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Package Intersil V256.17x17B

Package Intersil V256.17x17B

ManufacturerIntersil
SeriesBGA
Part NumberV256.17x17B

256 Low Profile Plastic Ball Grid Array Package (LBGA)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    V256.17x17B
    256 LOW PROFILE PLASTIC BALL GRID ARRAY PACKAGE (LBGA)
    Rev 0, 1/12
    Г?0.50(3X). REF COMMON
    SYMBOL DIEMENSIONS 1 2 3 4 5 6 7 8 9 10 1112 13 14 15 16 Package LBGA Body Size X D 17.00 Y E 17.00 X eD 1.000 Y eE 1.000 Total Thickness A 1.810 В±0.190 Mold Thickness A3 0.850 Ref. Substrate Thickness A2 0.560 Ref. Ball Diameter CA(4X) 0.500 Stand Off A1 0.300 ~ 0.500 Ball Width b 0.400 ~ 0.600 Mold Area X M 15.000 Y N 15.000 Chamfer CA 1.200 Ref. Package Edge Tolerance aaa 0.200 Substrate Flatness bbb 0.250 Mold Flatness ccc 0.350 Coplanarity ddd 0.200 Ball Offset (Package) eee 0.250 Ball Offset (Ball) fff 0.100 Ball Count n 256 X D1 15.000 Y E1 15.000 M Г?eee M C A B
    Г?b(n X)
    16 15 14 13 1211 10 9 8 7 6 5 4 3 2 1 E E1 eE A
    B
    C
    D
    E
    F
    G
    H
    J
    K
    L
    M
    N
    P
    R
    T ...

Parametrics

FamilyLBGA
Pin Count256
Length17 mm
Width17 mm
Weight0.807 g
Peak Temperature235 °C
Lead Free Peak Temperature260 °C
FeaturesLow Profile
Package IndexV256.17X17B

Moldel Line

Series: BGA (14)

Manufacturer's Classification

  • Plastic Packages
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