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Package Intersil L10.3x3C

Package Intersil L10.3x3C

ManufacturerIntersil
SeriesDFN
Part NumberL10.3x3C

10 Lead Dual Flat No-Lead Plastic Package

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits Package Outline Drawing
    L10.3x3C
    10 LEAD DUAL FLAT PACKAGE (DFN)
    Rev 4, 3/15
    3.00 5
    PIN #1 INDEX AREA A
    B
    10 5
    PIN 1
    INDEX AREA 1 2.38 3.00 0.50 2 10 x 0.25
    6
    (4X) 0.10 C B
    1.64 TOP VIEW 10x 0.40 BOTTOM VIEW
    (4X) 0.10 M C B SEE DETAIL "X" (10 x 0.60)
    (10x 0.25)
    0.90
    MAX 0.10 C
    BASE PLANE 2.38 0.20 C SEATING PLANE
    0.08 C
    SIDE VIEW (8x 0.50) 1.64
    2.80 TYP
    C TYPICAL RECOMMENDED LAND PATTERN 0.20 REF 4 0.05
    DETAIL "X" NOTES: 1 1. Dimensions are in millimeters. ...

Parametrics

FamilyDFN
Pin Count10
Length3.00 mm
Width3.00 mm
Thickness0.90 mm
Height max0.90 mm
Weight0.022 g
Pitch0.50 mm
Peak Temperature240 °C
Lead Free Peak Temperature260 °C
Package IndexL10.3X3C

Moldel Line

Series: DFN (43)

Manufacturer's Classification

  • Plastic Packages
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