Package Intersil V409.18x18

ManufacturerIntersil
SeriesBGA
Part NumberV409.18x18
Package Intersil V409.18x18

409 Low Profile Fine Pitch Plastic Ball Grid Array Package (LFBGA)

Package Outline Drawing (POD)

PDF, 163 Kb
Docket

Parametrics

FamilyLBGA
Pin Count409
Height max1.40 mm
Weight0.644 g
Pitch0.80 mm
Peak Temperature235 °C
Lead Free Peak Temperature260 °C
FeaturesLow Profile
Package IndexV409.18X18

Model Line

Manufacturer's Classification