Datasheet Texas Instruments SN54AHCT32

ManufacturerTexas Instruments
SeriesSN54AHCT32
Datasheet Texas Instruments SN54AHCT32

Quadruple 2-Input Positive-OR Gates

Datasheets

SNx4AHCT32 Quadruple 2-Input Positive-OR Gates datasheet
PDF, 2.2 Mb, Revision: M, File published: Oct 10, 2014
Extract from the document

Prices

Status

5962-9682601Q2A5962-9682601QCA5962-9682601QDASNJ54AHCT32FKSNJ54AHCT32JSNJ54AHCT32W
Lifecycle StatusActive (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)
Manufacture's Sample AvailabilityNoNoNoNoNoNo

Packaging

5962-9682601Q2A5962-9682601QCA5962-9682601QDASNJ54AHCT32FKSNJ54AHCT32JSNJ54AHCT32W
N123456
Pin201414201414
Package TypeFKJWFKJW
Industry STD TermLCCCCDIPCFPLCCCCDIPCFP
JEDEC CodeS-CQCC-NR-GDIP-TR-GDFP-FS-CQCC-NR-GDIP-TR-GDFP-F
Package QTY111111
CarrierTUBETUBETUBETUBETUBETUBE
Device Marking32FKSNJ54AHCT32J5962-9682601QDSNJ54AHCTSNJ54AHCT32JSNJ54AHCT32W
Width (mm)8.896.675.978.896.675.97
Length (mm)8.8919.569.218.8919.569.21
Thickness (mm)1.834.571.591.834.571.59
Pitch (mm)1.272.541.271.272.541.27
Max Height (mm)2.035.082.032.035.082.03
Mechanical DataDownloadDownloadDownloadDownloadDownloadDownload

Parametrics

Parameters / Models5962-9682601Q2A
5962-9682601Q2A
5962-9682601QCA
5962-9682601QCA
5962-9682601QDA
5962-9682601QDA
SNJ54AHCT32FK
SNJ54AHCT32FK
SNJ54AHCT32J
SNJ54AHCT32J
SNJ54AHCT32W
SNJ54AHCT32W
Bits444444
F @ Nom Voltage(Max), Mhz707070707070
ICC @ Nom Voltage(Max), mA0.020.020.020.020.020.02
Input TypeTTLTTLTTLTTLTTLTTL
Operating Temperature Range, C-55 to 125-55 to 125-55 to 125-55 to 125-55 to 125-55 to 125
Output Drive (IOL/IOH)(Max), mA8/-88/-88/-88/-88/-88/-8
Output TypeCMOSCMOSCMOSCMOSCMOSCMOS
Package GroupLCCCCDIPCFPLCCCCDIPCFP
Package Size: mm2:W x L, PKG20LCCC: 79 mm2: 8.89 x 8.89(LCCC)See datasheet (CDIP)See datasheet (CFP)20LCCC: 79 mm2: 8.89 x 8.89(LCCC)See datasheet (CDIP)See datasheet (CFP)
RatingMilitaryMilitaryMilitaryMilitaryMilitaryMilitary
Schmitt TriggerNoNoNoNoNoNo
Technology FamilyAHCTAHCTAHCTAHCTAHCTAHCT
VCC(Max), V5.55.55.55.55.55.5
VCC(Min), V4.54.54.54.54.54.5
tpd @ Nom Voltage(Max), ns999999

Eco Plan

5962-9682601Q2A5962-9682601QCA5962-9682601QDASNJ54AHCT32FKSNJ54AHCT32JSNJ54AHCT32W
RoHSSee ti.comSee ti.comSee ti.comSee ti.comSee ti.comSee ti.com

Application Notes

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    PDF, 1.1 Mb, Revision: A, File published: Jul 26, 2016
    TI Little Logic devices are logic-gate devices assembled in a small single- dual- or triple- gate package. Little Logic devices are widely used in portable equipment such as mobile phones MP3 players and notebook computers. Little Logic devices also are used in desktop computers and telecommunications. Little Logic gates are common components for easy PC board routing schematic design and b
  • Advanced High-Speed CMOS (AHC) Logic Family (Rev. C)
    PDF, 102 Kb, Revision: C, File published: Dec 2, 2002
    The Texas Instruments (TI) advanced high-speed CMOS (AHC) logic family provides a natural migration for high-speed CMOS (HCMOS) users who need more speed for low-power and low-drive applications. Unlike many other advanced logic families AHC does not have the drawbacks that come with higher speed e.g. higher signal noise and power consumption. The AHC logic family consists of gates medium-sca
  • TI IBIS File Creation Validation and Distribution Processes
    PDF, 380 Kb, File published: Aug 29, 2002
    The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con
  • Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices
    PDF, 115 Kb, File published: Dec 1, 1997
    This application report explores the possibilities for migrating to 3.3-V and 2.5-V power supplies and discusses the implications.Customers are successfully using a wide range of low-voltage 3.3-V logic devices. These devices are within Texas Instruments (TI) advanced low-voltage CMOS (ALVC) crossbar technology (CBT) crossbar technology with integrated diode (CBTD) low-voltage crossbar techn
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    PDF, 150 Kb, File published: Oct 1, 1996
    Many applications require the ability to exchange modules in electronic systems without removing the supply voltage from the module (live insertion). For example an electronic telephone exchange must always remain operational even during module maintenance and repair. To avoid damaging components additional circuitry modifications are necessary. This document describes in detail the phenomena tha
  • Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A)
    PDF, 105 Kb, Revision: A, File published: Aug 1, 1997
    The spectrum of bus-interface devices with damping resistors or balanced/light output drive currently offered by various logic vendors is confusing at best. Inconsistencies in naming conventions and methods used for implementation make it difficult to identify the best solution for a given application. This report attempts to clarify the issue by looking at several vendors? approaches and discussi
  • Texas Instruments Little Logic Application Report
    PDF, 359 Kb, File published: Nov 1, 2002
    Portable and consumer electronic systems? needs present greater challenges today than ever before. Engineers strive to design smaller faster lower-cost systems to meet the market demand. Consequently the semiconductor industry faces a growing need to increase operating speed minimize power consumption and reduce packaging size. Texas Instruments manufactures a variety of Little Logic semicond
  • Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)
    PDF, 614 Kb, Revision: C, File published: Dec 2, 2015
  • Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
    PDF, 337 Kb, File published: Jul 8, 2004
    Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
  • Selecting the Right Level Translation Solution (Rev. A)
    PDF, 313 Kb, Revision: A, File published: Jun 22, 2004
    Supply voltages continue to migrate to lower nodes to support today's low-power high-performance applications. While some devices are capable of running at lower supply nodes others might not have this capability. To haveswitching compatibility between these devices the output of each driver must be compliant with the input of the receiver that it is driving. There are several level-translati
  • Introduction to Logic
    PDF, 93 Kb, File published: Apr 30, 2015
  • Implications of Slow or Floating CMOS Inputs (Rev. D)
    PDF, 260 Kb, Revision: D, File published: Jun 23, 2016
  • CMOS Power Consumption and CPD Calculation (Rev. B)
    PDF, 89 Kb, Revision: B, File published: Jun 1, 1997
    Reduction of power consumption makes a device more reliable. The need for devices that consume a minimum amount of power was a major driving force behind the development of CMOS technologies. As a result CMOS devices are best known for low power consumption. However for minimizing the power requirements of a board or a system simply knowing that CMOS devices may use less power than equivale

Model Line

Manufacturer's Classification

  • Semiconductors> Space & High Reliability> Logic Products> Gate Products