Datasheet TLV2370, TLV2371, TLV2372, TLV2373, TLV2374, TLV2375 (Texas Instruments) - 3
| Manufacturer | Texas Instruments |
| Description | TLV237x 500-µA/Ch, 3-MHz Rail-to-Rail Input and Output Operational Amplifiers With Shutdown |
| Pages / Page | 59 / 3 — TLV2370,. TLV2371. , TLV2372. TLV2373,. TLV2374. , TLV2375. www.ti.com. 5 … |
| Revision | F |
| File Format / Size | PDF / 2.4 Mb |
| Document Language | English |
TLV2370,. TLV2371. , TLV2372. TLV2373,. TLV2374. , TLV2375. www.ti.com. 5 Device Comparison Tables
Text Version of Document
TLV2370, TLV2371 , TLV2372 TLV2373, TLV2374 , TLV2375 www.ti.com
SLOS270F – MARCH 2001 – REVISED AUGUST 2016
5 Device Comparison Tables Table 1. Selection of Signal Amplifier Products(1) SINGLES, V V I I GBW SR RAIL-TO- DEVICE DD IO Q/Ch IB SHUTDOWN DUALS, (V) (µV) (µA) (pA) (MHz) (V/µs) RAIL QUADS
TLV237x 2.7 to 16 500 550 1 3 2.4 Yes I/O S, D, Q TLC227x 4 to 16 300 1100 1 2.2 3.6 — O D, Q TLV27x 2.7 to 16 500 550 1 3 2.4 — O S, D, Q TLC27x 3 to 16 1100 675 1 1.7 3.6 — — S, D, Q TLV246x 2.7 to 16 150 550 1300 6.4 1.6 Yes I/O S, D, Q TLV247x 2.7 to 16 250 600 2 2.8 1.5 Yes I/O S, D, Q TLV244x 2.7 to 10 300 725 1 1.8 1.4 — O D, Q (1) Typical values measured at 5 V and 25°C.
Table 2. Family Package Table(1) PACKAGE TYPES UNIVERSAL NUMBER OF DEVICE SHUTDOWN EVM CHANNELS PDIP SOIC SOT-23 TSSOP MSOP BOARD
TLV2370 1 8 8 6 — — Yes TLV2371 1 8 8 5 — — — See the EVM TLV2372 2 8 8 — — 8 — Selection TLV2373 2 14 14 — — 10 Yes Guide TLV2374 4 14 14 — 14 — — TLV2375 4 16 16 — 16 — Yes (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com.
6 Pin Configuration and Functions TLV2370 DBV Package 6-Pin SOT-23 TLV2370 D and P Packages Top View 8-Pin SOIC and PDIP Top View
1 6 OUT VDD NC 1 8 SHDN IN 2 7 VDD GND 2 5 SHDN - IN+ 3 6 OUT IN+ 3 4 IN GND 4 5 NC -
Pin Functions: TLV2370 PIN I/O DESCRIPTION NAME SOT-23 SOIC, PDIP
GND 2 4 — Ground connection IN– 4 2 I Negative (inverting) input IN+ 3 3 I Positive (noninverting) input NC — 1, 5 — No internal connection (can be left floating) OUT 1 6 O Output SHDN 5 8 I Shutdown control (active low, can be left floating) VDD 6 7 — Positive power supply Copyright © 2001–2016, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: TLV2370 TLV2371 TLV2372 TLV2373 TLV2374 TLV2375 Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Revision History 5 Device Comparison Tables 6 Pin Configuration and Functions 7 Specifications 7.1 Absolute Maximum Ratings 7.2 Recommended Operating Conditions 7.3 Thermal Information: TLV2370 7.4 Thermal Information: TLV2371 7.5 Thermal Information: TLV2372 7.6 Thermal Information: TLV2373 7.7 Thermal Information: TLV2374 7.8 Thermal Information: TLV2375 7.9 Electrical Characteristics 7.10 Typical Characteristics 8 Detailed Description 8.1 Overview 8.2 Functional Block Diagram 8.3 Feature Description 8.3.1 Rail-to-Rail Input Operation 8.3.2 Driving a Capacitive Load 8.3.3 Offset Voltage 8.3.4 General Configurations 8.3.5 Shutdown Function 8.4 Device Functional Modes 9 Application and Implementation 9.1 Application Information 9.2 Typical Application 9.2.1 Design Requirements 9.2.2 Detailed Design Procedure 9.2.3 Application Curve 10 Power Supply Recommendations 11 Layout 11.1 Layout Guidelines 11.2 Layout Example 11.3 Power Dissipation Considerations 12 Device and Documentation Support 12.1 Documentation Support 12.1.1 Related Documentation 12.2 Related Links 12.3 Receiving Notification of Documentation Updates 12.4 Community Resources 12.5 Trademarks 12.6 Electrostatic Discharge Caution 12.7 Glossary 13 Mechanical, Packaging, and Orderable Information
