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Package Intersil V352.27x27

Package Intersil V352.27x27

ManufacturerIntersil
SeriesBGA
Part NumberV352.27x27

352 Plastic Ball Grid Array Package

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    V352.27x27
    352 PLASTIC BALL GRID ARRAY PACKAGE
    Rev 0, 3/11
    0.20 (4X)
    27.00 0.25 C 24.00В±0.03 A1 BALL PAD
    INDICATOR 0.35 C A 0.20 C B
    C
    30В° TYP +0.10
    3. 0.60 -0.10
    0.25 M C A B
    0.10 M C 27.00 24.00В±0.30
    4. SEATING PLANE 4X 45В° CHAMFER TOP VIEW (1.17)
    2.23 В±0.13
    0.50В±0.10
    (0.56) 26 24 22 20 18 16 14 12 10 8 6 4 2
    25 23 21 19 17 15 13 11 9 7 5 3 1 SIDE VIEW
    A
    B
    C
    D
    E
    F ...

Parametrics

FamilyBGA
Pin Count352
Weight2.28 g
Pitch1.00 mm
Peak Temperature235 °C
Lead Free Peak Temperature260 °C
Package IndexV352.27X27

Moldel Line

Series: BGA (14)

Manufacturer's Classification

  • Plastic Packages
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