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Package Intersil V409.18x18

Package Intersil V409.18x18

ManufacturerIntersil
SeriesBGA
Part NumberV409.18x18

409 Low Profile Fine Pitch Plastic Ball Grid Array Package (LFBGA)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    V409.18x18
    409 LOW PROFILE FINE PITCH PLASTIC BALL GRID ARRAY PACKAGE (LFBGA)
    Rev 0, 3/12
    PIN A1 CORNER SYMBOL COMMON DIMENSIONS
    Package LFBGA
    X E 18.00 Y D 18.00 Total Thickness A 1.400 MAX Mold Thickness M 0.700 Ref. Substrate Thickness S 0.260 Ref. A1 0.270 ~ 0.370 b 0.380 ~ 0.480 aaa 0.150 Body Size
    Ball Pitch 0.800 Ball Diameter 0.400 Stand Off
    Ball Width
    Package Edge Tolerance TOP VIEW Mold Flatness bbb 0.200 Coplanarity ddd 0.120 Ball Offset (Package) eee 0.150 Ball Offset (Ball) fff 0.080 Ball Count
    ddd C bbb C M Edge Ball Center to Center A
    A1 C S SIDE VIEW 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 D D1 e AA
    Y
    W
    V
    U
    T
    R
    P
    N
    M
    L
    K ...

Parametrics

FamilyLBGA
Pin Count409
Height max1.40 mm
Weight0.644 g
Pitch0.80 mm
Peak Temperature235 °C
Lead Free Peak Temperature260 °C
FeaturesLow Profile
Package IndexV409.18X18

Moldel Line

Series: BGA (14)

Manufacturer's Classification

  • Plastic Packages
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