Regulator Circuit 8.3.12 High-Current Adjustable Regulator Circuit 8.4 Power Supply Recommendations 8.5 Layout 8.5.1 Layout Guidelines 8.5.1.1 Thermal Considerations 8.5.1.1.1 Heat Sink Requirements 8.5.1.1.2 Heat Sinking Surface-Mount Packages 8.5.1.1.2.1 Heatsinking the SOT-223 (DCY) Package 8.5.1.1.2.2 Heat Sinking the TO-263 (KTT) Package 8.5.2 Layout Examples 9 Device and Documentation Support 9.1 Device Support 9.1.1 Device Nomenclature 9.2 Receiving Notification of Documentation Updates 9.3 Support Resources 9.4 Trademarks 9.5 Electrostatic Discharge Caution 9.6 Glossary 10 Revision History 11 Mechanical, Packaging, and Orderable Information