SLOS270F – MARCH 2001 – REVISED AUGUST 2016
5 Device Comparison Tables Table 1. Selection of Signal Amplifier Products(1) SINGLES, V V I I GBW SR RAIL-TO- DEVICE DD IO Q/Ch IB SHUTDOWN DUALS, (V) (µV) (µA) (pA) (MHz) (V/µs) RAIL QUADS
TLV237x 2.7 to 16 500 550 1 3 2.4 Yes I/O S, D, Q TLC227x 4 to 16 300 1100 1 2.2 3.6 — O D, Q TLV27x 2.7 to 16 500 550 1 3 2.4 — O S, D, Q TLC27x 3 to 16 1100 675 1 1.7 3.6 — — S, D, Q TLV246x 2.7 to 16 150 550 1300 6.4 1.6 Yes I/O S, D, Q TLV247x 2.7 to 16 250 600 2 2.8 1.5 Yes I/O S, D, Q TLV244x 2.7 to 10 300 725 1 1.8 1.4 — O D, Q (1) Typical values measured at 5 V and 25°C.
Table 2. Family Package Table(1) PACKAGE TYPES UNIVERSAL NUMBER OF DEVICE SHUTDOWN EVM CHANNELS PDIP SOIC SOT-23 TSSOP MSOP BOARD
TLV2370 1 8 8 6 — — Yes TLV2371 1 8 8 5 — — — See the EVM TLV2372 2 8 8 — — 8 — Selection TLV2373 2 14 14 — — 10 Yes Guide TLV2374 4 14 14 — 14 — — TLV2375 4 16 16 — 16 — Yes (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com.
6 Pin Configuration and Functions TLV2370 DBV Package 6-Pin SOT-23 TLV2370 D and P Packages Top View 8-Pin SOIC and PDIP Top View
1 6 OUT VDD NC 1 8 SHDN IN 2 7 VDD GND 2 5 SHDN - IN+ 3 6 OUT IN+ 3 4 IN GND 4 5 NC -
Pin Functions: TLV2370 PIN I/O DESCRIPTION NAME SOT-23 SOIC, PDIP
GND 2 4 — Ground connection IN– 4 2 I Negative (inverting) input IN+ 3 3 I Positive (noninverting) input NC — 1, 5 — No internal connection (can be left floating) OUT 1 6 O Output SHDN 5 8 I Shutdown control (active low, can be left floating) VDD 6 7 — Positive power supply Copyright © 2001–2016, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: TLV2370 TLV2371 TLV2372 TLV2373 TLV2374 TLV2375 Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Revision History 5 Device Comparison Tables 6 Pin Configuration and Functions 7 Specifications 7.1 Absolute Maximum Ratings 7.2 Recommended Operating Conditions 7.3 Thermal Information: TLV2370 7.4 Thermal Information: TLV2371 7.5 Thermal Information: TLV2372 7.6 Thermal Information: TLV2373 7.7 Thermal Information: TLV2374 7.8 Thermal Information: TLV2375 7.9 Electrical Characteristics 7.10 Typical Characteristics 8 Detailed Description 8.1 Overview 8.2 Functional Block Diagram 8.3 Feature Description 8.3.1 Rail-to-Rail Input Operation 8.3.2 Driving a Capacitive Load 8.3.3 Offset Voltage 8.3.4 General Configurations 8.3.5 Shutdown Function 8.4 Device Functional Modes 9 Application and Implementation 9.1 Application Information 9.2 Typical Application 9.2.1 Design Requirements 9.2.2 Detailed Design Procedure 9.2.3 Application Curve 10 Power Supply Recommendations 11 Layout 11.1 Layout Guidelines 11.2 Layout Example 11.3 Power Dissipation Considerations 12 Device and Documentation Support 12.1 Documentation Support 12.1.1 Related Documentation 12.2 Related Links 12.3 Receiving Notification of Documentation Updates 12.4 Community Resources 12.5 Trademarks 12.6 Electrostatic Discharge Caution 12.7 Glossary 13 Mechanical, Packaging, and Orderable Information
