Datasheet Texas Instruments SN74CB3Q3306A

ManufacturerTexas Instruments
SeriesSN74CB3Q3306A
Datasheet Texas Instruments SN74CB3Q3306A

Dual FET 2.5-V/3.3-V Low-Voltage, High-Bandwidth Bus Switch

Datasheets

SN74CB3Q3306A datasheet
PDF, 1.1 Mb, Revision: E, File published: Jan 25, 2011
Extract from the document

Prices

Status

74CB3Q3306ADCURE474CB3Q3306ADCURG4SN74CB3Q3306ADCURSN74CB3Q3306APWSN74CB3Q3306APWG4SN74CB3Q3306APWRSN74CB3Q3306APWRG4
Lifecycle StatusActive (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)
Manufacture's Sample AvailabilityNoNoYesNoNoNoYes

Packaging

74CB3Q3306ADCURE474CB3Q3306ADCURG4SN74CB3Q3306ADCURSN74CB3Q3306APWSN74CB3Q3306APWG4SN74CB3Q3306APWRSN74CB3Q3306APWRG4
N1234567
Pin8888888
Package TypeDCUDCUDCUPWPWPWPW
Industry STD TermVSSOPVSSOPVSSOPTSSOPTSSOPTSSOPTSSOP
JEDEC CodeR-PDSO-GR-PDSO-GR-PDSO-GR-PDSO-GR-PDSO-GR-PDSO-GR-PDSO-G
Package QTY30003000300015020002000
CarrierLARGE T&RLARGE T&RLARGE T&RTUBELARGE T&RLARGE T&R
Device MarkingGA6RGA6RA6BU306ABU306ABU306A
Width (mm)2224.44.44.44.4
Length (mm)2.32.32.33333
Thickness (mm).85.85.851111
Pitch (mm).5.5.5.65.65.65.65
Max Height (mm).9.9.91.21.21.21.2
Mechanical DataDownloadDownloadDownloadDownloadDownloadDownloadDownload

Parametrics

Parameters / Models74CB3Q3306ADCURE4
74CB3Q3306ADCURE4
74CB3Q3306ADCURG4
74CB3Q3306ADCURG4
SN74CB3Q3306ADCUR
SN74CB3Q3306ADCUR
SN74CB3Q3306APW
SN74CB3Q3306APW
SN74CB3Q3306APWG4
SN74CB3Q3306APWG4
SN74CB3Q3306APWR
SN74CB3Q3306APWR
SN74CB3Q3306APWRG4
SN74CB3Q3306APWRG4
Additional FeaturesPowered off protectionPowered off protectionPowered off protectionPowered off protectionIOFFPowered off protectionPowered off protection
Approx. Price (US$)0.29 | 1ku
Bandwidth, MHz500500500500500500
Bandwidth(MHz)500
Configuration1:1 SPST1:1 SPST1:1 SPST1:1 SPSTSPST1:1 SPST1:1 SPST
Crosstalk(dB)No
ESD Charged Device Model, kV111111
ESD Charged Device Model(kV)1
ESD HBM, kV222222
ESD HBM(kV)2
ICC(Max)(uA)700
Input/Ouput Voltage(Max), V5.55.55.55.55.55.5
Input/Ouput Voltage(Max)(V)5.5
Input/Output Continuous Current(Max), mA646464646464
Input/Output Continuous Current(Max)(mA)64
Input/Output OFF-state Capacitance(Typ), pF3.53.53.53.53.53.5
Input/Output ON-state Capacitance(Typ), pF888888
Number of Channels222222
Number of Channels(#)2
OFF-state leakage current(Max), µA111111
Operating Temperature Range, C-40 to 85-40 to 85-40 to 85-40 to 85-40 to 85-40 to 85
Operating Temperature Range(C)-40 to 85
Package GroupVSSOPVSSOPVSSOPTSSOPTSSOPTSSOPTSSOP
Package Size: mm2:W x L, PKG8VSSOP: 6 mm2: 3.1 x 2(VSSOP)8VSSOP: 6 mm2: 3.1 x 2(VSSOP)8VSSOP: 6 mm2: 3.1 x 2(VSSOP)8TSSOP: 19 mm2: 6.4 x 3(TSSOP)8TSSOP: 19 mm2: 6.4 x 3(TSSOP)8TSSOP: 19 mm2: 6.4 x 3(TSSOP)
Package Size: mm2:W x L (PKG)8TSSOP: 19 mm2: 6.4 x 3(TSSOP)
RatingCatalogCatalogCatalogCatalogCatalogCatalogCatalog
Ron(Max), Ohms999999
Ron(Max)(Ohms)9
Ron(Typ), Ohms444444
Ron(Typ)(Ohms)5
Supply Current(Max), uA200020002000200020002000
Supply Current(Typ), uA700700700700700700
Supply Range, Max3.63.63.63.63.63.6
VCC(Max)(V)3.6
VCC(Min)(V)2.3
VIH(Min), V1.71.71.71.71.71.7
VIL(Max), V0.80.80.80.80.80.8
Vdd(Max), V3.63.63.63.63.63.6
Vdd(Min), V2.32.32.32.32.32.3
Vss(Max), VN/AN/AN/AN/AN/AN/A
Vss(Min), VN/AN/AN/AN/AN/AN/A

Eco Plan

74CB3Q3306ADCURE474CB3Q3306ADCURG4SN74CB3Q3306ADCURSN74CB3Q3306APWSN74CB3Q3306APWG4SN74CB3Q3306APWRSN74CB3Q3306APWRG4
RoHSCompliantCompliantCompliantCompliantNot CompliantCompliantCompliant
Pb FreeNo

Application Notes

  • CBT-C, CB3T, and CB3Q Signal-Switch Families
    PDF, 584 Kb, File published: Feb 4, 2003
    Signal switch devices are widely used in applications requiring bus isolation, multiplexing, demultiplexing, and voltage translation. Compared to other logic and linear product alternatives, signal switches are the fastest and least power consuming. Texas Instruments (TI) CBT-C, CB3Q, and CB3T signal-switch families have low on-state resistance, negligible power consumption, and better undershoot
  • Bus FET Switch Solutions for Live Insertion Applications
    PDF, 300 Kb, File published: Feb 7, 2003
    In today?s competitive computing and networking industry, any equipment downtime due to component interconnects or bus failures impedes communication, hinders productivity and hampers financial growth. In recognizing this increasingly costly unplanned downtime, the industry introduced live-insertion technology to minimize the impact of any such failures. The live-insertion feature enables a networ

Model Line

Manufacturer's Classification

  • Semiconductors> Switches and Multiplexers> Analog Switches/Muxes
EMS supplier