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Package Intersil L12.4x4C

Package Intersil L12.4x4C

ManufacturerIntersil
SeriesDFN
Part NumberL12.4x4C

12 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE (TDFN)

Package Outline Drawing (POD)

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    Plastic Packages for Integrated Circuits
    Package Outline Drawing
    L12.4x4C 12 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE (TDFN)
    Rev 1, 3/15
    4.00 2.5 REF A
    PIN #1 INDEX AREA B 6 10x 0.50
    1 6
    12x 0.45 6
    PIN #1
    INDEX AREA 4.00 1.58 0.15 (4X)
    12 7 0.10 M C A B
    0.05 M C
    4 12x 0.25 2.80 TOP VIEW BOTTOM VIEW SEE DETAIL "X"
    (2.80) 12x 0.65 0.10 C C
    SEATING PLANE
    0.08 C 0.80 MAX SIDE VIEW (3.75) (1.58)
    5
    0.2 REF
    C (10x 0.5) 0.00 MIN.
    0.05 MAX. (12x 0.25) DETAIL "X"
    TYPICAL RECOMMENDED LAND PATTERN
    NOTES:
    1. Dimensions are in millimeters. ...

Parametrics

FamilyDFN
Pin Count12
Length4.00 mm
Width4.00 mm
Thickness0.75 mm
Height max1.00 mm
Weight0.043 g
Pitch0.50 mm
Peak Temperature240 °C
Lead Free Peak Temperature260 °C
Package IndexL12.4X4C

Moldel Line

Series: DFN (43)

Manufacturer's Classification

  • Plastic Packages
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