April 24, 2003 Fairchild Semiconductor International (NYSE: FCS) announces the FDS7066SN3, the first in a new family of MOSFETs utilizing Fairchild's FLMP (Flip Leaded Molded Package) and SyncFET silicon technology to dramatically improve performance and reduce overall system cost in synchronous DC/DC buck converter designs. With an integrated Schottky diode, the device's SyncFET technology offers similar performance (high power and current handling) of a separate MOSFET and Schottky rectifier in one package. This integration reduces space by as much as 50% and provides cost savings and manufacturing through-put (or "time") savings. By utilizing Fairchild's highly efficient FLMP SO-8 packaging combined with SyncFET technology, the performance improvements are even greater. With high thermal efficiency (thermal resistance junction-to-case of 0.5 degrees Celsius per Watt) and a very low RDS(on) (4.5mOhms typical at 10Vgs), the 30V, 19A N-Channel MOSFET is an ideal solution for the low-side switch used in synchronous buck DC/DC converter applications. Making use of technology patented by Fairchild, the SyncFET monolithic die solution incorporates a titanium Schottky diode with a PowerTrench® MOSFET, allowing Fairchild to match the performance of the Schottky to the requirements of the MOSFET to prevent the MOSFET body diode from turning on. This greatly improves reverse recovery gate charge (QRR) and reverse recovery time (trr) characteristics--with the FDS7066SN3 having a QRR of only 28 nC and a trr of 26.6 ns (both at IF = 19 A, di/dt = 300 A/µs). Reducing the reverse recovery charge also helps to increase the overall operating efficiency in the DC/DC converters. In addition, replacing the lower MOSFETs with a SyncFET of the same on-resistance can result in substantial efficiency improvements upwards of 5%. Fairchild's FLMP package offers the thermal performance and very low RDS(on) of a much larger TO-263 in a standard SO-8 package outline. This packaging allows the FDS7066SN3 to achieve thermal resistance junction-to-case of 0.5 degrees Celsius per Watt compared to the 25 degrees per Watt of a standard SO-8. It also improves power dissipation: a standard SO-8 dissipates 2.5W versus a FLMP, which dissipates 3W. Combined with SyncFET technology, FLMP packaging allows products to run much cooler to enhance system reliability, and cut board space by half, to greatly simplifying layout and reduce component count. The FDS7066SN3 is part of Fairchild's complete portfolio of SyncFETs, offering a wide range of single and dual solutions in industry standard and tailored pin-outs. This product complements Fairchild's other power solutions for DC/DC conversion applications such as PWM controllers, optocouplers, and bridge rectifiers. Price: FDS7066SN3 US$2.14 each (1,000 pcs.)
Availability: Now
Delivery: 8 weeks ARO
