RadioLocman.com Electronics ru
Advanced Search +
  

Package Intersil L12.4x3A

Package Intersil L12.4x3A

ManufacturerIntersil
SeriesDFN
Part NumberL12.4x3A

12 Lead Thin Dual Flat No-Lead Plastic Package

Package Outline Drawing (POD)

  • Download » PDF, 88 Kb
    Docket ↓
    Plastic Packages for Integrated Circuits
    Thin Dual Flat No-Lead Plastic Package (TDFN)
    L12.4x3A
    12 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE
    (COMPLIANT TO JEDEC MO-229-WGED-4 ISSUE C) 2X
    0.15 C A
    A D MILLIMETERS 2X
    0.15 C B SYMBOL MIN A 0.70 A1 -A3 E b 6
    INDEX
    AREA D2 0.18 E2 3.15 0.10 A 0.08 C
    C -0.05 -0.23 0.30 5,8 3.30 3.40 7,8 3.00 BSC
    1.55 e // NOTES 0.80 4.00 BSC E TOP VIEW MAX 0.75
    0.20 REF D
    B NOMINAL 1.70 1.80 7,8 0.50 BSC -k 0.20 -L 0.30 0.40 0.50 8 N 12 2 Nd 6 3
    Rev. 1 10/15 C NOTES: A3 SEATING
    PLANE 1. Dimensioning and tolerancing conform to ASME Y14.5-1994.
    2. N is the number of terminals. SIDE VIEW 3. Nd refers to the number of terminals on D.
    4. All dimensions are in millimeters. Angles are in degrees.
    D2
    (DATUM B)
    6
    INDEX
    AREA 7 5. Dimension b applies to the metallized terminal and is measured ...

Parametrics

FamilyTDFN
Pin Count12
Length4.00 mm
Width3.00 mm
Thickness0.75 mm
Height max0.80 mm
Weight0.0285 g
Pitch0.50 mm
Peak Temperature240 °C
Lead Free Peak Temperature260 °C
Package IndexL12.4X3A

Moldel Line

Series: DFN (43)

Manufacturer's Classification

  • Plastic Packages
Slices ↓
Radiolocman facebook Radiolocman twitter Radiolocman google plus