Datasheet Texas Instruments 74ACT11032

ManufacturerTexas Instruments
Series74ACT11032
Datasheet Texas Instruments 74ACT11032

Quadruple 2-Input Positive-OR Gates

Datasheets

Quadruple 2-Input Positive-OR Gate datasheet
PDF, 416 Kb, Revision: C, File published: Apr 1, 1996
Extract from the document

Prices

Status

74ACT11032D74ACT11032DBLE74ACT11032DG474ACT11032DR74ACT11032DRG474ACT11032N74ACT11032NE474ACT11032PWLE
Lifecycle StatusActive (Recommended for new designs)Obsolete (Manufacturer has discontinued the production of the device)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Obsolete (Manufacturer has discontinued the production of the device)
Manufacture's Sample AvailabilityNoNoNoNoNoNoNoNo

Packaging

74ACT11032D74ACT11032DBLE74ACT11032DG474ACT11032DR74ACT11032DRG474ACT11032N74ACT11032NE474ACT11032PWLE
N12345678
Pin1616161616161616
Package TypeDDBDDDNNPW
Industry STD TermSOICSSOPSOICSOICSOICPDIPPDIPTSSOP
JEDEC CodeR-PDSO-GR-PDSO-GR-PDSO-GR-PDSO-GR-PDSO-GR-PDIP-TR-PDIP-TR-PDSO-G
Package QTY4040250025002525
CarrierTUBETUBELARGE T&RLARGE T&RTUBETUBE
Device MarkingACT11032ACT11032ACT11032ACT1103274ACT11032N74ACT11032N
Width (mm)3.915.33.913.913.916.356.354.4
Length (mm)9.96.29.99.99.919.319.35
Thickness (mm)1.581.951.581.581.583.93.91
Pitch (mm)1.27.651.271.271.272.542.54.65
Max Height (mm)1.7521.751.751.755.085.081.2
Mechanical DataDownloadDownloadDownloadDownloadDownloadDownloadDownloadDownload

Parametrics

Parameters / Models74ACT11032D
74ACT11032D
74ACT11032DBLE
74ACT11032DBLE
74ACT11032DG4
74ACT11032DG4
74ACT11032DR
74ACT11032DR
74ACT11032DRG4
74ACT11032DRG4
74ACT11032N
74ACT11032N
74ACT11032NE4
74ACT11032NE4
74ACT11032PWLE
74ACT11032PWLE
Approx. Price (US$)0.88 | 1ku0.88 | 1ku
Bits444444
Bits(#)44
F @ Nom Voltage(Max), Mhz909090909090
F @ Nom Voltage(Max)(Mhz)9090
ICC @ Nom Voltage(Max), mA0.040.040.040.040.040.04
ICC @ Nom Voltage(Max)(mA)0.040.04
Input TypeTTLTTL
Operating Temperature Range, C-40 to 85-40 to 85-40 to 85-40 to 85-40 to 85-40 to 85
Operating Temperature Range(C)-40 to 85-40 to 85
Output Drive (IOL/IOH)(Max), mA24/-2424/-2424/-2424/-2424/-2424/-24
Output Drive (IOL/IOH)(Max)(mA)24/-2424/-24
Output TypeCMOSCMOS
Package GroupSOICPDIP
SOIC
TSSOP
SOICSOICSOICPDIPPDIPTSSOP
Package Size: mm2:W x L, PKG16SOIC: 59 mm2: 6 x 9.9(SOIC)16SOIC: 59 mm2: 6 x 9.9(SOIC)16SOIC: 59 mm2: 6 x 9.9(SOIC)16SOIC: 59 mm2: 6 x 9.9(SOIC)See datasheet (PDIP)See datasheet (PDIP)
Package Size: mm2:W x L (PKG)See datasheet (PDIP)See datasheet (PDIP)
RatingCatalogCatalogCatalogCatalogCatalogCatalogCatalogCatalog
Schmitt TriggerNoNoNoNoNoNoNoNo
Technology FamilyACTACTACTACTACTACTACTACT
VCC(Max), V5.55.55.55.55.55.5
VCC(Max)(V)5.55.5
VCC(Min), V4.54.54.54.54.54.5
VCC(Min)(V)4.54.5
Voltage(Nom), V555555
Voltage(Nom)(V)55
tpd @ Nom Voltage(Max), ns999999
tpd @ Nom Voltage(Max)(ns)99

Eco Plan

74ACT11032D74ACT11032DBLE74ACT11032DG474ACT11032DR74ACT11032DRG474ACT11032N74ACT11032NE474ACT11032PWLE
RoHSCompliantNot CompliantCompliantCompliantCompliantCompliantCompliantNot Compliant
Pb FreeYesYesNoNo

Application Notes

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    Supply voltages continue to migrate to lower nodes to support today's low-power high-performance applications. While some devices are capable of running at lower supply nodes others might not have this capability. To haveswitching compatibility between these devices the output of each driver must be compliant with the input of the receiver that it is driving. There are several level-translati
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  • Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)
    PDF, 614 Kb, Revision: C, File published: Dec 2, 2015
  • Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
    PDF, 337 Kb, File published: Jul 8, 2004
    Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
  • TI IBIS File Creation Validation and Distribution Processes
    PDF, 380 Kb, File published: Aug 29, 2002
    The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con
  • CMOS Power Consumption and CPD Calculation (Rev. B)
    PDF, 89 Kb, Revision: B, File published: Jun 1, 1997
    Reduction of power consumption makes a device more reliable. The need for devices that consume a minimum amount of power was a major driving force behind the development of CMOS technologies. As a result CMOS devices are best known for low power consumption. However for minimizing the power requirements of a board or a system simply knowing that CMOS devices may use less power than equivale
  • Designing With Logic (Rev. C)
    PDF, 186 Kb, Revision: C, File published: Jun 1, 1997
    Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w
  • Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc
    PDF, 43 Kb, File published: Apr 1, 1996
    Though low power consumption is a feature of CMOS devices sometimes this feature does not meet a designer?s system power supply constraints. Therefore a partial system power down or multiple Vcc supplies are used to meet the needs of the system. This document shows electrostatic discharge protection circuits. It also provides circuit and bus driver examples of partial system power down and curren

Model Line

Manufacturer's Classification

  • Semiconductors> Logic> Gate> OR Gate