Package Intersil V416.27x27
416 Plastic Ball Grid Array Package (Cavity Down)
Package Outline Drawing (POD)
Parametrics
| Family | PBGA |
| Pin Count | 416 |
| Weight | 2.28 g |
| Pitch | 25.40 mm |
| Peak Temperature | 235 °C |
| Lead Free Peak Temperature | 260 °C |
| Features | Plastic |
| Package Index | V416.27X27 |
Model Line
Series: BGA (14)
Manufacturer's Classification
- Plastic Packages
