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Package Intersil L10.3x3B

Package Intersil L10.3x3B

ManufacturerIntersil
SeriesDFN
Part NumberL10.3x3B

10 Lead Thin Dual Flat Package (TDFN) with E-pad

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    L10.3x3B
    10 LEAD THIN DUAL FLAT PACKAGE (TDFN) WITH E-PAD
    Rev 4, 4/15
    3.00 5
    PIN #1 INDEX AREA A
    B
    1
    2
    0.50 3.00 2.38 +0.1/ -0.15 10
    5
    PIN 1
    INDEX AREA 0.25 +0.05/ -0.07 6
    (4X) 0.15
    1.64 +0.1/ -0.15 TOP VIEW BOTTOM VIEW 10x 0.40 +/-0.1 SEE DETAIL "X" (10x0.60)
    (10X0.25)
    0.75 0.10 C SEATING PLANE
    0.08 C 2.38 0.05 C SIDE VIEW (8x 0.50) 1.64
    2.80 TYP
    TYPICAL RECOMMENDED LAND PATTERN C 0.20 REF 4 0.05
    DETAIL "X" NOTES: 1 1. Dimensions are in millimeters.
    Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal В± 0.05 4. Tiebar shown (if present) is a non-functional feature and may
    be located on any of the 4 sides (or ends). 5. The configuration of the pin #1 identifier is optional, but must be ...

Parametrics

FamilyTDFN
Pin Count10
Length3.00 mm
Width3.00 mm
Thickness0.75 mm
Height max0.75 mm
Weight0.022 g
Pitch0.50 mm
Peak Temperature240 °C
Lead Free Peak Temperature260 °C
Package IndexL10.3X3B

Moldel Line

Series: DFN (43)

Manufacturer's Classification

  • Plastic Packages
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