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Package Intersil V256.17x17

Package Intersil V256.17x17

ManufacturerIntersil
SeriesBGA
Part NumberV256.17x17

256 Plastic Ball Grid Array Package

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits
    Plastic Ball Grid Array Packages (BGA)
    o V256.17x17 A A1
    CORNER D 256 BALL PLASTIC BALL GRID ARRAY PACKAGE A1
    CORNER I.D. INCHES
    SYMBOL E B
    TOP VIEW
    0.15
    MC A B
    0.006
    0.08
    C
    0.003 M
    b A1
    CORNER D1 A1
    CORNER I.D. 16 15 14 13 121110 9 8 7 6 5 4 3 2 1
    A
    B
    C
    D
    E
    F
    G ...

Parametrics

FamilyFBGA
Pin Count256
Length17.00 mm
Width17.00 mm
Thickness1.03 mm
Height max1.50 mm
Weight0.705 g
Pitch1.00 mm
Peak Temperature240 °C
Lead Free Peak Temperature260 °C
FeaturesFine
Package IndexV256.17X17

Moldel Line

Series: BGA (14)

Manufacturer's Classification

  • Plastic Packages
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