Datasheet Texas Instruments SN54AHCT86

ManufacturerTexas Instruments
SeriesSN54AHCT86
Datasheet Texas Instruments SN54AHCT86

Quadruple 2-Input Exclusive-OR Gates

Datasheets

SNx4AHCT86 Quadruple 2-Input Exclusive-OR Gates datasheet
PDF, 1.5 Mb, Revision: N, File published: Aug 5, 2014
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Status

5962-9681701Q2A5962-9681701QCASNJ54AHCT86FKSNJ54AHCT86J
Lifecycle StatusActive (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)
Manufacture's Sample AvailabilityNoNoNoNo

Packaging

5962-9681701Q2A5962-9681701QCASNJ54AHCT86FKSNJ54AHCT86J
N1234
Pin20142014
Package TypeFKJFKJ
Industry STD TermLCCCCDIPLCCCCDIP
JEDEC CodeS-CQCC-NR-GDIP-TS-CQCC-NR-GDIP-T
Package QTY1111
CarrierTUBETUBETUBETUBE
Device Marking5962-A5962-SNJ54AHCT86J
Width (mm)8.896.678.896.67
Length (mm)8.8919.568.8919.56
Thickness (mm)1.834.571.834.57
Pitch (mm)1.272.541.272.54
Max Height (mm)2.035.082.035.08
Mechanical DataDownloadDownloadDownloadDownload

Parametrics

Parameters / Models5962-9681701Q2A
5962-9681701Q2A
5962-9681701QCA
5962-9681701QCA
SNJ54AHCT86FK
SNJ54AHCT86FK
SNJ54AHCT86J
SNJ54AHCT86J
Bits4444
F @ Nom Voltage(Max), Mhz70707070
ICC @ Nom Voltage(Max), mA0.020.020.020.02
Input TypeTTLTTLTTLTTL
Operating Temperature Range, C-55 to 125-55 to 125-55 to 125-55 to 125
Output Drive (IOL/IOH)(Max), mA8/-88/-88/-88/-8
Output TypeCMOSCMOSCMOSCMOS
Package GroupLCCCCDIPLCCCCDIP
Package Size: mm2:W x L, PKG20LCCC: 79 mm2: 8.89 x 8.89(LCCC)See datasheet (CDIP)20LCCC: 79 mm2: 8.89 x 8.89(LCCC)See datasheet (CDIP)
RatingMilitaryMilitaryMilitaryMilitary
Schmitt TriggerNoNoNoNo
Technology FamilyAHCTAHCTAHCTAHCT
VCC(Max), V5.55.55.55.5
VCC(Min), V4.54.54.54.5
tpd @ Nom Voltage(Max), ns10101010

Eco Plan

5962-9681701Q2A5962-9681701QCASNJ54AHCT86FKSNJ54AHCT86J
RoHSSee ti.comSee ti.comSee ti.comSee ti.com

Application Notes

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    PDF, 105 Kb, Revision: A, File published: Aug 1, 1997
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    PDF, 614 Kb, Revision: C, File published: Dec 2, 2015
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    PDF, 337 Kb, File published: Jul 8, 2004
    Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
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    PDF, 313 Kb, Revision: A, File published: Jun 22, 2004
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Manufacturer's Classification

  • Semiconductors> Space & High Reliability> Logic Products> Gate Products